JP2022553203A5 - - Google Patents

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Publication number
JP2022553203A5
JP2022553203A5 JP2022522907A JP2022522907A JP2022553203A5 JP 2022553203 A5 JP2022553203 A5 JP 2022553203A5 JP 2022522907 A JP2022522907 A JP 2022522907A JP 2022522907 A JP2022522907 A JP 2022522907A JP 2022553203 A5 JP2022553203 A5 JP 2022553203A5
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JP
Japan
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approximately
mass
acid
composition according
pure
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JP2022522907A
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English (en)
Japanese (ja)
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JP2022553203A (ja
JP7664914B2 (ja
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Priority claimed from PCT/US2020/055647 external-priority patent/WO2021076676A1/en
Publication of JP2022553203A publication Critical patent/JP2022553203A/ja
Publication of JP2022553203A5 publication Critical patent/JP2022553203A5/ja
Application granted granted Critical
Publication of JP7664914B2 publication Critical patent/JP7664914B2/ja
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JP2022522907A 2019-10-17 2020-10-15 Euvマスク保護構造のためのエッチング組成物及び方法 Active JP7664914B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962916280P 2019-10-17 2019-10-17
US62/916,280 2019-10-17
PCT/US2020/055647 WO2021076676A1 (en) 2019-10-17 2020-10-15 Etching composition and method for euv mask protective structure

Publications (3)

Publication Number Publication Date
JP2022553203A JP2022553203A (ja) 2022-12-22
JP2022553203A5 true JP2022553203A5 (https=) 2023-10-23
JP7664914B2 JP7664914B2 (ja) 2025-04-18

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ID=75538878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022522907A Active JP7664914B2 (ja) 2019-10-17 2020-10-15 Euvマスク保護構造のためのエッチング組成物及び方法

Country Status (7)

Country Link
US (1) US20240103377A1 (https=)
EP (1) EP4045978A4 (https=)
JP (1) JP7664914B2 (https=)
KR (1) KR20220084146A (https=)
CN (1) CN114761878A (https=)
TW (1) TWI845778B (https=)
WO (1) WO2021076676A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102891405B1 (ko) * 2021-05-25 2025-11-27 주식회사 이엔에프테크놀로지 식각액 조성물
KR102898348B1 (ko) * 2021-05-28 2025-12-11 주식회사 이엔에프테크놀로지 식각액 조성물
KR102930934B1 (ko) * 2021-08-27 2026-02-25 주식회사 이엔에프테크놀로지 실리콘 선택적 식각액 조성물
JP7811855B2 (ja) * 2022-02-02 2026-02-06 関東化学株式会社 エッチング液組成物およびエッチング方法
JP7372501B1 (ja) * 2022-09-15 2023-10-31 日本碍子株式会社 Euv透過膜
KR20240052248A (ko) * 2022-10-14 2024-04-23 주식회사 이엔에프테크놀로지 실리콘 식각액 조성물 및 이를 이용한 식각 방법
WO2024241857A1 (ja) * 2023-05-24 2024-11-28 富士フイルム株式会社 エッチング液、半導体デバイスの製造方法

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US20090212021A1 (en) * 2005-06-13 2009-08-27 Advanced Technology Materials, Inc. Compositions and methods for selective removal of metal or metal alloy after metal silicide formation
KR100706822B1 (ko) * 2005-10-17 2007-04-12 삼성전자주식회사 절연 물질 제거용 조성물, 이를 이용한 절연막의 제거 방법및 기판의 재생 방법
US7666555B2 (en) 2006-12-29 2010-02-23 Intel Corporation Pellicle, methods of fabrication and methods of use for extreme ultraviolet lithography
WO2009032460A1 (en) * 2007-08-02 2009-03-12 Advanced Technology Materials, Inc. Non-fluoride containing composition for the removal of residue from a microelectronic device
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JP5980717B2 (ja) 2013-05-02 2016-08-31 富士フイルム株式会社 エッチング液、これを用いたエッチング方法、エッチング液のキット、および半導体基板製品の製造方法
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KR102675777B1 (ko) 2017-07-31 2024-06-18 삼성전자주식회사 포토마스크용 펠리클과 이를 포함하는 레티클 및 포토마스크용 펠리클의 제조방법
US10934485B2 (en) * 2017-08-25 2021-03-02 Versum Materials Us, Llc Etching solution for selectively removing silicon over silicon-germanium alloy from a silicon-germanium/ silicon stack during manufacture of a semiconductor device
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US11499236B2 (en) * 2018-03-16 2022-11-15 Versum Materials Us, Llc Etching solution for tungsten word line recess

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