JP2022175092A - 可視又は赤外レーザー硬化型のカチオン重合系エポキシ樹脂組成物 - Google Patents
可視又は赤外レーザー硬化型のカチオン重合系エポキシ樹脂組成物 Download PDFInfo
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 115
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 115
- 239000000203 mixture Substances 0.000 title claims abstract description 53
- 239000002253 acid Substances 0.000 claims abstract description 40
- 125000002091 cationic group Chemical group 0.000 claims description 35
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 23
- 239000011256 inorganic filler Substances 0.000 claims description 13
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 13
- 125000002723 alicyclic group Chemical group 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000011342 resin composition Substances 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- -1 glycidyl ester Chemical class 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- 229930185605 Bisphenol Natural products 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 239000000049 pigment Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 7
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 150000001450 anions Chemical class 0.000 description 3
- 239000011324 bead Substances 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- SLJFKNONPLNAPF-UHFFFAOYSA-N 3-Vinyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C=C)CCC2OC21 SLJFKNONPLNAPF-UHFFFAOYSA-N 0.000 description 1
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 208000019651 NDE1-related microhydranencephaly Diseases 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 229910018286 SbF 6 Inorganic materials 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 238000002296 dynamic light scattering Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 238000002559 palpation Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 239000006254 rheological additive Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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Abstract
Description
可視又は赤外レーザー硬化型のカチオン重合系エポキシ樹脂組成物であって、
(A)エポキシ樹脂、及び
(B)酸発生剤
を含む、
カチオン重合系エポキシ樹脂組成物。
項2.
前記エポキシ樹脂(A)が、脂環型エポキシ樹脂を含む、項1に記載のカチオン重合系エポキシ樹脂組成物。
項3.
前記エポキシ樹脂(A)が、さらにグリシジルエーテル型エポキシ樹脂を含む、項2に記載のカチオン重合系エポキシ樹脂組成物。
項4.
前記可視又は赤外レーザーが、600~1200nmの波長を有する、項1~3のいずれか一項に記載のカチオン重合系エポキシ樹脂組成物。
項5.
さらに、
(C)無機フィラー
を含む、項1~4のいずれか一項に記載のカチオン重合系エポキシ樹脂組成物。
項6.
前記酸発生剤が、光酸発生剤又は熱酸発生剤である、項1~5のいずれか一項に記載のカチオン重合系エポキシ樹脂組成物。
項7.
金属の接着、並びにカメラモジュール及び電子センサーの組み立てからなる群より選択される少なくとも一種の用途のために用いられる、項1~6のいずれか一項に記載のカチオン重合系エポキシ樹脂組成物。
項8.
カチオン重合系エポキシ樹脂組成物であって、
(A)エポキシ樹脂、及び
(B)酸発生剤
を含む、
カチオン重合系エポキシ樹脂組成物の、可視又は赤外レーザー硬化のための使用。
項9.
カチオン重合系エポキシ樹脂組成物を硬化させる方法であって、
前記カチオン重合系エポキシ樹脂組成物を、可視又は赤外レーザーを照射することにより硬化させる工程を含み、
前記カチオン重合系エポキシ樹脂組成物が、
(A)エポキシ樹脂、及び
(B)酸発生剤
を含む、方法。
本発明で用いるエポキシ樹脂は、カチオン重合しうるものであればよく、特に限定されない。エポキシ樹脂のカチオン重合の反応機構は周知である。具体的には、本発明で用いるエポキシ樹脂は、成長鎖が炭素カチオン(カルボカチオン)である重合系であればよい。本発明で用いるエポキシ樹脂は、酸発生剤より生じる酸との反応によりカルボカチオンを生じる。このカルボカチオンと、本発明で用いるエポキシ樹脂との間で生長反応が起こり、最終的に硬化物が得られる。
本発明で用いる酸発生剤は、可視又は赤外レーザーにより直接的に又は間接的に酸を発生し、その酸がエポキシ樹脂(A)と反応することによりカルボカチオンを生じるものであればよく、特に限定されない。
