JP2022165642A5 - - Google Patents
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- Publication number
- JP2022165642A5 JP2022165642A5 JP2021071065A JP2021071065A JP2022165642A5 JP 2022165642 A5 JP2022165642 A5 JP 2022165642A5 JP 2021071065 A JP2021071065 A JP 2021071065A JP 2021071065 A JP2021071065 A JP 2021071065A JP 2022165642 A5 JP2022165642 A5 JP 2022165642A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- layer
- insulating
- metal layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 11
- 239000002184 metal Substances 0.000 claims 8
- 230000015572 biosynthetic process Effects 0.000 claims 6
- 238000009413 insulation Methods 0.000 claims 2
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021071065A JP7561083B2 (ja) | 2021-04-20 | 2021-04-20 | 配線基板 |
| US18/264,704 US12408276B2 (en) | 2021-04-20 | 2022-04-08 | Wiring substrate |
| EP22791615.2A EP4329436A4 (en) | 2021-04-20 | 2022-04-08 | Wiring substrate |
| PCT/JP2022/017319 WO2022224841A1 (ja) | 2021-04-20 | 2022-04-08 | 配線基板 |
| CN202280013239.5A CN116868696A (zh) | 2021-04-20 | 2022-04-08 | 布线基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021071065A JP7561083B2 (ja) | 2021-04-20 | 2021-04-20 | 配線基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022165642A JP2022165642A (ja) | 2022-11-01 |
| JP2022165642A5 true JP2022165642A5 (enExample) | 2023-05-15 |
| JP7561083B2 JP7561083B2 (ja) | 2024-10-03 |
Family
ID=83722943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021071065A Active JP7561083B2 (ja) | 2021-04-20 | 2021-04-20 | 配線基板 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12408276B2 (enExample) |
| EP (1) | EP4329436A4 (enExample) |
| JP (1) | JP7561083B2 (enExample) |
| CN (1) | CN116868696A (enExample) |
| WO (1) | WO2022224841A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI856847B (zh) * | 2023-10-19 | 2024-09-21 | 矽品精密工業股份有限公司 | 基板結構及其製法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63224392A (ja) * | 1987-03-13 | 1988-09-19 | 日本メクトロン株式会社 | 多層プリント配線板およびその加工法 |
| JP3210838B2 (ja) | 1995-07-04 | 2001-09-25 | 京セラ株式会社 | 半導体素子収納用パッケージの製造方法 |
| US7378936B2 (en) * | 2005-05-23 | 2008-05-27 | Tektronix, Inc. | Circuit element with laser trimmed component |
| JP4814750B2 (ja) | 2006-09-29 | 2011-11-16 | 京セラ株式会社 | 多層配線基板及び電子装置、並びにこれらの製造方法 |
| TWI305127B (en) * | 2006-10-13 | 2009-01-01 | Phoenix Prec Technology Corp | Circuit board structure capable of performing electrica tests and fabrication method thereof |
| JP2015082645A (ja) * | 2013-10-24 | 2015-04-27 | イビデン株式会社 | フレックスリジッド配線板及びフレックスリジッド配線板の製造方法 |
| JP2017032290A (ja) | 2015-07-29 | 2017-02-09 | セイコーエプソン株式会社 | パッケージベース、パッケージベースの製造方法、容器、電子デバイス、電子機器及び移動体 |
| JP2019149442A (ja) * | 2018-02-27 | 2019-09-05 | 株式会社デンソーウェーブ | プリント配線の製造方法、及びプリント配線 |
-
2021
- 2021-04-20 JP JP2021071065A patent/JP7561083B2/ja active Active
-
2022
- 2022-04-08 WO PCT/JP2022/017319 patent/WO2022224841A1/ja not_active Ceased
- 2022-04-08 CN CN202280013239.5A patent/CN116868696A/zh active Pending
- 2022-04-08 US US18/264,704 patent/US12408276B2/en active Active
- 2022-04-08 EP EP22791615.2A patent/EP4329436A4/en active Pending