JP2021005704A5 - - Google Patents
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- Publication number
- JP2021005704A5 JP2021005704A5 JP2020104048A JP2020104048A JP2021005704A5 JP 2021005704 A5 JP2021005704 A5 JP 2021005704A5 JP 2020104048 A JP2020104048 A JP 2020104048A JP 2020104048 A JP2020104048 A JP 2020104048A JP 2021005704 A5 JP2021005704 A5 JP 2021005704A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- group
- polishing liquid
- liquid composition
- composition according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 19
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 15
- 239000007788 liquid Substances 0.000 claims 15
- 125000000129 anionic group Chemical group 0.000 claims 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 4
- 229910052783 alkali metal Inorganic materials 0.000 claims 4
- 150000001340 alkali metals Chemical class 0.000 claims 4
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims 4
- 150000001342 alkaline earth metals Chemical class 0.000 claims 4
- 125000003545 alkoxy group Chemical group 0.000 claims 4
- 125000003118 aryl group Chemical group 0.000 claims 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 4
- 150000002892 organic cations Chemical class 0.000 claims 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims 3
- 239000000178 monomer Substances 0.000 claims 3
- 125000003710 aryl alkyl group Chemical group 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000002947 alkylene group Chemical group 0.000 claims 1
- 239000012736 aqueous medium Substances 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 229910000420 cerium oxide Inorganic materials 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 239000000470 constituent Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 229920001519 homopolymer Polymers 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- -1 methacryloyloxyethyl Chemical group 0.000 claims 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920001223 polyethylene glycol Polymers 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 125000000542 sulfonic acid group Chemical group 0.000 claims 1
- 229920003169 water-soluble polymer Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019118741 | 2019-06-26 | ||
| JP2019118741 | 2019-06-26 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021005704A JP2021005704A (ja) | 2021-01-14 |
| JP2021005704A5 true JP2021005704A5 (enExample) | 2022-01-11 |
| JP7041714B2 JP7041714B2 (ja) | 2022-03-24 |
Family
ID=74061638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020104048A Active JP7041714B2 (ja) | 2019-06-26 | 2020-06-16 | 酸化珪素膜用研磨液組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20220259458A1 (enExample) |
| JP (1) | JP7041714B2 (enExample) |
| KR (1) | KR20220024175A (enExample) |
| CN (1) | CN114026189B (enExample) |
| TW (1) | TWI796575B (enExample) |
| WO (1) | WO2020262234A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102677799B1 (ko) * | 2021-04-30 | 2024-06-24 | 주식회사 케이씨텍 | 연마 슬러리 조성물 |
| JP7727510B2 (ja) * | 2021-12-02 | 2025-08-21 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| JP7685983B2 (ja) * | 2021-12-28 | 2025-05-30 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY144587A (en) * | 2001-06-21 | 2011-10-14 | Kao Corp | Polishing composition |
| JP2007103485A (ja) * | 2005-09-30 | 2007-04-19 | Fujifilm Corp | 研磨方法及びそれに用いる研磨液 |
| US10087082B2 (en) * | 2006-06-06 | 2018-10-02 | Florida State University Research Foundation, Inc. | Stabilized silica colloid |
| US8075697B2 (en) * | 2007-02-08 | 2011-12-13 | Fontana Technology | Particle removal method and composition |
| US20090056231A1 (en) * | 2007-08-28 | 2009-03-05 | Daniela White | Copper CMP composition containing ionic polyelectrolyte and method |
| KR101250090B1 (ko) * | 2008-04-23 | 2013-04-03 | 히타치가세이가부시끼가이샤 | 연마제 및 이 연마제를 이용한 기판의 연마방법 |
| JP5940270B2 (ja) * | 2010-12-09 | 2016-06-29 | 花王株式会社 | 研磨液組成物 |
| TWI573864B (zh) * | 2012-03-14 | 2017-03-11 | 卡博特微電子公司 | 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物 |
| CN103509468B (zh) * | 2012-06-21 | 2017-08-11 | 安集微电子（上海）有限公司 | 一种用于硅通孔平坦化的化学机械抛光液 |
| US9803109B2 (en) * | 2015-02-03 | 2017-10-31 | Cabot Microelectronics Corporation | CMP composition for silicon nitride removal |
| JP6618355B2 (ja) * | 2015-12-28 | 2019-12-11 | 花王株式会社 | 研磨液組成物 |
| US10066126B2 (en) * | 2016-01-06 | 2018-09-04 | Cabot Microelectronics Corporation | Tungsten processing slurry with catalyst |
| JP6637816B2 (ja) * | 2016-03-31 | 2020-01-29 | 株式会社フジミインコーポレーテッド | 研磨用組成物、基板の研磨方法および基板の製造方法 |
| JP2017190363A (ja) * | 2016-04-11 | 2017-10-19 | 花王株式会社 | サファイア板用研磨液組成物 |
| JP6815092B2 (ja) * | 2016-04-12 | 2021-01-20 | 花王株式会社 | 表面処理剤 |
| JP6783609B2 (ja) * | 2016-09-29 | 2020-11-11 | 花王株式会社 | 金属酸化物粒子分散液 |
| JP7061862B2 (ja) * | 2016-10-28 | 2022-05-02 | 花王株式会社 | シリコンウェーハ用リンス剤組成物 |
| JP6495230B2 (ja) * | 2016-12-22 | 2019-04-03 | 花王株式会社 | シリコンウェーハ用リンス剤組成物 |
| JP6811090B2 (ja) * | 2016-12-27 | 2021-01-13 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| JP6864519B2 (ja) * | 2017-03-31 | 2021-04-28 | 株式会社フジミインコーポレーテッド | 研磨用組成物、磁気ディスク基板の製造方法および磁気ディスクの研磨方法 |
-
2020
- 2020-06-16 JP JP2020104048A patent/JP7041714B2/ja active Active
- 2020-06-19 CN CN202080046236.2A patent/CN114026189B/zh active Active
- 2020-06-19 KR KR1020217042462A patent/KR20220024175A/ko active Pending
- 2020-06-19 US US17/622,457 patent/US20220259458A1/en active Pending
- 2020-06-19 WO PCT/JP2020/024130 patent/WO2020262234A1/ja not_active Ceased
- 2020-06-23 TW TW109121321A patent/TWI796575B/zh active
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