JP2022540796A5 - - Google Patents

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Publication number
JP2022540796A5
JP2022540796A5 JP2021577578A JP2021577578A JP2022540796A5 JP 2022540796 A5 JP2022540796 A5 JP 2022540796A5 JP 2021577578 A JP2021577578 A JP 2021577578A JP 2021577578 A JP2021577578 A JP 2021577578A JP 2022540796 A5 JP2022540796 A5 JP 2022540796A5
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JP
Japan
Prior art keywords
circuit board
circuit
contact pad
hard substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021577578A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022540796A (ja
JP7578298B2 (ja
Filing date
Publication date
Priority claimed from GB1909557.9A external-priority patent/GB2585219A/en
Application filed filed Critical
Publication of JP2022540796A publication Critical patent/JP2022540796A/ja
Publication of JP2022540796A5 publication Critical patent/JP2022540796A5/ja
Application granted granted Critical
Publication of JP7578298B2 publication Critical patent/JP7578298B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2021577578A 2019-07-03 2020-06-30 回路構成要素を実装及び冷却する方法及び装置 Active JP7578298B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1909557.9A GB2585219A (en) 2019-07-03 2019-07-03 Method and apparatus for mounting and cooling a circuit component
GB1909557.9 2019-07-03
PCT/IB2020/056184 WO2021001757A1 (en) 2019-07-03 2020-06-30 Method and apparatus for mounting and cooling a circuit component

Publications (3)

Publication Number Publication Date
JP2022540796A JP2022540796A (ja) 2022-09-20
JP2022540796A5 true JP2022540796A5 (https=) 2023-07-03
JP7578298B2 JP7578298B2 (ja) 2024-11-06

Family

ID=67540115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021577578A Active JP7578298B2 (ja) 2019-07-03 2020-06-30 回路構成要素を実装及び冷却する方法及び装置

Country Status (7)

Country Link
US (2) US11764540B2 (https=)
EP (1) EP3994726B1 (https=)
JP (1) JP7578298B2 (https=)
KR (1) KR102796385B1 (https=)
CN (1) CN114008753A (https=)
GB (1) GB2585219A (https=)
WO (1) WO2021001757A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220329029A1 (en) * 2021-04-12 2022-10-13 St. Jude Medical, Cardiology Division, Inc. Method for bonding flexible electronic circuit elements
TWI824277B (zh) * 2021-08-06 2023-12-01 友達光電股份有限公司 顯示裝置及其製造方法
US20220225530A1 (en) * 2022-03-21 2022-07-14 Intel Corporation Fan on printed circuit board
CN118399188B (zh) * 2024-03-29 2025-04-04 武汉云岭光电股份有限公司 多通道光芯片封装方法以及多通道光模块

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2705658B2 (ja) * 1994-08-31 1998-01-28 日本電気株式会社 電子デバイス組立体およびその製造方法
JP3311899B2 (ja) * 1995-01-20 2002-08-05 松下電器産業株式会社 回路基板及びその製造方法
TW462121B (en) * 2000-09-19 2001-11-01 Siliconware Precision Industries Co Ltd Heat sink type ball grid array package
US6816385B1 (en) * 2000-11-16 2004-11-09 International Business Machines Corporation Compliant laminate connector
US6903929B2 (en) * 2003-03-31 2005-06-07 Intel Corporation Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink
JP2004335505A (ja) 2003-04-30 2004-11-25 Ibiden Co Ltd 多層プリント配線板
US7269017B2 (en) * 2004-11-19 2007-09-11 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices on laminate ceramic substrate
JP2006253225A (ja) 2005-03-08 2006-09-21 Denso Corp 回路基板、回路基板の製造方法、及び電子回路装置
JP4787195B2 (ja) 2007-03-26 2011-10-05 三菱樹脂株式会社 ビアホール充填用導電性ペースト組成物とそれを用いた多層配線基板
US20080241563A1 (en) 2007-03-30 2008-10-02 Khamvong Thammasouk Polymer substrate for electronic components
WO2009119904A1 (ja) * 2008-03-28 2009-10-01 日本電気株式会社 半導体装置、その製造方法、プリント回路基板および電子機器
TW201100711A (en) * 2009-06-30 2011-01-01 Power Light Tech Co Ltd Light emitting diode light source assembly with heat dissipation base
TWM381175U (en) * 2009-12-22 2010-05-21 Li-Yu Lin Improved ceramic radiator structure
US20130044431A1 (en) * 2011-08-18 2013-02-21 Harris Corporation Liquid cooling of stacked die through substrate lamination
US20130215586A1 (en) 2012-02-16 2013-08-22 Ibiden Co., Ltd. Wiring substrate
US8749043B2 (en) * 2012-03-01 2014-06-10 Taiwan Semiconductor Manufacturing Company, Ltd. Package on package structure
US9968012B2 (en) 2012-10-16 2018-05-08 Mitsubishi Materials Corporation Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing heat-sink-attached power module substrate
JP6130162B2 (ja) 2013-02-23 2017-05-17 京セラ株式会社 電子部品の製造方法
DE102013226972A1 (de) * 2013-12-20 2015-07-09 Zumtobel Lighting Gmbh Flexible Leiterplatte mit Kühlkörper
US20190267307A1 (en) * 2014-03-07 2019-08-29 Bridge Semiconductor Corp. Heat conductive wiring board and semiconductor assembly using the same
TWI581389B (zh) * 2014-05-22 2017-05-01 精材科技股份有限公司 半導體結構及其製造方法
US10553358B2 (en) * 2016-04-29 2020-02-04 The Regents Of The University Of California Electronic substrates and interposers made from nanoporous films
US10573579B2 (en) * 2017-03-08 2020-02-25 Mediatek Inc. Semiconductor package with improved heat dissipation
DE102017207684A1 (de) * 2017-05-08 2018-11-08 Robert Bosch Gmbh Anordnung mit einer Leiterplatte und einem Halbleiterbauelement

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