JP2022506331A - 層状構造の電気機械変換器 - Google Patents

層状構造の電気機械変換器 Download PDF

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Publication number
JP2022506331A
JP2022506331A JP2021523646A JP2021523646A JP2022506331A JP 2022506331 A JP2022506331 A JP 2022506331A JP 2021523646 A JP2021523646 A JP 2021523646A JP 2021523646 A JP2021523646 A JP 2021523646A JP 2022506331 A JP2022506331 A JP 2022506331A
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JP
Japan
Prior art keywords
layer
electromechanical
layers
electromechanical transducer
sensor
Prior art date
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Pending
Application number
JP2021523646A
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English (en)
Japanese (ja)
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JP2022506331A5 (https=
JPWO2020094559A5 (https=
Inventor
ペトリセヴィック・ライノ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Indtact GmbH
Original Assignee
Indtact GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Indtact GmbH filed Critical Indtact GmbH
Publication of JP2022506331A publication Critical patent/JP2022506331A/ja
Publication of JP2022506331A5 publication Critical patent/JP2022506331A5/ja
Publication of JPWO2020094559A5 publication Critical patent/JPWO2020094559A5/ja
Priority to JP2024112512A priority Critical patent/JP2024153687A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H04R17/02—Microphones
    • H04R17/025—Microphones using a piezoelectric polymer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Measuring Fluid Pressure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Micromachines (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Pressure Sensors (AREA)
JP2021523646A 2018-11-06 2019-11-04 層状構造の電気機械変換器 Pending JP2022506331A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024112512A JP2024153687A (ja) 2018-11-06 2024-07-12 層状構造の電気機械変換器

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018127651.6A DE102018127651A1 (de) 2018-11-06 2018-11-06 Elektromechanischer Wandler mit einem Schichtaufbau
DE102018127651.6 2018-11-06
PCT/EP2019/080081 WO2020094559A1 (de) 2018-11-06 2019-11-04 Elektromechanischer wandler mit einem schichtaufbau

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024112512A Division JP2024153687A (ja) 2018-11-06 2024-07-12 層状構造の電気機械変換器

Publications (3)

Publication Number Publication Date
JP2022506331A true JP2022506331A (ja) 2022-01-17
JP2022506331A5 JP2022506331A5 (https=) 2022-05-26
JPWO2020094559A5 JPWO2020094559A5 (https=) 2022-05-26

Family

ID=68468725

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021523646A Pending JP2022506331A (ja) 2018-11-06 2019-11-04 層状構造の電気機械変換器
JP2024112512A Pending JP2024153687A (ja) 2018-11-06 2024-07-12 層状構造の電気機械変換器

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024112512A Pending JP2024153687A (ja) 2018-11-06 2024-07-12 層状構造の電気機械変換器

Country Status (7)

