Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
  • H10N30/302—Sensors
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
  • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
  • H04R17/02—Microphones
  • H04R17/025—Microphones using a piezoelectric polymer
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/01—Manufacture or treatment
  • H10N30/02—Forming enclosures or casings
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/80—Constructional details
  • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
  • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N30/00—Piezoelectric or electrostrictive devices
  • H10N30/80—Constructional details
  • H10N30/88—Mounts; Supports; Enclosures; Casings
  • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings

Definitions

• the invention relates to an electromechanical transducer with a layer structure.
• EP 2 372 802 A2 describes an electromechanical transducer which comprises at least a lower support layer, an electrical and / or electromechanical functional element arranged thereon, and a cover layer which has electrical contacts which are connected to the functional element.
• the invention is therefore based on the object of specifying an electromechanical transducer which is suitable for production on an industrial scale and works robustly and reliably.
• an associated retrieval process is to be specified.
• An electromechanical transducer with the features of claim 1 is provided to achieve this object.
• the electromechanical transducer according to the invention has a layer structure which, in this order, comprises the following:
• a first layer which has at least one outwardly isolated structured electrically conductive region which acts as electrical shielding in at least one plane
• a second layer which serves as an adhesive layer and is at least selectively electrically conductive
• a fourth layer which serves as an adhesive layer and is at least selectively electrically conductive
• a fifth layer which has at least one outwardly isolated structured electrically conductive region which acts as an electrical shield in at least one plane.
• the electromechanical transducer according to the invention is characterized in that it can be easily and inexpensively manufactured in large numbers due to its layer structure.
• the outer layers, i.e. H. the first layer and the fifth layer serve in particular to shield the electromechanical functional element, so that it cannot be disturbed by external influences such as electromagnetic fields.
• Another advantage can be seen in the fact that the electromechanical transducer according to the invention is comparatively easy to manufacture due to the layer structure.
• a plurality of electromechanical transducers can be produced by superimposing the individual layers in a single process, in which the layer structure (benefit) is subsequently divided, whereby the individual transducers are obtained.
• the second layer and the fourth layer serve as an adhesive layer, which in this way covers the two adjacent layers, i. H. connect the first layer and the third layer or the third layer and the fifth layer to one another. It is essential that both the second layer and the fourth layer are at least selectively electrically conductive. In this way, an electrical connection can be achieved across the various layers.
• the first layer and / or the fifth layer has or have contacting that is exposed on the outside.
• the contact can be used to connect an electrical connection element, for example a line. It is also within the scope of the invention that the contact is designed as a plug or a socket or as an electronic component. If the contacting is integrated in the electromechanical converter, the electrical connection is particularly simple.
• the contact can be designed, for example, like a memory card, for example an SD card, or like a SIM card for a mobile phone.
• each layer has at least one punctiform electrical contact or via, via which the layer is electrically conductively connected to an adjacent layer.
• an electrical signal perpendicular to the layer level can be transmitted to one or both outer layers in one or more times (redundantly).
• the second to fifth layer preferably has at least one electrically conductive connection to the first layer, directly or indirectly via a layer arranged between them.
• the contacting which is preferably arranged on the first layer, can be electrically connected to each individual layer, provided that this is necessary for the forwarding of a signal or for other reasons.
• a particularly robust construction of the electromechanical transducer results if two adjacent layers, preferably all adjacent layers, are bonded together. This means that all layers are firmly connected to each other, which results in a stable construction of the electromechanical transducer.
• the second and fourth layers as the adhesive layer can themselves consist of a polymer matrix or have a resin matrix.
• they can have an adhesive film, a thermoplastic film or a liquid or viscous adhesive.
• the cohesive connection connects a polymer surface with a polymer surface.
• the integral connection connects a metal surface with a metal surface or that the integral connection connects a polymer surface with a metal surface.
• the integral connection is preferably formed on at least 20% of the area of the electromechanical transducer from polymers, in particular from a resin matrix.
• the integral connection can be made using a resin matrix or a polymer-based adhesive.
