JP2023044722A5 - - Google Patents

Info

Publication number
JP2023044722A5
JP2023044722A5 JP2022144755A JP2022144755A JP2023044722A5 JP 2023044722 A5 JP2023044722 A5 JP 2023044722A5 JP 2022144755 A JP2022144755 A JP 2022144755A JP 2022144755 A JP2022144755 A JP 2022144755A JP 2023044722 A5 JP2023044722 A5 JP 2023044722A5
Authority
JP
Japan
Prior art keywords
region
electrical conductivity
semiconductor layer
solid body
front side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022144755A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023044722A (ja
Filing date
Publication date
Priority claimed from IT102021000024104A external-priority patent/IT202100024104A1/it
Application filed filed Critical
Publication of JP2023044722A publication Critical patent/JP2023044722A/ja
Publication of JP2023044722A5 publication Critical patent/JP2023044722A5/ja
Pending legal-status Critical Current

Links

JP2022144755A 2021-09-20 2022-09-12 シリコンカーバイドに基づくmps装置におけるjbダイオードとショットキーダイオードの文脈的形成及びmps装置 Pending JP2023044722A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102021000024104 2021-09-20
IT102021000024104A IT202100024104A1 (it) 2021-09-20 2021-09-20 Formazione contestuale di un diodo jb e di un diodo schottky in un dispositivo mps basato su carburo di silicio, e dispositivo mps

Publications (2)

Publication Number Publication Date
JP2023044722A JP2023044722A (ja) 2023-03-31
JP2023044722A5 true JP2023044722A5 (https=) 2025-09-11

Family

ID=78649965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022144755A Pending JP2023044722A (ja) 2021-09-20 2022-09-12 シリコンカーバイドに基づくmps装置におけるjbダイオードとショットキーダイオードの文脈的形成及びmps装置

Country Status (5)

Country Link
US (2) US12426285B2 (https=)
EP (1) EP4152406B1 (https=)
JP (1) JP2023044722A (https=)
CN (2) CN115841947B (https=)
IT (1) IT202100024104A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202100024104A1 (it) * 2021-09-20 2023-03-20 Consiglio Nazionale Ricerche Formazione contestuale di un diodo jb e di un diodo schottky in un dispositivo mps basato su carburo di silicio, e dispositivo mps
CN117317034A (zh) * 2023-11-28 2023-12-29 深圳平创半导体有限公司 一种碳化硅混合二极管器件、制作方法及版图结构
CN118448471A (zh) * 2024-05-23 2024-08-06 深圳市港祥辉电子有限公司 一种高压低导通电阻金刚石混合式pin二极管及其制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071281A (ja) * 2009-09-25 2011-04-07 Toyota Central R&D Labs Inc 半導体装置とその製造方法
DE102014118874B4 (de) * 2014-12-17 2025-09-18 Infineon Technologies Austria Ag Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung
DE102017100109A1 (de) * 2017-01-04 2018-07-05 Infineon Technologies Ag Halbleitervorrichtung und verfahren zum herstellen derselben
KR101972739B1 (ko) 2017-07-29 2019-04-25 한국표준과학연구원 반도체 소자 및 반도체 소자의 제조방법
CN109686797A (zh) * 2017-10-19 2019-04-26 株洲中车时代电气股份有限公司 一种碳化硅肖特基二极管及其制造方法
CN108231871B (zh) 2018-01-31 2023-11-03 华南理工大学 一种MoS2基量子阱型调制掺杂场效应晶体管及其制备方法
US10840385B1 (en) 2020-01-31 2020-11-17 Genesic Semiconductor Inc. Performance SiC Schottky diodes
IT202100024104A1 (it) * 2021-09-20 2023-03-20 Consiglio Nazionale Ricerche Formazione contestuale di un diodo jb e di un diodo schottky in un dispositivo mps basato su carburo di silicio, e dispositivo mps

Similar Documents

Publication Publication Date Title
US11699748B2 (en) Normally-off HEMT transistor with selective generation of 2DEG channel, and manufacturing method thereof
JP2023044722A5 (https=)
CN110875387B (zh) 半导体器件和用于形成半导体器件的方法
US7479669B2 (en) Current aperture transistors and methods of fabricating same
US9412858B2 (en) Group III nitride semiconductor device which can be used as a power transistor
JP5580602B2 (ja) デプレッションモードGaNベースFETを使用したカスコード回路
US12176430B2 (en) Semiconductor structure and semiconductor device
CN109037324A (zh) 在断态期间具有高应力顺应性的hemt晶体管及其制造方法
TW202025493A (zh) 增強模式化合物半導體場效電晶體、半導體裝置、以及製造增強模式半導體裝置之方法
US7786509B2 (en) Field-effect transistor and method of making same
CN108258035B (zh) 一种GaN基增强型场效应器件及其制作方法
CN116490979B (zh) 半导体结构及其制作方法
CN113892186A (zh) 一种半导体结构及其制造方法
JP4889203B2 (ja) 窒化物半導体装置及びその製造方法
CN110021661A (zh) 半导体器件及其制作方法
US20200251583A1 (en) High electron mobility transistor
CN102544087B (zh) 基于氮化物的半导体器件及其制造方法
CN113906573A (zh) 一种半导体结构及其制造方法
KR101172857B1 (ko) 인헨스먼트 노멀리 오프 질화물 반도체 소자 및 그 제조방법
CN113488536A (zh) 具有衬底电极的增强型的p型氮化镓器件及其制备方法
CN115101413B (zh) 一种增强型场效应晶体管的制备方法及器件
US12040380B2 (en) High electron mobility transistor and method for fabricating the same
JP5580012B2 (ja) ショットキーバリアダイオード及びその製造方法
WO2022032576A1 (zh) 半导体结构及其制作方法
TWI870916B (zh) 二極體及其製造方法