JP2022505395A5 - - Google Patents
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- Publication number
- JP2022505395A5 JP2022505395A5 JP2021521399A JP2021521399A JP2022505395A5 JP 2022505395 A5 JP2022505395 A5 JP 2022505395A5 JP 2021521399 A JP2021521399 A JP 2021521399A JP 2021521399 A JP2021521399 A JP 2021521399A JP 2022505395 A5 JP2022505395 A5 JP 2022505395A5
- Authority
- JP
- Japan
- Prior art keywords
- approximately
- bias
- watts
- substrate
- mhz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024049050A JP7778835B2 (ja) | 2018-10-26 | 2024-03-26 | パターニング応用のための高密度炭素膜 |
| JP2025145127A JP2026000945A (ja) | 2018-10-26 | 2025-09-02 | パターニング応用のための高密度炭素膜 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862751213P | 2018-10-26 | 2018-10-26 | |
| US62/751,213 | 2018-10-26 | ||
| PCT/US2019/054812 WO2020086241A1 (en) | 2018-10-26 | 2019-10-04 | High density carbon films for patterning applications |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024049050A Division JP7778835B2 (ja) | 2018-10-26 | 2024-03-26 | パターニング応用のための高密度炭素膜 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022505395A JP2022505395A (ja) | 2022-01-14 |
| JP2022505395A5 true JP2022505395A5 (cg-RX-API-DMAC7.html) | 2022-10-13 |
| JP7462626B2 JP7462626B2 (ja) | 2024-04-05 |
Family
ID=70327222
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021521399A Active JP7462626B2 (ja) | 2018-10-26 | 2019-10-04 | パターニング応用のための高密度炭素膜 |
| JP2024049050A Active JP7778835B2 (ja) | 2018-10-26 | 2024-03-26 | パターニング応用のための高密度炭素膜 |
| JP2025145127A Pending JP2026000945A (ja) | 2018-10-26 | 2025-09-02 | パターニング応用のための高密度炭素膜 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024049050A Active JP7778835B2 (ja) | 2018-10-26 | 2024-03-26 | パターニング応用のための高密度炭素膜 |
| JP2025145127A Pending JP2026000945A (ja) | 2018-10-26 | 2025-09-02 | パターニング応用のための高密度炭素膜 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11842897B2 (cg-RX-API-DMAC7.html) |
| JP (3) | JP7462626B2 (cg-RX-API-DMAC7.html) |
| KR (2) | KR102758013B1 (cg-RX-API-DMAC7.html) |
| CN (2) | CN120854258A (cg-RX-API-DMAC7.html) |
| SG (1) | SG11202101496WA (cg-RX-API-DMAC7.html) |
| TW (2) | TWI827705B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2020086241A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11202101496WA (en) * | 2018-10-26 | 2021-05-28 | Applied Materials Inc | High density carbon films for patterning applications |
| WO2022005700A1 (en) * | 2020-06-29 | 2022-01-06 | Applied Materials, Inc. | Methods for producing high-density doped-carbon films for hardmask and other patterning applications |
| US11421324B2 (en) * | 2020-10-21 | 2022-08-23 | Applied Materials, Inc. | Hardmasks and processes for forming hardmasks by plasma-enhanced chemical vapor deposition |
| US11694902B2 (en) * | 2021-02-18 | 2023-07-04 | Applied Materials, Inc. | Methods, systems, and apparatus for processing substrates using one or more amorphous carbon hardmask layers |
| JP7841233B2 (ja) * | 2021-10-26 | 2026-04-07 | 東京エレクトロン株式会社 | 基板に炭素含有膜を成膜する装置、及び方法 |
| TWI773628B (zh) * | 2022-01-19 | 2022-08-01 | 華邦電子股份有限公司 | 半導體結構及其形成方法 |
| US20250376761A1 (en) * | 2024-06-07 | 2025-12-11 | Applied Materials, Inc. | Method for forming high density carbon films with reduced substrate backside damage |
Family Cites Families (45)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5316795A (en) * | 1990-05-24 | 1994-05-31 | Houston Advanced Research Center | Halogen-assisted chemical vapor deposition of diamond |
| US5684669A (en) * | 1995-06-07 | 1997-11-04 | Applied Materials, Inc. | Method for dechucking a workpiece from an electrostatic chuck |
| MY132894A (en) | 1997-08-25 | 2007-10-31 | Ibm | Layered resist system using tunable amorphous carbon film as a bottom layer and methods of fabrication thereof |
| US6332961B1 (en) * | 1997-09-17 | 2001-12-25 | Tokyo Electron Limited | Device and method for detecting and preventing arcing in RF plasma systems |
| US6149730A (en) * | 1997-10-08 | 2000-11-21 | Nec Corporation | Apparatus for forming films of a semiconductor device, a method of manufacturing a semiconductor device, and a method of forming thin films of a semiconductor |
| US7004107B1 (en) | 1997-12-01 | 2006-02-28 | Applied Materials Inc. | Method and apparatus for monitoring and adjusting chamber impedance |
| US6291334B1 (en) * | 1997-12-19 | 2001-09-18 | Applied Materials, Inc. | Etch stop layer for dual damascene process |
| TW495553B (en) | 1999-08-27 | 2002-07-21 | Surftech Corp | Method for preparing diamond-like carbon film by cathode arc evaporation (CAE) |
| US6596465B1 (en) * | 1999-10-08 | 2003-07-22 | Motorola, Inc. | Method of manufacturing a semiconductor component |
| US20030107865A1 (en) * | 2000-12-11 | 2003-06-12 | Shinsuke Masuda | Wafer handling apparatus and method of manufacturing the same |
| WO2002081771A2 (en) * | 2001-04-05 | 2002-10-17 | Angstron Systems, Inc. | Atomic layer deposition system and method |
| US20050130620A1 (en) * | 2003-12-16 | 2005-06-16 | Andreas Fischer | Segmented radio frequency electrode apparatus and method for uniformity control |
| US20070031609A1 (en) * | 2005-07-29 | 2007-02-08 | Ajay Kumar | Chemical vapor deposition chamber with dual frequency bias and method for manufacturing a photomask using the same |
| US20100211180A1 (en) * | 2006-03-21 | 2010-08-19 | Jet Engineering, Inc. | Tetrahedral Amorphous Carbon Coated Medical Devices |
| KR100867123B1 (ko) | 2007-04-03 | 2008-11-06 | 삼성전자주식회사 | 반도체소자의 식각방법 |
| US20090029067A1 (en) * | 2007-06-28 | 2009-01-29 | Sciamanna Steven F | Method for producing amorphous carbon coatings on external surfaces using diamondoid precursors |
| US8962101B2 (en) * | 2007-08-31 | 2015-02-24 | Novellus Systems, Inc. | Methods and apparatus for plasma-based deposition |
| US8133819B2 (en) | 2008-02-21 | 2012-03-13 | Applied Materials, Inc. | Plasma etching carbonaceous layers with sulfur-based etchants |
| US20090246243A1 (en) * | 2008-03-25 | 2009-10-01 | La Corporation De I'ecole Polytechnique | Carbonaceous Protective Multifunctional Coatings |
| WO2010019430A2 (en) | 2008-08-12 | 2010-02-18 | Applied Materials, Inc. | Electrostatic chuck assembly |
| JP5960384B2 (ja) * | 2009-10-26 | 2016-08-02 | 新光電気工業株式会社 | 静電チャック用基板及び静電チャック |
| JP2011162830A (ja) | 2010-02-09 | 2011-08-25 | Fuji Electric Co Ltd | プラズマcvdによる成膜方法、成膜済基板および成膜装置 |
| US8361906B2 (en) | 2010-05-20 | 2013-01-29 | Applied Materials, Inc. | Ultra high selectivity ashable hard mask film |
| KR20120121340A (ko) | 2011-04-26 | 2012-11-05 | 삼성전자주식회사 | 유도결합 플라즈마를 이용한 탄소계 하드 마스크막 제조 방법 및 이를 이용한 패턴 형성 방법 |
| US20120276743A1 (en) | 2011-04-26 | 2012-11-01 | Jai-Hyung Won | Methods of forming a carbon type hard mask layer using induced coupled plasma and methods of forming patterns using the same |
| TW201309836A (zh) | 2011-08-24 | 2013-03-01 | Ritedia Corp | 似鑽碳膜及其製備方法 |
| US8679987B2 (en) * | 2012-05-10 | 2014-03-25 | Applied Materials, Inc. | Deposition of an amorphous carbon layer with high film density and high etch selectivity |
| US9362133B2 (en) | 2012-12-14 | 2016-06-07 | Lam Research Corporation | Method for forming a mask by etching conformal film on patterned ashable hardmask |
| JP2014154866A (ja) * | 2013-02-14 | 2014-08-25 | Fujifilm Corp | ドライエッチング装置及びドライエッチング装置用のクランプ |
| US20150371851A1 (en) | 2013-03-15 | 2015-12-24 | Applied Materials, Inc. | Amorphous carbon deposition process using dual rf bias frequency applications |
| EP3056069A4 (en) * | 2013-10-07 | 2017-06-21 | Aeonclad Coatings, LLC | Low-cost plasma reactor |
| US20150200094A1 (en) * | 2014-01-10 | 2015-07-16 | Applied Materials, Inc. | Carbon film stress relaxation |
| US20150333213A1 (en) * | 2014-05-19 | 2015-11-19 | Applied Materials, Inc. | Diamond-like carbon coatings for substrate carriers |
| US20170117174A1 (en) * | 2014-06-17 | 2017-04-27 | Evatec Ag | Electro-static chuck with radiofrequency shunt |
| US10418243B2 (en) * | 2015-10-09 | 2019-09-17 | Applied Materials, Inc. | Ultra-high modulus and etch selectivity boron-carbon hardmask films |
| US12217949B2 (en) * | 2015-12-21 | 2025-02-04 | Ionquest Corp. | Magnetically enhanced high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films |
| US10249495B2 (en) | 2016-06-28 | 2019-04-02 | Applied Materials, Inc. | Diamond like carbon layer formed by an electron beam plasma process |
| WO2018022142A1 (en) * | 2016-07-29 | 2018-02-01 | Applied Materials, Inc. | Performing decoupled plasma fluorination to reduce interfacial defects in film stack |
| US20180277340A1 (en) * | 2017-03-24 | 2018-09-27 | Yang Yang | Plasma reactor with electron beam of secondary electrons |
| US10544505B2 (en) * | 2017-03-24 | 2020-01-28 | Applied Materials, Inc. | Deposition or treatment of diamond-like carbon in a plasma reactor |
| WO2018226370A1 (en) | 2017-06-08 | 2018-12-13 | Applied Materials, Inc. | High-density low temperature carbon films for hardmask and other patterning applications |
| US11043375B2 (en) | 2017-08-16 | 2021-06-22 | Applied Materials, Inc. | Plasma deposition of carbon hardmask |
| JP6518024B1 (ja) * | 2017-10-30 | 2019-05-22 | 日本碍子株式会社 | 静電チャック及びその製法 |
| US11469097B2 (en) | 2018-04-09 | 2022-10-11 | Applied Materials, Inc. | Carbon hard masks for patterning applications and methods related thereto |
| SG11202101496WA (en) * | 2018-10-26 | 2021-05-28 | Applied Materials Inc | High density carbon films for patterning applications |
-
2019
- 2019-10-04 SG SG11202101496WA patent/SG11202101496WA/en unknown
- 2019-10-04 KR KR1020217015648A patent/KR102758013B1/ko active Active
- 2019-10-04 JP JP2021521399A patent/JP7462626B2/ja active Active
- 2019-10-04 KR KR1020257001416A patent/KR20250010759A/ko active Pending
- 2019-10-04 CN CN202510957492.1A patent/CN120854258A/zh active Pending
- 2019-10-04 CN CN201980061362.2A patent/CN112740360B/zh active Active
- 2019-10-04 WO PCT/US2019/054812 patent/WO2020086241A1/en not_active Ceased
- 2019-10-04 US US16/593,757 patent/US11842897B2/en active Active
- 2019-10-16 TW TW108137197A patent/TWI827705B/zh active
- 2019-10-16 TW TW112147610A patent/TWI867885B/zh active
-
2023
- 2023-11-13 US US18/507,328 patent/US12463036B2/en active Active
-
2024
- 2024-03-26 JP JP2024049050A patent/JP7778835B2/ja active Active
-
2025
- 2025-09-02 JP JP2025145127A patent/JP2026000945A/ja active Pending
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