JP2023037557A - 固体撮像素子 - Google Patents
固体撮像素子 Download PDFInfo
- Publication number
- JP2023037557A JP2023037557A JP2022043525A JP2022043525A JP2023037557A JP 2023037557 A JP2023037557 A JP 2023037557A JP 2022043525 A JP2022043525 A JP 2022043525A JP 2022043525 A JP2022043525 A JP 2022043525A JP 2023037557 A JP2023037557 A JP 2023037557A
- Authority
- JP
- Japan
- Prior art keywords
- solid
- imaging device
- state imaging
- organic
- color filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007787 solid Substances 0.000 title abstract 2
- 239000002086 nanomaterial Substances 0.000 claims abstract description 52
- 238000006243 chemical reaction Methods 0.000 claims abstract description 46
- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000000926 separation method Methods 0.000 claims abstract description 4
- 238000003384 imaging method Methods 0.000 claims description 66
- 238000002955 isolation Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
- H10K39/32—Organic image sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14665—Imagers using a photoconductor layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/451—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising a metal-semiconductor-metal [m-s-m] structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/81—Electrodes
- H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
10 半導体基板
11R、11Mg、11B 光電変換素子
13 分離構造
20 カラーフィルタ層
20SB 青色カラーフィルタセグメント
20SR 赤色カラーフィルタセグメント
20SW 白色カラーフィルタセグメント
30 グリッド構造
40 有機膜
40L 下側
40S 有機セグメント
40S1 有機セグメント
40U 上側
50L 下電極
50LS 電極セグメント
50LS1、50LS1’ 第1の電極セグメント
50LS2、50LS2’ 第2の電極セグメント
50U 上電極
50UT 上側
60U、60L ナノ構造
70 集光構造
70m マイクロレンズ
E1、E1’ 第1の電極セグメントの長さ
E2、E2’ 第2の電極セグメントの長さ
N、N1、N1’ ナノ構造の長さ
P 画素
PDAF 位相検出オートフォーカス
X、Z 座標軸
Claims (12)
- 光電変換素子を有する半導体基板、
前記光電変換素子の間に配置された分離構造、
前記半導体基板の上に配置され、前記光電変換素子に対応するカラーフィルタセグメントを有するカラーフィルタ層、
前記カラーフィルタ層の上に配置された有機膜、
前記有機膜の上側および下側にそれぞれ配置された上電極および下電極、および
前記有機膜の前記上側または前記下側に配置されたナノ構造を含む固体撮像素子。 - 前記カラーフィルタセグメントの間に配置されたグリッド構造をさらに含み、
前記グリッド構造の屈折率は、前記カラーフィルタ層の屈折率より低い請求項1に記載の固体撮像素子。 - 前記有機膜は有機セグメントを有し、前記グリッド構造は前記有機セグメントの間に配置され、前記グリッド構造の屈折率は、前記有機膜の屈折率より低い請求項2に記載の固体撮像素子。
- 前記有機膜は有機セグメントを有し、前記分離構造は前記カラーフィルタセグメントの間に配置され、前記分離構造は前記有機セグメントの間に配置される請求項1又は2に記載の固体撮像素子。
- 前記有機膜は有機セグメントを有し、前記各有機セグメントのナノ構造の長さは、200μmから500μmの間である請求項1~4のいずれか一項に記載の固体撮像素子。
- 前記ナノ構造は、前記有機膜の内部に配置される請求項1~5のいずれか一項に記載の固体撮像素子。
- 前記ナノ構造は、前記上電極の上側に配置される請求項1~5のいずれか一項に記載の固体撮像素子。
- 前記下電極は、前記光電変換素子に対応する電極セグメントを有し、前記電極セグメントの1つは、前記カラーフィルタセグメントの1つに対応する第1の電極セグメントおよび第2の電極セグメントを含み、前記第1の電極セグメントの長さは、前記第2の電極セグメントの長さと異なる請求項1~7いずれか一項に記載の固体撮像素子。
- 前記有機膜は有機セグメントを有し、前記第1の電極セグメントおよび前記第2の電極セグメントは、前記有機セグメントの特定の有機セグメントの下側に配置され、前記特定の有機セグメントの前記ナノ構造の長さは、前記第1の電極セグメントの長さに対応する請求項8に記載の固体撮像素子。
- 前記ナノ構造は前記上電極または前記下電極の一部である請求項1~9のいずれか一項に記載の固体撮像素子。
- 各前記ナノ構造は、三角錐、円錐、または四角錐に形成され、前記ナノ構造は、透明導電材料または金属を含む請求項1~10のいずれか一項に記載の固体撮像素子。
