TW202342662A - 氧化矽膜用研磨液組合物 - Google Patents

氧化矽膜用研磨液組合物 Download PDF

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Publication number
TW202342662A
TW202342662A TW111150361A TW111150361A TW202342662A TW 202342662 A TW202342662 A TW 202342662A TW 111150361 A TW111150361 A TW 111150361A TW 111150361 A TW111150361 A TW 111150361A TW 202342662 A TW202342662 A TW 202342662A
Authority
TW
Taiwan
Prior art keywords
component
polishing
group
liquid composition
silicon oxide
Prior art date
Application number
TW111150361A
Other languages
English (en)
Chinese (zh)
Inventor
菅原将人
山口哲史
Original Assignee
日商花王股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商花王股份有限公司 filed Critical 日商花王股份有限公司
Publication of TW202342662A publication Critical patent/TW202342662A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW111150361A 2021-12-28 2022-12-28 氧化矽膜用研磨液組合物 TW202342662A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-214529 2021-12-28
JP2021214529 2021-12-28

Publications (1)

Publication Number Publication Date
TW202342662A true TW202342662A (zh) 2023-11-01

Family

ID=86999094

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111150361A TW202342662A (zh) 2021-12-28 2022-12-28 氧化矽膜用研磨液組合物

Country Status (3)

Country Link
JP (1) JP7685983B2 (enExample)
TW (1) TW202342662A (enExample)
WO (1) WO2023127898A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025023040A1 (ja) * 2023-07-21 2025-01-30 Ａｇｃ株式会社 研磨剤及びその製造方法、研磨剤用添加液の製造方法、研磨方法、並びに、半導体部品の製造方法
CN119998926A (zh) * 2023-09-13 2025-05-13 株式会社力森诺科 Cmp用研磨液、cmp用研磨液套组及研磨方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4462593B2 (ja) * 2001-07-26 2010-05-12 花王株式会社 研磨液組成物
JP7326048B2 (ja) * 2018-09-28 2023-08-15 花王株式会社 酸化珪素膜用研磨液組成物
JP7024690B2 (ja) * 2018-11-12 2022-02-24 トヨタ自動車株式会社 制御ユニット
JP7209583B2 (ja) * 2019-05-08 2023-01-20 花王株式会社 酸化珪素膜用研磨液組成物
JP7041714B2 (ja) * 2019-06-26 2022-03-24 花王株式会社 酸化珪素膜用研磨液組成物
JP7425660B2 (ja) * 2020-04-07 2024-01-31 花王株式会社 酸化珪素膜用研磨液組成物

Also Published As

Publication number Publication date
JP2023098704A (ja) 2023-07-10
WO2023127898A1 (ja) 2023-07-06
JP7685983B2 (ja) 2025-05-30

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