JP2022529066A5 - - Google Patents
Info
- Publication number
- JP2022529066A5 JP2022529066A5 JP2021561950A JP2021561950A JP2022529066A5 JP 2022529066 A5 JP2022529066 A5 JP 2022529066A5 JP 2021561950 A JP2021561950 A JP 2021561950A JP 2021561950 A JP2021561950 A JP 2021561950A JP 2022529066 A5 JP2022529066 A5 JP 2022529066A5
- Authority
- JP
- Japan
- Prior art keywords
- material layer
- organic solvent
- patterned
- use according
- additive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19169513.9 | 2019-04-16 | ||
| EP19169513 | 2019-04-16 | ||
| PCT/EP2020/059580 WO2020212173A1 (en) | 2019-04-16 | 2020-04-03 | Composition for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below comprising a boron-type additive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022529066A JP2022529066A (ja) | 2022-06-16 |
| JP2022529066A5 true JP2022529066A5 (enExample) | 2023-04-14 |
Family
ID=66217771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021561950A Pending JP2022529066A (ja) | 2019-04-16 | 2020-04-03 | ホウ素タイプの添加剤を含む、50nm以下のライン間寸法を有するパターン化材料を処理する際のパターンの崩壊を回避するための組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20220187712A1 (enExample) |
| EP (1) | EP3956729A1 (enExample) |
| JP (1) | JP2022529066A (enExample) |
| KR (1) | KR20210154971A (enExample) |
| CN (1) | CN113574460A (enExample) |
| IL (1) | IL287201A (enExample) |
| TW (1) | TW202104572A (enExample) |
| WO (1) | WO2020212173A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112135899B (zh) * | 2018-05-25 | 2022-10-25 | 巴斯夫欧洲公司 | 包含溶剂混合物的组合物用于处理图案化材料时避免图案坍塌的用途 |
| WO2022008306A1 (en) * | 2020-07-09 | 2022-01-13 | Basf Se | Composition comprising a siloxane and an alkane for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below |
| KR20250109768A (ko) * | 2023-01-10 | 2025-07-17 | 후지필름 가부시키가이샤 | 약액, 약액 수용체 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2434118A1 (fr) * | 1978-06-19 | 1980-03-21 | Charbonnages Ste Chimique | Solutions d'anhydride borique et leur utilisation comme durcisseurs de resols |
| US7767657B2 (en) * | 2005-02-16 | 2010-08-03 | Anacor Pharmaceuticals, Inc. | Boron-containing small molecules |
| US20080299487A1 (en) | 2007-05-31 | 2008-12-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography material and lithography process |
| CN103081072A (zh) | 2010-08-27 | 2013-05-01 | 高级技术材料公司 | 预防干燥期间高纵横比结构崩塌的方法 |
| US8828144B2 (en) * | 2010-12-28 | 2014-09-09 | Central Grass Company, Limited | Process for cleaning wafers |
| US9236256B2 (en) * | 2011-01-25 | 2016-01-12 | Basf Se | Use of surfactants having at least three short-chain perfluorinated groups RF for manufacturing integrated circuits having patterns with line-space dimensions below 50 NM |
| JP5681560B2 (ja) * | 2011-05-17 | 2015-03-11 | 東京エレクトロン株式会社 | 基板乾燥方法及び基板処理装置 |
| JP5806645B2 (ja) * | 2012-06-12 | 2015-11-10 | 株式会社東芝 | 基板の乾燥方法、電子装置の製造方法及び基板の乾燥装置 |
| HK1259443A1 (zh) * | 2015-09-24 | 2019-11-29 | Board Of Trustees Of Michigan State University | 用於生产生物基对苯二甲酸、间苯二甲酸和聚(对苯二甲酸乙二醇酯)的硼基环加成催化剂和方法 |
| WO2019086374A1 (en) | 2017-11-03 | 2019-05-09 | Basf Se | Use of compositions comprising a siloxane-type additive for avoiding pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below |
| CN108565124B (zh) * | 2018-03-27 | 2019-12-31 | 天津理工大学 | 一种基于掺硼石墨烯/掺硼金刚石复合电极的钠离子超级电容器的制备方法 |
| JP7077184B2 (ja) * | 2018-08-30 | 2022-05-30 | キオクシア株式会社 | 基板処理方法及び半導体装置の製造方法 |
-
2020
- 2020-04-03 CN CN202080020797.5A patent/CN113574460A/zh active Pending
- 2020-04-03 EP EP20715884.1A patent/EP3956729A1/en not_active Withdrawn
- 2020-04-03 KR KR1020217032642A patent/KR20210154971A/ko not_active Withdrawn
- 2020-04-03 US US17/603,250 patent/US20220187712A1/en not_active Abandoned
- 2020-04-03 WO PCT/EP2020/059580 patent/WO2020212173A1/en not_active Ceased
- 2020-04-03 JP JP2021561950A patent/JP2022529066A/ja active Pending
- 2020-04-14 TW TW109112484A patent/TW202104572A/zh unknown
-
2021
- 2021-10-12 IL IL287201A patent/IL287201A/en unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018507933A5 (enExample) | ||
| JP5593466B1 (ja) | レジスト剥離液 | |
| JP2006350325A5 (enExample) | ||
| JP2019050365A (ja) | 半導体デバイスの製造中にシリコン−ゲルマニウム/シリコン積層体からシリコン−ゲルマニウム合金を選択的に除去するためのエッチング液 | |
| JP2006515933A5 (enExample) | ||
| JP2010529036A5 (enExample) | ||
| CN109837089B (zh) | 绝缘层蚀刻剂组合物和使用其形成图案的方法 | |
| CN102206559A (zh) | 洗涤组合物、洗涤方法和半导体装置的制造方法 | |
| TWI553042B (zh) | 圖型反轉膜形成用組成物及反轉圖型形成方法 | |
| TW201522539A (zh) | 抗蝕圖型所塗佈之塗佈液及反轉圖型之形成方法 | |
| KR102409538B1 (ko) | 갭 충전 조성물 및 저분자량 화합물을 사용하는 패턴 형성 방법 | |
| KR101945211B1 (ko) | 에칭 방법, 이것에 이용되는 에칭액, 및 이것을 이용한 반도체 소자의 제조 방법 | |
| JP2017215561A (ja) | ギャップフィリング組成物、およびポリマーを含んでなる組成物を用いたパターン形成方法 | |
| JP2015535813A5 (enExample) | ||
| TW201418911A (zh) | 非水系洗淨液及矽基板之蝕刻加工方法 | |
| JP2019535136A5 (enExample) | ||
| TW201610613A (zh) | 用於移除光阻的剝離劑組成物及使用其的光阻剝離方法 | |
| JP2000075506A (ja) | フォトレジスト用のストリッパ―組成物 | |
| KR101008373B1 (ko) | 포토레지스트 스트리퍼 조성물 및 이를 이용한 포토레지스트 박리방법 | |
| TW201931029A (zh) | 用於移除乾膜光阻的剝離組成物及使用所述組成物的剝離方法 | |
| EP3247784A1 (en) | Solutions and processes for removing substances from substrates | |
| JP2011524908A5 (enExample) | ||
| JP2023184588A5 (enExample) | ||
| JP2019066732A (ja) | フォトレジスト剥離液 | |
| KR102469799B1 (ko) | 절연막 식각액 조성물 및 이를 이용한 패턴 형성 방법 |