JP2020111769A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2020111769A5 JP2020111769A5 JP2019001638A JP2019001638A JP2020111769A5 JP 2020111769 A5 JP2020111769 A5 JP 2020111769A5 JP 2019001638 A JP2019001638 A JP 2019001638A JP 2019001638 A JP2019001638 A JP 2019001638A JP 2020111769 A5 JP2020111769 A5 JP 2020111769A5
- Authority
- JP
- Japan
- Prior art keywords
- base layer
- catalyst
- metal film
- nanoimprinting
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 25
- 239000003054 catalyst Substances 0.000 description 21
- 239000000463 material Substances 0.000 description 21
- 238000007747 plating Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 13
- 238000013329 compounding Methods 0.000 description 10
- 239000000243 solution Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- HWCKGOZZJDHMNC-UHFFFAOYSA-M tetraethylammonium bromide Chemical compound [Br-].CC[N+](CC)(CC)CC HWCKGOZZJDHMNC-UHFFFAOYSA-M 0.000 description 2
- KKZZSTCINUMTGD-UHFFFAOYSA-N 1,2,2,3-tetramethylpiperidin-4-ol Chemical compound CC1C(O)CCN(C)C1(C)C KKZZSTCINUMTGD-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000007877 V-601 Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- BHIWKHZACMWKOJ-UHFFFAOYSA-N methyl isobutyrate Chemical compound COC(=O)C(C)C BHIWKHZACMWKOJ-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019001638A JP2020111769A (ja) | 2019-01-09 | 2019-01-09 | 金属膜作成方法及びナノインプリンティング材 |
| US16/737,669 US20200218148A1 (en) | 2019-01-09 | 2020-01-08 | Method for forming a metal film, and nanoimprint lithography material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019001638A JP2020111769A (ja) | 2019-01-09 | 2019-01-09 | 金属膜作成方法及びナノインプリンティング材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2020111769A JP2020111769A (ja) | 2020-07-27 |
| JP2020111769A5 true JP2020111769A5 (enExample) | 2020-09-03 |
Family
ID=71404350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019001638A Pending JP2020111769A (ja) | 2019-01-09 | 2019-01-09 | 金属膜作成方法及びナノインプリンティング材 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20200218148A1 (enExample) |
| JP (1) | JP2020111769A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024014152A1 (ja) * | 2022-07-11 | 2024-01-18 | 東洋合成工業株式会社 | パターン基材の製造方法、硬化性組成物、及び部品の製造方法 |
-
2019
- 2019-01-09 JP JP2019001638A patent/JP2020111769A/ja active Pending
-
2020
- 2020-01-08 US US16/737,669 patent/US20200218148A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI690977B (zh) | 用於自組裝之模板及製造自組裝圖樣之方法 | |
| KR101667401B1 (ko) | 화학 증폭 포지티브형 레지스트 재료 및 패턴 형성 방법 | |
| TWI564659B (zh) | Ｉ－ｌｉｎｅ光阻成分及使用其形成精細圖案的方法 | |
| JP2004046217A5 (enExample) | ||
| TW200811920A (en) | Method of forming pattern, metal oxide film-forming material and method of use thereof | |
| TWI655217B (zh) | 底劑、含相分離結構的結構體的製造方法 | |
| TW201111917A (en) | Method and materials for reverse patterning | |
| EP3500637B1 (en) | Polymer compositions for self-assembly applications | |
| JP2012219236A (ja) | 相分離構造を有する層を表面に備える基板の製造方法 | |
| JP2011079877A (ja) | 高分子超薄膜および高分子超薄膜パターン、並びに、パターン形成用組成物 | |
| TWI619746B (zh) | 含有相分離結構之結構體的製造方法、圖型形成方法及微細圖型形成方法 | |
| TW201546544A (zh) | 包含相分離構造之構造體的製造方法及面塗膜的成膜方法 | |
| TW202140580A (zh) | 用於嵌段共聚物之自組裝之新穎組合物及方法 | |
| JP2020111769A5 (enExample) | ||
| JP6027758B2 (ja) | 組成物及びパターン形成方法 | |
| TW201641542A (zh) | 嵌段共聚物、嵌段共聚物之製造方法及含相分離結構之結構體的製造方法 | |
| JP2018100384A (ja) | 相分離構造形成用樹脂組成物、及び、相分離構造を含む構造体の製造方法 | |
| TW201840617A (zh) | 相分離構造形成用樹脂組成物，以及包含相分離構造之構造體之製造方法 | |
| JPWO2018062157A1 (ja) | 相分離構造を含む構造体の製造方法 | |
| US20240182701A1 (en) | Resin composition for forming phase-separated structure, method of producing structure containing phase-separated structure, and block copolymer | |
| JP2020111769A (ja) | 金属膜作成方法及びナノインプリンティング材 | |
| TW202504954A (zh) | 相分離構造形成用樹脂組成物、以及包含相分離構造之構造體的製造方法 | |
| JP6357054B2 (ja) | 相分離構造を含む構造体の製造方法 | |
| JP2025103405A (ja) | 相分離構造形成用樹脂組成物、及び相分離構造を含む構造体の製造方法 | |
| TW202505302A (zh) | 蝕刻遮罩圖型形成用樹脂組成物及蝕刻遮罩圖型之製造方法 |