- 前記有機膜の上に配置された集光構造を含み、前記集光構造は、前記カラーフィルタセグメントに対応するマイクロレンズを含む請求項1~11のいずれか一項に記載の固体撮像素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17/466,297 US20230073737A1 (en) | 2021-09-03 | 2021-09-03 | Solid-state image sensor |
US17/466,297 | 2021-09-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023037557A true JP2023037557A (ja) | 2023-03-15 |
JP7357095B2 JP7357095B2 (ja) | 2023-10-05 |
Family
ID=79687145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022043525A Active JP7357095B2 (ja) | 2021-09-03 | 2022-03-18 | 固体撮像素子 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20230073737A1 (ja) |
EP (1) | EP4145514A1 (ja) |
JP (1) | JP7357095B2 (ja) |
CN (1) | CN115768150A (ja) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100670857B1 (ko) * | 2005-10-27 | 2007-01-19 | 한국과학기술연구원 | 블록 공중합체 나노템플레이트를 이용하여 제조된 전도성고분자 나노 구조 광전 변환 소자 및 그의 제조 방법 |
JP2010239003A (ja) * | 2009-03-31 | 2010-10-21 | Sony Corp | 反射防止構造体の製造方法および固体撮像装置の製造方法 |
JP2014127545A (ja) * | 2012-12-26 | 2014-07-07 | Sony Corp | 固体撮像素子およびこれを備えた固体撮像装置 |
JP2015050331A (ja) * | 2013-09-02 | 2015-03-16 | ソニー株式会社 | 固体撮像素子およびその製造方法、並びに電子機器 |
WO2017010262A1 (ja) * | 2015-07-10 | 2017-01-19 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、製造装置、製造方法 |
US20170357031A1 (en) * | 2016-06-09 | 2017-12-14 | Intel Corporation | Image sensor having photodetectors with reduced reflections |
JP2018133357A (ja) * | 2017-02-13 | 2018-08-23 | キヤノン株式会社 | 撮像素子、撮像装置 |
US20190371861A1 (en) * | 2018-06-05 | 2019-12-05 | Samsung Electronics Co., Ltd. | Image sensor |
US20200403025A1 (en) * | 2019-06-21 | 2020-12-24 | Samsung Electronics Co., Ltd. | Image sensor |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI700824B (zh) * | 2015-02-09 | 2020-08-01 | 日商索尼半導體解決方案公司 | 攝像元件及電子裝置 |
JP6914001B2 (ja) * | 2015-08-12 | 2021-08-04 | 株式会社ソニー・インタラクティブエンタテインメント | 撮像素子、イメージセンサ、撮像装置、および情報処理装置 |
WO2017159025A1 (ja) * | 2016-03-15 | 2017-09-21 | ソニー株式会社 | 光電変換素子および固体撮像装置 |
JP2017174936A (ja) * | 2016-03-23 | 2017-09-28 | ソニー株式会社 | 固体撮像素子及び電子機器 |
US10236461B2 (en) * | 2016-05-20 | 2019-03-19 | Samsung Electronics Co., Ltd. | Organic photoelectronic device and image sensor |
KR102612436B1 (ko) * | 2016-10-24 | 2023-12-08 | 삼성전자주식회사 | 광전 소자, 이미지 센서 및 전자 장치 |
WO2018173754A1 (ja) * | 2017-03-24 | 2018-09-27 | ソニーセミコンダクタソリューションズ株式会社 | 積層型撮像素子及び固体撮像装置 |
KR102421726B1 (ko) * | 2017-09-25 | 2022-07-15 | 삼성전자주식회사 | 이미지 센서 |
KR102424652B1 (ko) * | 2017-11-17 | 2022-07-25 | 삼성전자주식회사 | 이미지 센서 |
US11075242B2 (en) * | 2017-11-27 | 2021-07-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor devices for image sensing |
-
2021
- 2021-09-03 US US17/466,297 patent/US20230073737A1/en active Pending
-
2022
- 2022-01-15 EP EP22151695.8A patent/EP4145514A1/en active Pending
- 2022-03-18 JP JP2022043525A patent/JP7357095B2/ja active Active
