JP2022521860A5 - - Google Patents
Info
- Publication number
- JP2022521860A5 JP2022521860A5 JP2021571641A JP2021571641A JP2022521860A5 JP 2022521860 A5 JP2022521860 A5 JP 2022521860A5 JP 2021571641 A JP2021571641 A JP 2021571641A JP 2021571641 A JP2021571641 A JP 2021571641A JP 2022521860 A5 JP2022521860 A5 JP 2022521860A5
- Authority
- JP
- Japan
- Prior art keywords
- transportable
- rack
- transportable wafer
- vtm
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962807612P | 2019-02-19 | 2019-02-19 | |
| US62/807,612 | 2019-02-19 | ||
| PCT/US2020/018786 WO2020172244A1 (en) | 2019-02-19 | 2020-02-19 | Automated batch production thin film deposition systems and methods of using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022521860A JP2022521860A (ja) | 2022-04-12 |
| JP2022521860A5 true JP2022521860A5 (enExample) | 2023-02-15 |
| JP7573549B2 JP7573549B2 (ja) | 2024-10-25 |
Family
ID=72143899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021571641A Active JP7573549B2 (ja) | 2019-02-19 | 2020-02-19 | 自動バッチ生産の薄膜付着システム及びその使用方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12400894B2 (enExample) |
| EP (1) | EP3918106A4 (enExample) |
| JP (1) | JP7573549B2 (enExample) |
| KR (1) | KR102872606B1 (enExample) |
| CN (1) | CN113474485A (enExample) |
| SG (1) | SG11202108920SA (enExample) |
| TW (1) | TWI842835B (enExample) |
| WO (1) | WO2020172244A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102411440B1 (ko) * | 2021-10-21 | 2022-06-22 | 주식회사 기가레인 | 웨이퍼 처리 시스템 및 웨이퍼 처리 방법 |
| JP7429252B2 (ja) * | 2022-03-18 | 2024-02-07 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法、基板処理方法及びプログラム |
| CN115458441A (zh) * | 2022-09-19 | 2022-12-09 | 上海谙邦半导体设备有限公司 | 一种等离子体去胶装置 |
| DE102023128552A1 (de) * | 2023-10-18 | 2025-04-24 | Aixtron Se | Be- und Entladezyklus für ein CVD-Reaktorsystem |
| WO2025083109A2 (de) | 2023-10-18 | 2025-04-24 | Aixtron Se | Be- und entladezyklus für ein cvd-reaktorsystem |
| CN117976592A (zh) * | 2024-02-18 | 2024-05-03 | 上海稷以科技有限公司 | 晶圆传送平台及方法 |
| CN118516764B (zh) * | 2024-05-15 | 2024-10-25 | 国鲸合创(青岛)科技有限公司 | 蓝宝石基掺铝氧化锌透明导电单晶薄膜材料生产成套设备 |
| CN119265549B (zh) * | 2024-09-30 | 2025-09-26 | 苏州精材半导体科技有限公司 | 连续式化学气相沉积方法、系统、程序和存储介质 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62222625A (ja) * | 1986-03-25 | 1987-09-30 | Shimizu Constr Co Ltd | 半導体製造装置 |
| US5186594A (en) | 1990-04-19 | 1993-02-16 | Applied Materials, Inc. | Dual cassette load lock |
| US5516732A (en) | 1992-12-04 | 1996-05-14 | Sony Corporation | Wafer processing machine vacuum front end method and apparatus |
| US6712577B2 (en) | 1994-04-28 | 2004-03-30 | Semitool, Inc. | Automated semiconductor processing system |
| US20010052392A1 (en) * | 1998-02-25 | 2001-12-20 | Masahiko Nakamura | Multichamber substrate processing apparatus |
| JP4386983B2 (ja) | 1998-02-25 | 2009-12-16 | キヤノンアネルバ株式会社 | 基板処理装置、マルチチャンバー基板処理装置及び電子デバイス製作方法 |
| US20020159864A1 (en) | 2001-04-30 | 2002-10-31 | Applied Materials, Inc. | Triple chamber load lock |
| KR100443121B1 (ko) | 2001-11-29 | 2004-08-04 | 삼성전자주식회사 | 반도체 공정의 수행 방법 및 반도체 공정 장치 |
| JP2005203458A (ja) | 2004-01-14 | 2005-07-28 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| KR20070089197A (ko) | 2004-11-22 | 2007-08-30 | 어플라이드 머티어리얼스, 인코포레이티드 | 배치 처리 챔버를 사용한 기판 처리 기기 |
| TWI476855B (zh) * | 2006-05-03 | 2015-03-11 | 吉恩股份有限公司 | 基板傳輸設備、和使用該設備的高速基板處理系統 |
| KR100814238B1 (ko) * | 2006-05-03 | 2008-03-17 | 위순임 | 기판 반송 장치 및 이를 이용한 기판 처리 시스템 |
| US7833351B2 (en) | 2006-06-26 | 2010-11-16 | Applied Materials, Inc. | Batch processing platform for ALD and CVD |
| US7661544B2 (en) * | 2007-02-01 | 2010-02-16 | Tokyo Electron Limited | Semiconductor wafer boat for batch processing |
| US9328417B2 (en) | 2008-11-01 | 2016-05-03 | Ultratech, Inc. | System and method for thin film deposition |
| US9175388B2 (en) | 2008-11-01 | 2015-11-03 | Ultratech, Inc. | Reaction chamber with removable liner |
| JP5274339B2 (ja) * | 2009-03-30 | 2013-08-28 | 大日本スクリーン製造株式会社 | 基板処理装置および基板搬送方法 |
| KR101167947B1 (ko) | 2010-03-19 | 2012-07-23 | (주) 엔피홀딩스 | 스퍼터링 시스템 |
| US20110232569A1 (en) | 2010-03-25 | 2011-09-29 | Applied Materials, Inc. | Segmented substrate loading for multiple substrate processing |
| TWI624897B (zh) * | 2013-03-15 | 2018-05-21 | Applied Materials, Inc. | 多位置批次負載鎖定裝置與系統，以及包括該裝置與系統的方法 |
| DE202016104588U1 (de) * | 2015-09-03 | 2016-11-30 | Veeco Instruments Inc. | Mehrkammersystem für chemische Gasphasenabscheidung |
| JP6775533B2 (ja) | 2016-02-05 | 2020-10-28 | 株式会社国際電気セミコンダクターサービス | 基板処理装置、半導体装置の製造方法、基板保持具、および小型保持具 |
-
2020
- 2020-02-19 EP EP20759383.1A patent/EP3918106A4/en active Pending
- 2020-02-19 JP JP2021571641A patent/JP7573549B2/ja active Active
- 2020-02-19 US US17/310,680 patent/US12400894B2/en active Active
- 2020-02-19 WO PCT/US2020/018786 patent/WO2020172244A1/en not_active Ceased
- 2020-02-19 TW TW109105377A patent/TWI842835B/zh active
- 2020-02-19 KR KR1020217029311A patent/KR102872606B1/ko active Active
- 2020-02-19 CN CN202080014430.2A patent/CN113474485A/zh active Pending
- 2020-02-19 SG SG11202108920SA patent/SG11202108920SA/en unknown
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