JP2023090254A - 撮像装置 - Google Patents

撮像装置 Download PDF

Info

Publication number
JP2023090254A
JP2023090254A JP2021205129A JP2021205129A JP2023090254A JP 2023090254 A JP2023090254 A JP 2023090254A JP 2021205129 A JP2021205129 A JP 2021205129A JP 2021205129 A JP2021205129 A JP 2021205129A JP 2023090254 A JP2023090254 A JP 2023090254A
Authority
JP
Japan
Prior art keywords
circuit board
heat dissipation
dissipation sheet
contact
flexible member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021205129A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023090254A5 (https=
Inventor
圭 鈴木
Kei Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2021205129A priority Critical patent/JP2023090254A/ja
Priority to US18/064,420 priority patent/US12256134B2/en
Publication of JP2023090254A publication Critical patent/JP2023090254A/ja
Publication of JP2023090254A5 publication Critical patent/JP2023090254A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Cameras Adapted For Combination With Other Photographic Or Optical Apparatuses (AREA)
JP2021205129A 2021-12-17 2021-12-17 撮像装置 Pending JP2023090254A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021205129A JP2023090254A (ja) 2021-12-17 2021-12-17 撮像装置
US18/064,420 US12256134B2 (en) 2021-12-17 2022-12-12 Image capturing apparatus that can efficiently radiate heat from an image sensor and reduce the load applied to the image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021205129A JP2023090254A (ja) 2021-12-17 2021-12-17 撮像装置

Publications (2)

Publication Number Publication Date
JP2023090254A true JP2023090254A (ja) 2023-06-29
JP2023090254A5 JP2023090254A5 (https=) 2024-11-22

Family

ID=86769560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021205129A Pending JP2023090254A (ja) 2021-12-17 2021-12-17 撮像装置

Country Status (2)

Country Link
US (1) US12256134B2 (https=)
JP (1) JP2023090254A (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023090254A (ja) 2021-12-17 2023-06-29 キヤノン株式会社 撮像装置
JP7770900B2 (ja) 2021-12-17 2025-11-17 キヤノン株式会社 レンズ装置および撮像装置
JP7814912B2 (ja) 2021-12-17 2026-02-17 キヤノン株式会社 撮像装置
JP7814913B2 (ja) * 2021-12-17 2026-02-17 キヤノン株式会社 レンズモジュール、撮像装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09163197A (ja) * 1995-12-09 1997-06-20 Sony Corp ビデオカメラ装置
JP2002299866A (ja) * 2001-03-30 2002-10-11 Minolta Co Ltd 基板の放熱構造
JP2009229582A (ja) * 2008-03-19 2009-10-08 Casio Comput Co Ltd デジタルカメラ
JP2010205916A (ja) * 2009-03-03 2010-09-16 Olympus Corp 半導体ユニットおよび電子撮像装置
JP2012070272A (ja) * 2010-09-24 2012-04-05 Canon Inc 撮像素子の放熱構造
JP2014081504A (ja) * 2012-10-17 2014-05-08 Ricoh Co Ltd 撮像ユニットおよび電子機器
US20180241917A1 (en) * 2015-11-23 2018-08-23 SZ DJI Technology Co., Ltd. Image capture assembly and aerial photographing aerial vehicle
JP2018180506A (ja) * 2017-04-12 2018-11-15 日本電産サンキョー株式会社 光学ユニットおよび３軸振れ補正機能付き光学ユニット
JP2019200349A (ja) * 2018-05-17 2019-11-21 キヤノン株式会社 撮像装置
US20190377244A1 (en) * 2018-06-12 2019-12-12 Sharp Kabushiki Kaisha Dashboard camera