• the adhesive can be adhesive-activated and / or cured by heating, if necessary under pressure.
• the functional element is designed as one of the following sensors: piezoelectric sensor, capacitive sensor, inductive sensor, conductivity sensor, resistive sensor, piezoresistive sensor, pyroelectric sensor, position sensor, gyrometer, Hall sensor Sensor, magnetometer, radar sensor, proximity sensor.
• sensors piezoelectric sensor, capacitive sensor, inductive sensor, conductivity sensor, resistive sensor, piezoresistive sensor, pyroelectric sensor, position sensor, gyrometer, Hall sensor Sensor, magnetometer, radar sensor, proximity sensor.
• structure-borne noise can be detected, for example. H. Vibrations of a body or a force, a stretch or a bend. From these measured values recorded by the sensors, further quantities can be derived or calculated. For example, structure-borne noise can also be recorded as an audio signal.
• the electromechanical converter according to the invention can have an electronic circuit with one or more of the following components: signal amplifier, filter, A / D converter, control unit for signal processing, data memory, wireless data transmission module, module for wireless transmission of energy, ASIC (application specific integrated circuit), DSP (digital signal processor), FPGA (Field Programmable Gate Array).
• ASIC application specific integrated circuit
• DSP digital signal processor
• FPGA Field Programmable Gate Array
• the electromechanical converter according to the invention has several identical or different ones stacked on top of one another Has layers.
• the order of the layers can be different.
• the stacked layers can be arranged symmetrically.
• At least one layer of the electromechanical transducer according to the invention can have a fiber-reinforced polymer.
• Such fiber-reinforced polymer can be put together particularly well to form a layer structure.
• the adhesive layer of the electromechanical transducer according to the invention can be electrically insulating at least in sections.
• An electrically conductive connection can be formed, for example, by an electrically conductive polymer, which has, for example, carbon fibers or silver particles as components.
• the electrical conductivity can also be present only at certain points, perpendicular to the layer plane, while the adhesive layer is insulated in the plane.
• Such a layer can contain an electronic component, a sensor or a further sensor, for example a temperature sensor, a position sensor, a torque sensor, an acceleration sensor or one or more of the above-mentioned electronic circuits.
• sensors and circuits can be connected simply and inexpensively by the invention. It is also possible to integrate a circuit board fully equipped with electronic components into the converter according to the invention.
• At least one layer can be thermally curable or hardened or self-adhesive. Furthermore, it is possible for the electromechanical transducer to have a plurality of layers having an electromechanical functional element. At least one layer of the electromechanical transducer preferably has a fiber-reinforced polymer.
• the adhesive layer is preferably designed to be electrically insulating, at least in sections and / or parallel to a plane defined by the adhesive layer.
• the invention relates to a method for producing an electromechanical converter, with the following steps:
• Providing a fifth layer which has at least one outwardly isolated, structured, electrically conductive area acting as an electrical shield in at least one plane.
• the layers are pressed together with the supply of heat.
• the layers can be pressed together for a few minutes or a few seconds or preferably only for fractions of a second.
• At least one layer is subjected to cleaning or surface activation before the pressing.
• Surface activation can take the form of a plasma treatment.
• a cold-curing adhesive a thermoplastic hot-melt adhesive or a thermoset structural adhesive can be used as the adhesive layer.
• FIG. 1 is a sectional view of a first embodiment of an electromechanical transducer according to the invention
• FIG. 2 shows a second exemplary embodiment of an electromechanical transducer according to the invention.
• FIG 3 shows a third exemplary embodiment of an electromechanical transducer according to the invention.
• Fig. 1 is a sectional view and shows an electromechanical transducer 1 with a layer structure.
• the electromechanical transducer 1 comprises a first layer 2 which has at least one outwardly isolated, structured, electrically conductive region 3 which acts as an electrical shield in at least one plane.
• the flat region 3 forms an outer layer which is electrically insulated from the outside of the electromechanical transducer 1.
• the first layer 2 comprises a further flat area 4 which is spaced apart from the flat area 3.
• the two planar regions 3, 4 are embedded in a polymer matrix 5 and are thus integrally connected to one another.
• the first layer 2 is followed by a second layer 6, which serves as an adhesive layer.
• the adhesive layer is electrically conductive at various points 7. At these points 7 there is electrical contact across the adhesive layer, ie from one side of the adhesive layer to the opposite side.
• a contact 8 extends from the second layer 6 serving as an adhesive layer perpendicular to the layer plane to the outside 9 of the electromechanical transducer 1. The contact 8 ends there in a contact 10. In FIG. 1 it can be seen that there are 9 more on the outside Contacts are available. Several Contacts 11 extend to the flat area 3.