Country Link
US (1) US12137615B2 (https=)
EP (1) EP3853915B1 (https=)
JP (2) JP2022506331A (https=)
KR (1) KR102827418B1 (https=)
CN (1) CN113039656B (https=)
DE (1) DE102018127651A1 (https=)
WO (1) WO2020094559A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025037302A (ja) * 2023-09-06 2025-03-18 株式会社村田製作所 電子機器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020107028B4 (de) 2020-03-13 2022-12-29 Technische Universität Chemnitz Piezoelektrische Vorrichtung und Verfahren zu deren Herstellung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1114478A (ja) * 1997-06-26 1999-01-22 Matsushita Electric Ind Co Ltd 圧力検出装置
JP2003346556A (ja) * 2002-05-24 2003-12-05 Sumitomo Electric Ind Ltd 異方導電材料
JP2008135886A (ja) * 2006-11-27 2008-06-12 Matsushita Electric Works Ltd Ｂａｗ共振器の製造方法
JP2013048233A (ja) * 2011-08-17 2013-03-07 Boeing Co:The Ｐｚｔナノ粒子インクベースの圧電センサを製作する方法およびシステム
JP2014170863A (ja) * 2013-03-05 2014-09-18 Sekisui Chem Co Ltd 圧電センサの製造方法
CN104881193A (zh) * 2015-06-02 2015-09-02 南昌欧菲光科技有限公司 触控显示装置、压力触控单元及其制作方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2375175A (en) 2001-05-03 2002-11-06 Electro Mechanical Assembly Lt Peizoelectric device for detecting or measuring the bending of objects
DE10136402C2 (de) * 2001-07-26 2003-07-31 Fraunhofer Ges Forschung Physikalisch aktives Pflaster und Verfahren zur Herstellung
JP4617078B2 (ja) * 2003-12-08 2011-01-19 北陸電気工業株式会社 積層圧電体及び圧電型振動素子
US20080202664A1 (en) * 2007-02-27 2008-08-28 Iptrade, Inc. Method of manufacturing a piezoelectric package having a composite structure
US7858440B2 (en) * 2007-09-21 2010-12-28 Infineon Technologies Ag Stacked semiconductor chips
EP2144290A1 (en) 2008-07-08 2010-01-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Electronic device and method of manufacturing the same
US7656076B1 (en) * 2008-07-15 2010-02-02 Iptrade, Inc. Unimorph/bimorph piezoelectric package
DE102010013565A1 (de) 2010-03-30 2012-01-19 Fludicon Gmbh Elektromechanischer Wandler und Verfahren zur Herstellung des elektromechanischen Wandlers
DE102010041129A1 (de) * 2010-09-21 2012-03-22 Robert Bosch Gmbh Multifunktionssensor als PoP-mWLP
DE102011086042A1 (de) * 2011-11-09 2013-05-16 Johnson Matthey Catalysts (Germany) Gmbh Biegewandler sowie Mikropumpe mit einem Biegewandler
JP2014169945A (ja) * 2013-03-04 2014-09-18 Sekisui Chem Co Ltd 圧電センサ
WO2015041049A1 (ja) 2013-09-20 2015-03-26 株式会社村田製作所 圧電センサ
DE102016214607B4 (de) * 2016-08-05 2023-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektronisches Modul und Verfahren zu seiner Herstellung
JP6764759B2 (ja) * 2016-10-28 2020-10-07 日本特殊陶業株式会社 圧電アクチュエータ
JP2017034290A (ja) * 2016-11-16 2017-02-09 タツタ電線株式会社 圧電フィルム積層体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1114478A (ja) * 1997-06-26 1999-01-22 Matsushita Electric Ind Co Ltd 圧力検出装置
JP2003346556A (ja) * 2002-05-24 2003-12-05 Sumitomo Electric Ind Ltd 異方導電材料
JP2008135886A (ja) * 2006-11-27 2008-06-12 Matsushita Electric Works Ltd Ｂａｗ共振器の製造方法
JP2013048233A (ja) * 2011-08-17 2013-03-07 Boeing Co:The Ｐｚｔナノ粒子インクベースの圧電センサを製作する方法およびシステム
JP2014170863A (ja) * 2013-03-05 2014-09-18 Sekisui Chem Co Ltd 圧電センサの製造方法
CN104881193A (zh) * 2015-06-02 2015-09-02 南昌欧菲光科技有限公司 触控显示装置、压力触控单元及其制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025037302A (ja) * 2023-09-06 2025-03-18 株式会社村田製作所 電子機器

Also Published As

Publication number Publication date
EP3853915B1 (de) 2022-11-30
WO2020094559A1 (de) 2020-05-14
CN113039656A (zh) 2021-06-25
US12137615B2 (en) 2024-11-05
KR20210084623A (ko) 2021-07-07
CN113039656B (zh) 2025-02-07
DE102018127651A1 (de) 2020-05-07
US20210343926A1 (en) 2021-11-04
BR112021007772A2 (pt) 2021-07-27
EP3853915A1 (de) 2021-07-28
JP2024153687A (ja) 2024-10-29
KR102827418B1 (ko) 2025-07-01

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