JP7685983B2 - 酸化珪素膜用研磨液組成物 - Google Patents

酸化珪素膜用研磨液組成物 Download PDF

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Publication number
JP7685983B2
JP7685983B2 JP2022210624A JP2022210624A JP7685983B2 JP 7685983 B2 JP7685983 B2 JP 7685983B2 JP 2022210624 A JP2022210624 A JP 2022210624A JP 2022210624 A JP2022210624 A JP 2022210624A JP 7685983 B2 JP7685983 B2 JP 7685983B2
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Japan
Prior art keywords
component
polishing
present disclosure
hydrogen atom
less
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JP2022210624A
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English (en)
Japanese (ja)
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JP2023098704A (ja
JP2023098704A5 (enExample
Inventor
将人 菅原
哲史 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
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Kao Corp
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Publication of JP2023098704A5 publication Critical patent/JP2023098704A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2022210624A 2021-12-28 2022-12-27 酸化珪素膜用研磨液組成物 Active JP7685983B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021214529 2021-12-28
JP2021214529 2021-12-28

Publications (3)

Publication Number Publication Date
JP2023098704A JP2023098704A (ja) 2023-07-10
JP2023098704A5 JP2023098704A5 (enExample) 2024-04-23
JP7685983B2 true JP7685983B2 (ja) 2025-05-30

Family

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Family Applications (1)

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JP2022210624A Active JP7685983B2 (ja) 2021-12-28 2022-12-27 酸化珪素膜用研磨液組成物

Country Status (3)

Country Link
JP (1) JP7685983B2 (enExample)
TW (1) TW202342662A (enExample)
WO (1) WO2023127898A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025023040A1 (ja) * 2023-07-21 2025-01-30 Ａｇｃ株式会社 研磨剤及びその製造方法、研磨剤用添加液の製造方法、研磨方法、並びに、半導体部品の製造方法
CN119998926A (zh) * 2023-09-13 2025-05-13 株式会社力森诺科 Cmp用研磨液、cmp用研磨液套组及研磨方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003041239A (ja) 2001-07-26 2003-02-13 Kao Corp 研磨液組成物
JP2020080399A (ja) 2018-09-28 2020-05-28 花王株式会社 酸化珪素膜用研磨液組成物
JP2020183481A (ja) 2019-05-08 2020-11-12 花王株式会社 酸化珪素膜用研磨液組成物
JP2021005704A (ja) 2019-06-26 2021-01-14 花王株式会社 酸化珪素膜用研磨液組成物
JP2021166254A (ja) 2020-04-07 2021-10-14 花王株式会社 酸化珪素膜用研磨液組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7024690B2 (ja) * 2018-11-12 2022-02-24 トヨタ自動車株式会社 制御ユニット

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003041239A (ja) 2001-07-26 2003-02-13 Kao Corp 研磨液組成物
JP2020080399A (ja) 2018-09-28 2020-05-28 花王株式会社 酸化珪素膜用研磨液組成物
JP2020183481A (ja) 2019-05-08 2020-11-12 花王株式会社 酸化珪素膜用研磨液組成物
JP2021005704A (ja) 2019-06-26 2021-01-14 花王株式会社 酸化珪素膜用研磨液組成物
JP2021166254A (ja) 2020-04-07 2021-10-14 花王株式会社 酸化珪素膜用研磨液組成物

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Publication number Publication date
JP2023098704A (ja) 2023-07-10
WO2023127898A1 (ja) 2023-07-06
TW202342662A (zh) 2023-11-01

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