本発明のカチオン重合系エポキシ樹脂組成物は、さらに無機フィラーを含んでいてもよい。
本発明のカチオン重合系エポキシ樹脂組成物は、さらに必要に応じて一種又は二種以上のその他の成分を含んでいてもよい。
本発明のカチオン重合系エポキシ樹脂組成物は、可視又は赤外レーザーで硬化させるために使用することができる。本発明において、可視又は赤外レーザーは、具体的には、600~1200nmの波長を有するものを指す。本発明のカチオン重合系エポキシ樹脂組成物は、好ましくは800~1100nm、より好ましくは900~1100nmの波長のレーザーで硬化させるために使用することができる。
[脂環型エポキシ樹脂]
3,4-エポキシシクロヘキシルメチル-3’,4’-エポキシシクロヘキサンカルボキシレート(ダイセル社製「セロキサイド2021P[CEL2021P]」)
[グリシジルエーテル]
ビスフェノールA型エポキシ樹脂(DIC株式会社製「EPICLON 840」)
[オキセタン樹脂]
3-エチル-3{[(3-エチルオキセタン-3-イル)メトキシ]メチル}オキセタン(東亜合成社製「OXT 221)
[酸発生剤]
熱酸発生剤(キングインダストリーズ社製「TGA CXC1821」)
[フィラー]
高純度合成球状シリカ(アドマテックス社製「SO-E5」、平均粒径:2μm)
[硬化剤1]
潜在性ポリアミン型硬化剤(ADEKA社製「EH-5057P」)
[硬化剤2]
酸無水物(昭和電工株式会社製「MHAC-P」)
[顔料]
カーボンブラック(三菱ガスケミカル株式会社製「MA100」)
[アクリレート樹脂]
ビスフェノールA型ジアクリレート(サートマー社製「SR-540」)
[ぺルオキシド]
有機過酸化物、重合開始剤(日油株式会社製「Per Octa-O」)
<硬化試験方法>
各エポキシ樹脂組成物を、スライドガラスに0.01cc塗布し、90°の角度で980nmのレーザーをパナソニック株式会社製「CB1F」を用いて照射した後、外観と触診で竹串の硬化性を評価した。
Claims (9)
- 可視又は赤外レーザー硬化型のカチオン重合系エポキシ樹脂組成物であって、
(A)エポキシ樹脂、及び
(B)酸発生剤
を含む、
カチオン重合系エポキシ樹脂組成物。 - 前記エポキシ樹脂(A)が、脂環型エポキシ樹脂を含む、請求項1に記載のカチオン重合系エポキシ樹脂組成物。
- 前記エポキシ樹脂(A)が、さらにグリシジルエーテル型エポキシ樹脂を含む、請求項2に記載のカチオン重合系エポキシ樹脂組成物。
- 前記可視又は赤外レーザーが、600~1200nmの波長を有する、請求項1~3のいずれか一項に記載のカチオン重合系エポキシ樹脂組成物。
- さらに、
(C)無機フィラー
を含む、請求項1~4のいずれか一項に記載のカチオン重合系エポキシ樹脂組成物。 - 前記酸発生剤が、光酸発生剤又は熱酸発生剤である、請求項1~5のいずれか一項に記載のカチオン重合系エポキシ樹脂組成物。
- 金属の接着、並びにカメラモジュール及び電子センサーの組み立てからなる群より選択される少なくとも一種の用途のために用いられる、請求項1~6のいずれか一項に記載のカチオン重合系エポキシ樹脂組成物。
- カチオン重合系エポキシ樹脂組成物であって、
(A)エポキシ樹脂、及び
(B)酸発生剤
を含む、
カチオン重合系エポキシ樹脂組成物の、可視又は赤外レーザー硬化のための使用。 - カチオン重合系エポキシ樹脂組成物を硬化させる方法であって、
前記カチオン重合系エポキシ樹脂組成物を、可視又は赤外レーザーを照射することにより硬化させる工程を含み、
前記カチオン重合系エポキシ樹脂組成物が、
(A)エポキシ樹脂、及び
(B)酸発生剤
を含む、方法。
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EP22726315.9A EP4337711A1 (en) | 2021-05-12 | 2022-05-12 | Visible-laser-curable or infrared-laser-curable cationically polymerizable epoxy resin composition |
CN202280048597.XA CN117999302A (zh) | 2021-05-12 | 2022-05-12 | 可可见激光固化或可红外激光固化的可阳离子聚合的环氧树脂组合物 |
KR1020237042485A KR20240011731A (ko) | 2021-05-12 | 2022-05-12 | 가시광선 레이저 경화성 또는 적외선 레이저 경화성 양이온 중합성 에폭시 수지 조성물 |
PCT/JP2022/020119 WO2022239846A1 (en) | 2021-05-12 | 2022-05-12 | Visible-laser-curable or infrared-laser-curable cationically polymerizable epoxy resin composition |
JP2023001882A JP2023055708A (ja) | 2021-05-12 | 2023-01-10 | 可視又は赤外レーザー硬化型のカチオン重合系エポキシ樹脂組成物 |
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JP2020045435A (ja) | 2018-09-19 | 2020-03-26 | パナソニックIpマネジメント株式会社 | レーザー光硬化性接着剤組成物、光学部品、及び光学部品の製造方法 |
CN113286781B (zh) * | 2019-01-10 | 2023-08-08 | 三亚普罗股份有限公司 | 锍盐、光产酸剂、固化性组合物和抗蚀剂组合物 |
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JPH04349462A (ja) * | 1991-05-28 | 1992-12-03 | Jujo Paper Co Ltd | 近赤外線感光性樹脂組成物及びその組成物を用いた光学的造形体 |
JP2008291172A (ja) * | 2007-05-28 | 2008-12-04 | Konica Minolta Medical & Graphic Inc | 硬化性組成物及びその硬化方法 |
JP2016088980A (ja) * | 2014-10-31 | 2016-05-23 | 株式会社ダイセル | レーザー光照射による硬化物の製造方法 |
WO2019043778A1 (ja) * | 2017-08-29 | 2019-03-07 | 三菱重工業株式会社 | 硬化性組成物、硬化性ペースト材、硬化性シート材、硬化性型取り材、硬化方法および硬化物 |
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