JP2023050162A5 - - Google Patents

Info

Publication number
JP2023050162A5
JP2023050162A5 JP2022153351A JP2022153351A JP2023050162A5 JP 2023050162 A5 JP2023050162 A5 JP 2023050162A5 JP 2022153351 A JP2022153351 A JP 2022153351A JP 2022153351 A JP2022153351 A JP 2022153351A JP 2023050162 A5 JP2023050162 A5 JP 2023050162A5
Authority
JP
Japan
Prior art keywords
film
release
connection
treated
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022153351A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023050162A (ja
Filing date
Publication date
Application filed filed Critical
Priority to KR1020247009355A priority Critical patent/KR20240049589A/ko
Priority to US18/694,783 priority patent/US20250114982A1/en
Priority to PCT/JP2022/035844 priority patent/WO2023054316A1/ja
Priority to TW111136742A priority patent/TW202344658A/zh
Publication of JP2023050162A publication Critical patent/JP2023050162A/ja
Publication of JP2023050162A5 publication Critical patent/JP2023050162A5/ja
Pending legal-status Critical Current

Links

JP2022153351A 2021-09-29 2022-09-27 接続フィルムの製造方法 Pending JP2023050162A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020247009355A KR20240049589A (ko) 2021-09-29 2022-09-27 접속 필름의 제조 방법
US18/694,783 US20250114982A1 (en) 2021-09-29 2022-09-27 Method for manufacturing a connection film
PCT/JP2022/035844 WO2023054316A1 (ja) 2021-09-29 2022-09-27 接続フィルムの製造方法
TW111136742A TW202344658A (zh) 2021-09-29 2022-09-28 連接膜之製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021159766 2021-09-29
JP2021159766 2021-09-29

Publications (2)

Publication Number Publication Date
JP2023050162A JP2023050162A (ja) 2023-04-10
JP2023050162A5 true JP2023050162A5 (https=) 2025-10-03

Family

ID=85802138

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022153351A Pending JP2023050162A (ja) 2021-09-29 2022-09-27 接続フィルムの製造方法

Country Status (2)

Country Link
JP (1) JP2023050162A (https=)
CN (1) CN117999326A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024241858A1 (ja) * 2023-05-23 2024-11-28 デクセリアルズ株式会社 接続構造体の製造方法、及び接続構造体
WO2026074952A1 (ja) * 2024-10-02 2026-04-09 デクセリアルズ株式会社 フィラー含有フィルム及びその製造方法並びに接続構造体及びその製造方法

Similar Documents

Publication Publication Date Title
US9362042B2 (en) Electronic component
US9691539B2 (en) Coil component
JP2023050162A5 (https=)
US10475570B2 (en) Electronic component
EP3082385B1 (en) Rigid-flexible circuit board having flying-tail structure and method for manufacturing same
US20170084384A1 (en) Coil component
JP6870428B2 (ja) 電子部品
JP2020198422A5 (https=)
US11842839B2 (en) Magnetic coupling coil component
US11289965B2 (en) Resin multilayer substrate, actuator, and method of manufacturing resin multilayer substrate
JP2012064683A (ja) 積層型コイル
JP6930217B2 (ja) 積層電子部品
KR101431964B1 (ko) 전자 부품 및 그 제조 방법
CN104160459A (zh) 基板内置用芯片电阻器及其制造方法
TWI529750B (zh) Flat cable
US20090229121A1 (en) Method for manufacturing multilayer printed circuit boards
CN104869761A (zh) 一种挠性板在外层的刚挠结合线路板的制作方法
JP2010135691A (ja) リード型電子部品
JP6318838B2 (ja) 積層セラミック電子部品の製造方法
US11942276B2 (en) First-stage ceramic collective board, second-stage ceramic collective board, manufacturing method for second-stage ceramic collective board, and manufacturing method for multilayer electronic component
JP4795073B2 (ja) 回路基板同士の接続構造及び接続方法
JP2005317837A (ja) プリント配線の製造方法
US11636972B2 (en) Multilayer substrate and method of manufacturing the same
US20250266205A1 (en) Inductor, coil substrate, and method of manufacturing inductor
JP2007088140A (ja) 集合プリント配線板