• a contact 12 connects the outside 9 to the flat area 4.
• the electromechanical functional element is designed as a piezoelectric sensor 14.
• the sensor 14 makes use of the piezoelectric effect. When a mechanical pressure is applied, an electrical charge is generated that can be fed to an amplifier. The signal supplied by the piezoelectric sensor 14 can then be processed and evaluated.
• the fourth layer 15 serving as an adhesive layer which is constructed like the layer 6 serving as an adhesive layer.
• the layer 15 serving as an adhesive layer is selectively electrically conductive. For this purpose, there are contacts through the adhesive layer at several points 16.
• the layer 15 serving as an adhesive layer connects the third layer 13 and a fifth layer 17.
• the fifth layer 17 is basically constructed like the first layer 2. In one plane, it comprises a structured, electrically conductive region 18 which is insulated from the outside. In addition, the fifth layer 17 comprises a further planar region 19 which is spaced apart from the planar region 18 in the thickness direction.
• the two flat regions 18, 19 are embedded in a polymer matrix 20, analogous to the flat regions 3, 4 of the first layer 2.
• the contact 8 extends from the contact 10 on the outside 9 through the second layer 6 serving as an adhesive layer and the fourth layer 15 serving as an adhesive layer to the fifth layer 17, which is connected to the contact 10 in this way.
• the various contacts are used to electrically contact the electromechanical transducer 1 with external components, for example with an amplifier or with an evaluation circuit.
• the total of five layers of the electromechanical transducer 1 consist of a polymer or a fiber-reinforced polymer, with electrically conductive or electrically insulating regions being provided in the layer as required.
• Each layer has at least one electrically conductive contact at least at certain points, or a flat contact or a via, via which the respective layer is connected to one or more adjacent layers.
• the electromechanical transducer described in this exemplary embodiment can be easily manufactured in large quantities in an automated process.
• a panel is produced which comprises a large number of electromechanical transducers arranged in rows and columns. After the individual layers have been stacked, the pressing takes place under pressure. The benefits are then divided, creating the individual electromechanical transducers.
• FIG. 2 shows a second exemplary embodiment of an electromechanical transducer 21, which is similar to that in FIG. 1. Embodiment described converter is built. A detailed description of matching components is therefore not given here.
• the electromechanical transducer 21 comprises the first layer 2 with the flat region 3, which is insulated, structured and electrically conductive from the outside and serves as electrical shielding. This is followed by the second layer 6 serving as an adhesive layer.
• a third layer 22 comprises an electromechanical functional element which is designed as a sensor 14.
• a fourth layer 23 is used as the adhesive layer, which in the view of FIG. 2 is located on the side of the third layer 22 opposite the layer 6.
• a fifth layer 24 forms an outer side 25 opposite the outer side 9.
• the fifth layer 24 comprises an outwardly insulated, structured, electrically conductive region 26 which acts as an electrical shield.
• the electromechanical transducer 21 is constructed symmetrically. Accordingly, there are 2 identical sensors 14, each of which is provided with an adhesive layer on both sides.
• the fifth layer 24 is connected to the adhesive layer of the lower sensor in FIG. 2. There is an intermediate layer 27 between the two inner adhesive layers.
• FIG. 3 shows a further exemplary embodiment of an electromechanical transducer 28 which is constructed similarly to the electromechanical transducer shown in FIG. 2 and additionally has a shield similar to that of the exemplary embodiment shown in FIG. 1.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Physics & Mathematics (AREA)
• Acoustics & Sound (AREA)
• Signal Processing (AREA)
• Measuring Fluid Pressure (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
• Micromachines (AREA)
• Testing Or Calibration Of Command Recording Devices (AREA)
• General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
• Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
• Piezo-Electric Transducers For Audible Bands (AREA)
• Pressure Sensors (AREA)

Priority Applications (7)

Applications Claiming Priority (2)

Publications (1)

Family

ID=68468725

Family Applications (1)

Country Status (7)

Families Citing this family (2)

Citations (4)

Family Cites Families (17)

• 2018
  • 2018-11-06 DE DE102018127651.6A patent/DE102018127651A1/de not_active Withdrawn
• 2019
  • 2019-11-04 EP EP19798269.7A patent/EP3853915B1/de active Active
  • 2019-11-04 WO PCT/EP2019/080081 patent/WO2020094559A1/de not_active Ceased
  • 2019-11-04 JP JP2021523646A patent/JP2022506331A/ja active Pending
  • 2019-11-04 US US17/283,810 patent/US12137615B2/en active Active
  • 2019-11-04 KR KR1020217017118A patent/KR102827418B1/ko active Active
  • 2019-11-04 CN CN201980069501.6A patent/CN113039656B/zh active Active
• 2024
  • 2024-07-12 JP JP2024112512A patent/JP2024153687A/ja active Pending

Patent Citations (4)

Non-Patent Citations (1)

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