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10663714B2 (en) 2010-10-28 2020-05-26 Endochoice, Inc. Optical system for an endoscope
EP2696575B1 (en) * 2011-04-05 2018-10-10 Panasonic Intellectual Property Management Co., Ltd. Solid-state image pickup device, and method for manufacturing solid-state image pickup device
US9176298B1 (en) 2012-10-04 2015-11-03 Drs Network & Imaging Systems, Llc Springless athermal lens design with flexured spacer
EP2740258B1 (en) * 2012-10-15 2016-12-21 GoPro, Inc. Heat transfer camera ring
JP6054720B2 (ja) 2012-11-28 2016-12-27 京セラ株式会社 光学ユニット、撮像装置、および移動体
CN203120020U (zh) * 2013-01-15 2013-08-07 上海莫仕连接器有限公司 相机装置及电子装置
CN105492953B (zh) 2013-09-03 2019-09-13 维宁尔瑞典公司 用于机动车辆的摄像机模块及安装摄像机模块的方法
EP3163864B1 (en) * 2014-06-26 2019-11-06 Kyocera Corporation Image-capturing device and vehicle
US10582101B2 (en) 2015-04-01 2020-03-03 Gopro, Inc. Thermal compensation in an integrated image sensor and lens assembly
JP6912530B2 (ja) 2015-05-15 2021-08-04 マクセル株式会社 カメラ
US9674986B2 (en) * 2015-08-03 2017-06-06 Apple Inc. Parallel heat spreader
JP6391122B2 (ja) 2015-10-26 2018-09-19 カンタツ株式会社 レンズアセンブリおよび撮像装置
JP6732438B2 (ja) 2015-11-27 2020-07-29 京セラ株式会社 撮像装置
CN105578736A (zh) * 2016-03-15 2016-05-11 深圳华麟电路技术有限公司 散热效率高用于摄像头模组的fpc板及其制作方法
US10962733B2 (en) 2016-03-30 2021-03-30 Lg Innotek Co., Ltd. Camera module and optical apparatus comprising same
US10133158B2 (en) * 2016-10-17 2018-11-20 Panasonic Intellectual Property Management Co., Ltd. Imaging device
KR102645353B1 (ko) * 2016-12-23 2024-03-08 삼성전자주식회사 카메라 모듈
US10306114B2 (en) 2017-02-10 2019-05-28 Google Llc Camera module mounting in an electronic device
JP2018141861A (ja) 2017-02-28 2018-09-13 日本電産コパル株式会社 レンズ鏡筒及び撮像装置
US20190373142A1 (en) * 2018-05-31 2019-12-05 Sharp Kabushiki Kaisha Imaging apparatus
US11397306B2 (en) 2018-07-30 2022-07-26 Magna Electronics Inc. Vehicular camera with temperature invariant lens spacers
CN208636519U (zh) 2018-08-10 2019-03-22 瑞声科技(新加坡)有限公司 镜头模组
US12106893B2 (en) 2019-03-19 2024-10-01 Rohm Co., Ltd. Coil module, actuator provided with coil module, and method for manufacturing coil module
JP7281956B2 (ja) 2019-04-25 2023-05-26 マクセル株式会社 レンズユニットおよびカメラモジュール
JP6825661B2 (ja) 2019-08-26 2021-02-03 株式会社リコー 電子機器および熱拡散体
JP7529422B2 (ja) 2020-03-30 2024-08-06 ニデックインスツルメンツ株式会社 レンズユニット
JP7638070B2 (ja) 2020-06-09 2025-03-03 マクセル株式会社 レンズユニットおよびカメラモジュール
CN113905150A (zh) * 2020-06-22 2022-01-07 三赢科技（深圳）有限公司 摄像头模组及电子装置
SE547236C2 (en) 2020-06-30 2025-06-10 Orlaco Products B V Camera system with lens heater
JP7706233B2 (ja) 2020-10-01 2025-07-11 マクセル株式会社 レンズユニットおよびカメラモジュール
KR20220052557A (ko) 2020-10-21 2022-04-28 엘지이노텍 주식회사 카메라 모듈
EP4376566A4 (en) * 2021-09-24 2024-11-06 Samsung Electronics Co., Ltd. CAMERA MODULE FOR HEAT DISSIPATION AND GROUNDING AND ELECTRONIC DEVICE THEREFOR
JP7790929B2 (ja) 2021-11-18 2025-12-23 キヤノン株式会社 撮像装置
JP7814912B2 (ja) 2021-12-17 2026-02-17 キヤノン株式会社 撮像装置
JP7770900B2 (ja) 2021-12-17 2025-11-17 キヤノン株式会社 レンズ装置および撮像装置
JP2023090254A (ja) 2021-12-17 2023-06-29 キヤノン株式会社 撮像装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09163197A (ja) * 1995-12-09 1997-06-20 Sony Corp ビデオカメラ装置
JP2002299866A (ja) * 2001-03-30 2002-10-11 Minolta Co Ltd 基板の放熱構造
JP2009229582A (ja) * 2008-03-19 2009-10-08 Casio Comput Co Ltd デジタルカメラ
JP2010205916A (ja) * 2009-03-03 2010-09-16 Olympus Corp 半導体ユニットおよび電子撮像装置
JP2012070272A (ja) * 2010-09-24 2012-04-05 Canon Inc 撮像素子の放熱構造
JP2014081504A (ja) * 2012-10-17 2014-05-08 Ricoh Co Ltd 撮像ユニットおよび電子機器
US20180241917A1 (en) * 2015-11-23 2018-08-23 SZ DJI Technology Co., Ltd. Image capture assembly and aerial photographing aerial vehicle
JP2018180506A (ja) * 2017-04-12 2018-11-15 日本電産サンキョー株式会社 光学ユニットおよび３軸振れ補正機能付き光学ユニット
JP2019200349A (ja) * 2018-05-17 2019-11-21 キヤノン株式会社 撮像装置
US20190377244A1 (en) * 2018-06-12 2019-12-12 Sharp Kabushiki Kaisha Dashboard camera

Also Published As

Publication number Publication date
US20230199289A1 (en) 2023-06-22
US12256134B2 (en) 2025-03-18

Similar Documents

Publication Publication Date Title
US12256134B2 (en) Image capturing apparatus that can efficiently radiate heat from an image sensor and reduce the load applied to the image sensor
US10841467B2 (en) Parts for imaging apparatus, and imaging apparatus
JP5565117B2 (ja) 撮像装置
EP3599493B1 (en) Imaging apparatus
CN101848326B (zh) 摄像设备
JP2019020557A (ja) 撮像装置
JP2007049369A (ja) 撮像素子パッケージの保持構造、及びレンズユニット
JP2012070272A (ja) 撮像素子の放熱構造
KR20190019729A (ko) 카메라 모듈
JP2016019005A (ja) 撮像装置
JP5460178B2 (ja) 撮像装置
KR20190040447A (ko) 카메라
JP2012084804A (ja) コネクタ押さえ部材、および電子機器
CN219068287U (zh) 摄像装置
JP2002247594A (ja) 撮像装置
JP2001326840A (ja) 撮像装置
JP2018189667A (ja) 撮像装置
JP7336315B2 (ja) 撮像装置
JP5188412B2 (ja) 撮像装置および電子機器
JP2021048540A (ja) 撮像装置
JP2013120955A (ja) 撮像装置
US12513379B2 (en) Image pickup apparatus
US20260110950A1 (en) Camera module
JP6675241B2 (ja) 撮像装置
JP5805114B2 (ja) 撮像装置および電子機器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241114

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241114

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20250611

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250617

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250710

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20250902