- 2022-03-31 CN CN202210344634.3A patent/CN115768150A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100670857B1 (ko) * | 2005-10-27 | 2007-01-19 | 한국과학기술연구원 | 블록 공중합체 나노템플레이트를 이용하여 제조된 전도성고분자 나노 구조 광전 변환 소자 및 그의 제조 방법 |
JP2010239003A (ja) * | 2009-03-31 | 2010-10-21 | Sony Corp | 反射防止構造体の製造方法および固体撮像装置の製造方法 |
JP2014127545A (ja) * | 2012-12-26 | 2014-07-07 | Sony Corp | 固体撮像素子およびこれを備えた固体撮像装置 |
JP2015050331A (ja) * | 2013-09-02 | 2015-03-16 | ソニー株式会社 | 固体撮像素子およびその製造方法、並びに電子機器 |
WO2017010262A1 (ja) * | 2015-07-10 | 2017-01-19 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、製造装置、製造方法 |
US20170357031A1 (en) * | 2016-06-09 | 2017-12-14 | Intel Corporation | Image sensor having photodetectors with reduced reflections |
JP2018133357A (ja) * | 2017-02-13 | 2018-08-23 | キヤノン株式会社 | 撮像素子、撮像装置 |
US20190371861A1 (en) * | 2018-06-05 | 2019-12-05 | Samsung Electronics Co., Ltd. | Image sensor |
US20200403025A1 (en) * | 2019-06-21 | 2020-12-24 | Samsung Electronics Co., Ltd. | Image sensor |
Also Published As
Publication number | Publication date |
---|---|
EP4145514A1 (en) | 2023-03-08 |
JP7357095B2 (ja) | 2023-10-05 |
TW202312467A (zh) | 2023-03-16 |
CN115768150A (zh) | 2023-03-07 |
KR20230034833A (ko) | 2023-03-10 |
US20230073737A1 (en) | 2023-03-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5556122B2 (ja) | 固体撮像装置、固体撮像装置の製造方法、電子機器 | |
EP2595189B1 (en) | Solid-state imaging element, process for producing solid-state imaging element, and electronic device | |
USRE46836E1 (en) | Imaging device and method of manufacturing the same and electronic apparatus | |
JP5032954B2 (ja) | カラー撮像装置 | |
WO2016072281A1 (ja) | 固体撮像素子およびその製造方法、並びに電子機器 | |
WO2011142065A1 (ja) | 固体撮像装置及びその製造方法 | |
US7579209B2 (en) | Image sensor and fabricating method thereof | |
JP2012238774A (ja) | 撮像装置 | |
JP2004047682A (ja) | 固体撮像装置 | |
JP2013012518A (ja) | 固体撮像素子 | |
KR102492595B1 (ko) | 솔리드-스테이트 이미지 센서 | |
US20060138490A1 (en) | CMOS image sensor and method for fabricating the same | |
JP7357095B2 (ja) | 固体撮像素子 | |
JP2009124053A (ja) | 光電変換装置及びその製造方法 | |
KR101473720B1 (ko) | 컬러 필터 어레이 및 컬러 필터 제조 방법, 및 상기 컬러필터 어레이를 포함하는 이미지 촬상 장치 | |
JP2008058794A (ja) | カラーフィルタ用材料、カラーフィルタ、その製造方法、これを用いた固体撮像素子およびその製造方法 | |
KR102684014B1 (ko) | 솔리드-스테이트 이미지 센서 | |
TWI837597B (zh) | 固態影像感測器 | |
JP2014239081A (ja) | 固体撮像装置 | |
US11664399B2 (en) | Solid-state image sensor | |
JP2011165923A (ja) | カラー固体撮像素子およびその製造方法 | |
JP2023123331A (ja) | 固体撮像素子 | |
CN115642163A (zh) | 固态影像感测器 | |
JP2017092180A (ja) | 固体撮像素子及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220318 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230509 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230807 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230905 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230925 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7357095 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |