TW495553B - Method for preparing diamond-like carbon film by cathode arc evaporation (CAE) - Google Patents
Method for preparing diamond-like carbon film by cathode arc evaporation (CAE) Download PDFInfo
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- TW495553B TW495553B TW88114687A TW88114687A TW495553B TW 495553 B TW495553 B TW 495553B TW 88114687 A TW88114687 A TW 88114687A TW 88114687 A TW88114687 A TW 88114687A TW 495553 B TW495553 B TW 495553B
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Description
495553 案號 88114687 年月曰 修正一 五、發明說明(1) 【本發明的詳細説明】 本發明係有關於一種陰極電弧蒸鍍類鑽碳膜之製備方 法’以及特別係有關於一種以陰極電弧蒸鍍法為核心技術 發展出複合物理氣相沈積製移,即結合PVD沈積介層及 電漿輔助化學氣相沈積(以PECVD沈積類鑽碳膜)之 製程,因此其實在是一種相當具有實用性及進步性之發明 ’相當值得產業界來推廣,旅公諸於社會大眾。 【本發明的背景説明】495553 Case No. 88114687 Amendment I. Description of the Invention (1) [Detailed description of the invention] The present invention relates to a method for preparing a carbon film for a cathodic arc evaporation type diamond film, and particularly relates to a method using a cathodic arc Evaporation as the core technology has developed a composite physical vapor deposition process, that is, a process that combines PVD deposition interlayer and plasma-assisted chemical vapor deposition (PECVD deposition of diamond-like carbon films), so it is actually quite practical. Progressive and progressive inventions' are worthy of being promoted by the industry and traveled to the public. [Background of the invention]
由於類鑽碳膜(DIAM〇ND—LIKE CAR b〇N(DLC), F I LMS)具有高硬度、極低導電 性、低摩擦係數、低化學親和力等特性,因此而被廣泛應 用於需具低磨耗、抗腐蝕之場合,諸如半導體工業與機械 耐磨耗零組件; 而類鑽碳膜之組織為一非晶形(NON-CRYSTALLINE) 組織同時具有sp2及sp3鍵結碳膜,另外類鑽碳膜又可分為 含氫類鑽碳膜(a — c : H)與不含氫之類鑽碳膜(a — c ); 含氫類鑽碳膜一般係採用碳氫氣體裂解方式來獲得, 如電漿輔助化學氣相沈積法(p E C V D )、熱燈絲化學 氣相沈積方法(Η OT — FILAMENT CVD)或雷射沈積法 ® (L ASER A BLASION );Diamond-like carbon film (DIAMOND—LIKE CAR bON (DLC), FI LMS) has been widely used in applications requiring low hardness due to its high hardness, extremely low conductivity, low coefficient of friction, and low chemical affinity. Wear-resistant and corrosion-resistant occasions, such as the semiconductor industry and mechanical wear-resistant components; while the diamond-like carbon film has an amorphous (NON-CRYSTALLINE) structure with both sp2 and sp3 bonded carbon films, and other diamond-like carbon films It can be divided into hydrogen-containing diamond carbon film (a-c: H) and hydrogen-free diamond carbon film (a-c); hydrogen-containing diamond carbon film is generally obtained by cracking hydrocarbon gas, such as Plasma Assisted Chemical Vapor Deposition (p ECVD), Hot Filament Chemical Vapor Deposition (Η OT — FILAMENT CVD) or Laser Deposition (L ASER A BLASION);
而不含氫之類鑽碳膜則採用磁控濺射法(M AGNETRONAnd diamond films such as hydrogen do not use magnetron sputtering (M AGNETRON
SPUTTERING),電子束蒸發法(£ LECTRON BE ΑΜΕ VEPOR A TION)或陰極電弧電漿蒸鍍法(CATHODIC ARC E VEPORSPUTTERING), electron beam evaporation (£ LECTRON BE ΑΜΕ VEPOR A TION) or cathodic arc plasma evaporation (CATHODIC ARC E VEPOR
曰 工 88114687 五、發明 AT I〇ν,Γ 利用复古Α Ε ),而值得一提的是,陰極電弧蒸鍍法可 目、=離化率並控制離子動能以獲得高硬度類鑽碳膜。 讚碳滕ΐ採用以上方法製備類鑽碳膜之主要缺點在於此類 1. 〇um、,回内應力及附著力不佳以致沈積之厚度只有0· 2〜 改善此因而無法有效應用於機械模具或零組件,而為了 等人項缺點,請參看附件一之所示,F RANCESCHINI 某種翁危即在含氫類鑽碳膜中加入氮以改善内應力並獲致 鍍=度之效果。FALABELLA〔2〕等人利用陰極電弧蒸 入金屬靶沈積類鑽碳膜,在其專利所引用之方法乃加 以卜 f介層或在類鑽碳膜中加入氮以減少内應力,但 方法須在同一蒸鍍系統中採用2種以上之釦紝x ^ ^ ^ ^ ^ ^ PECVD^ ^ ^ ^ ,χ t 備3金屬介層及雜質之類鑽碳膜,此 低溫結合PVD與PECVD方法製備DLC,但受限於盆對稱以 磁控漱射(UBM)系統之離化能,其薄膜产二= $ 化物與傳統DLC之間,且其沈積速度亦較低二介於金屬乳 因此有鑑於此,本發明人乃積極開發研究, 一種陰極電弧蒸鍍類鑽碳膜之製備方法, ^ 類鑽碳臈製法,而使得其更且產業上 此改進傳統之 八又八座茶上之利用價值。 【本發明的發明目的】 本發明的主要目的係在於提供一種陰 碳膜之製備方法,而使得其可以提高所&成之二鑽 附著力,同時亦可以改善類鑽碳膜之殘餘應力.、奴臈之 而本發明之次要目的係可以使得其製^之類錢碳膜更 495553 _案號88114687_年月日_i±^_ 五、發明說明(3) 具較高之硬度,以利產業上之利用; 因此其總體來講,本發明可說是相當具有功效性,且 可以稱為相當突破的一種發明,相當具有產業上的利用價 值。 【本發明之實施例詳細說明】 本發明係有關於一種陰極電弧蒸鍍類鑽碳膜之製備方 法,,這種陰極電弧蒸鍍類鑽碳膜之製備方法其主要乃係 在利用電弧蒸鍍法沈積類鑽碳膜製程中,利用高離化率之 金屬弧源所提供之高能量電漿與通入之碳氫氣體(如ch4 或c2h2)產生裂解及沈積反應,形成含金屬滲入物之類鑽 碳膜,並經由調整基材偏壓、工作壓力、反應氣體種類及 弧源靶材種類,而製成具有不同機械性質之含金屬類鑽碳 膜; 而所通入之碳氫氣體分壓可介於0.5Pa〜5.0Pa之間,同 時經由控制基材偏壓與碳氫氣體分壓之調整而可獲得不同 微觀結構及機械性質之類鑽碳膜,以薄膜硬度為例,經由 參數之調整可介於HV 1 8 0 0〜HV4200之間。適當的基材偏壓 參數可形成良好的介層,如Cr、Ti 介層,一般基材偏壓 介於-100V〜-3 0 0V之間,而基材偏壓電源形式可採用直流 (DC)、脈波式(Pulsed )或RF電源供應器; 請配合參看附件二之所示,其係為利用本發明製備類 鑽碳膜之製程實施例及其製程參數,如此可以利用本發明 而獲得不同機械性質之含金屬類鑽碳膜。 另外在陰極電弧蒸鍍法中通入碳氫氣體之同時亦可以Said work 88114687 V. Invented AT Ioν, Γ uses retro AE), and it is worth mentioning that the cathodic arc evaporation method can achieve the target ionization rate and control the ion kinetic energy to obtain high hardness diamond carbon film. The main disadvantage of Zantan Tengye using the above method to prepare diamond-like carbon film is that this type of 1.0 um, the internal stress and adhesion is not good so that the thickness of the deposition is only 0 · 2 ~ to improve this and it can not be effectively applied to mechanical molds Or components, and in order to wait for the shortcomings of others, please refer to the Annex I, F RANCESCHINI some kind of danger is to add nitrogen to the carbon film of hydrogen-containing diamond to improve the internal stress and obtain the effect of plating. FALABELLA [2] et al. Used cathodic arc to vaporize metal targets to deposit diamond-like carbon films. The method cited in their patents was to use an interposer or add nitrogen to diamond-like carbon films to reduce internal stress. In the same evaporation system, more than two kinds of buttons are used: x ^ ^ ^ ^ ^ ^ PECVD ^ ^ ^ ^, χ t Prepare 3 diamond interlayers and diamond carbon films such as impurities. This low temperature combines PVD and PECVD to prepare DLC. However, due to the ionization energy of the magnetic symmetry (UBM) system of the pelvic symmetry, the film production is between $ 2 and the traditional DLC, and the deposition rate is also lower than the metal emulsion. Therefore, in view of this, The present inventors are actively developing and researching a method for preparing cathode-arc vapor-deposited diamond-like carbon film, and a diamond-like carbon reed method, which makes it more useful in industry to improve the traditional eight-eight teas. [Objective of the invention] The main object of the present invention is to provide a method for preparing an anion carbon film, so that it can improve the adhesion of two diamonds, and can also improve the residual stress of the diamond-like carbon film. The slave's secondary purpose of the present invention is to make its carbon film more like 495553 _ case number 88114687_ year month day _i ± ^ _ 5. Description of the invention (3) has a higher hardness, To facilitate industrial use; therefore, in general, the present invention can be said to be quite effective, and can be called a breakthrough invention, which has considerable industrial use value. [Detailed description of the embodiment of the present invention] The present invention relates to a method for preparing a carbon film for a cathodic arc evaporation type diamond film. The method for preparing a carbon film for the cathodic arc evaporation type diamond film is mainly based on arc evaporation. In the process of depositing diamond-like carbon film, the high-energy plasma provided by the metal ion source with high ionization rate and the incoming hydrocarbon gas (such as ch4 or c2h2) generate cracking and sedimentation reactions to form metal-containing infiltrates. Diamond-like carbon film, and through adjusting the substrate bias, working pressure, reaction gas type and arc source target material, to make metal-containing diamond-like carbon film with different mechanical properties; and the incoming hydrocarbon gas is divided into The pressure can be between 0.5Pa ~ 5.0Pa. At the same time, the diamond carbon film with different microstructures and mechanical properties can be obtained by adjusting the bias of the substrate and the partial pressure of the hydrocarbon gas. Take film hardness as an example. The adjustment can be between HV 1 800 to HV4200. Appropriate substrate bias parameters can form good interlayers, such as Cr, Ti interlayers. Generally, the substrate bias voltage is between -100V ~ -3 0 0V, and the form of substrate bias power can be DC (DC ), Pulsed (Pulsed) or RF power supply; please refer to the reference shown in Annex II, which is an embodiment of the manufacturing process of the diamond-like carbon film using the present invention and its process parameters, so you can use the present invention to obtain Metal-containing diamond carbon film with different mechanical properties. In addition, it is also possible to pass hydrocarbon gas in the cathodic arc evaporation method.
第6頁 495553 ___案號8811468Ϊ_年 g 3 修至___ 五、發明說明(4) 加入其他氣體作為滲入劑(D〇pant),如氮氣(N2), 經由添加渗入劑參與裂解反應,可改善類鑽碳膜之sp3碳 鍵之自由度,藉由滲入劑之添加即可獲得不同比例之拉曼 偏移強度比(The intensity rati〇 of Raman shifts, ID /IG),同時亦改善類鑽碳膜之薄膜硬度值。 因此由以上所述之陰極電弧蒸鍍類鑽碳膜之製備方法 ,可知本發明提供較習用之類鑽碳膜之製備方法更新穎之 製程,而且可以使得陰極電弧蒸鍍類鑽碳膜之製備方法所 製成之類鑽碳膜更具產業上的利用價值,為使 貴審查委 員更能了解到本發明所能達到的功效及價值性,茲就以上 之論點加以論述: 1·本發明可以應用於半導體、光電、光學及機械抗 磨耗產業,而運用於各種機械零組件、模具及刀具上時類 鑽碳膜即需同時具備高硬度及韌性。 2·本發明所製備之類鑽碳膜能改善附著力並提高硬 度。 3 ·利用本發明而可以提高類鑽碳膜之附著力,亦可 在類鑽碳膜中滲入金屬、金屬氮化物或金屬碳化物以改善 類鑽碳膜之殘餘應力。 ° 綜上所述’本發明陰極電弧蒸鍍類鑽碳膜之製備方法 在結構設計、使用實用性及成本效益上,確實是完全符人 產業上發展所需’且所揭露之結構發明亦是具有前所未^ 的創新構造’其既未見於任何刊物,而且市面上亦未見 任何類似的產品,所以其具有『新穎性』應無疑慮; 有Page 6 495553 ___ Case No. 8811468Ϊ_year g 3 Revised to ___ V. Description of the invention (4) Adding other gases as infiltration agents (Dopant), such as nitrogen (N2), participate in the cracking reaction by adding infiltration agents, It can improve the degree of freedom of the sp3 carbon bond of the diamond-like carbon film. By adding the infiltrant, different ratios of the Raman shift intensity (ID / IG) can be obtained. Diamond film hardness value. Therefore, from the above-mentioned preparation method of the cathode arc evaporation type diamond carbon film, it can be known that the present invention provides a more novel process than the conventional method of preparing the diamond carbon film, and can also make the preparation of the cathode arc evaporation type diamond carbon film. The diamond carbon film made by the method has more industrial utilization value. In order to make your reviewers better understand the effect and value of the present invention, the following points are discussed: 1. The present invention can Applied to the semiconductor, optoelectronic, optical, and mechanical wear-resistant industries. When applied to various mechanical components, molds, and tools, diamond-like carbon films need to have both high hardness and toughness. 2. The diamond carbon film prepared by the present invention can improve the adhesion and increase the hardness. 3. Using the present invention, the adhesion of the diamond-like carbon film can be improved, and metal, metal nitride or metal carbide can be infiltrated into the diamond-like carbon film to improve the residual stress of the diamond-like carbon film. ° In summary, the method for preparing the carbon film of the cathodic arc evaporation type diamond film of the present invention is indeed completely suitable for the development of the human industry in terms of structural design, practicality and cost-effectiveness, and the disclosed structural invention is also It has an unprecedented innovative structure 'It has not been seen in any publications, and there are no similar products on the market, so its "newness" should no doubt be considered;
495553 案號 88114687 曰 修正 五、發明說明(5) 且本案申請人係為實際生產製造『陰極電弧蒸鍍類鑽 碳膜之製備方法』之公司,其發展此類產品巳有十數年之 經驗,對於習用陰極電弧蒸鍍類鑽碳膜之製備方法所產生 的問題缺失相當了解,本發明確實具有增進相當之功效, 因此本案確實符合 鈞局有關發明專利之要件,請查照之495553 Case No. 88114687 Amendment V. Description of Invention (5) and the applicant of this case is a company that actually manufactures "Preparation Method of Cathodic Arc Evaporation Diamond Carbon Film" and has more than ten years of experience in developing such products I have a good understanding of the problems caused by the preparation method of the conventional cathode arc evaporation type diamond film. The present invention does have an equivalent effect. Therefore, this case is indeed in line with the requirements of the relevant invention patents of the Bureau.
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Cited By (2)
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CN115125481A (en) * | 2022-07-05 | 2022-09-30 | 东莞市龙铮真空设备有限公司 | Vacuum coating method for kitchen sink |
US11842897B2 (en) | 2018-10-26 | 2023-12-12 | Applied Materials, Inc. | High density carbon films for patterning applications |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US11842897B2 (en) | 2018-10-26 | 2023-12-12 | Applied Materials, Inc. | High density carbon films for patterning applications |
TWI827705B (en) * | 2018-10-26 | 2024-01-01 | 美商應用材料股份有限公司 | High density carbon films for patterning applications |
CN115125481A (en) * | 2022-07-05 | 2022-09-30 | 东莞市龙铮真空设备有限公司 | Vacuum coating method for kitchen sink |
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