JP2022099720A5 - - Google Patents

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Publication number
JP2022099720A5
JP2022099720A5 JP2020213686A JP2020213686A JP2022099720A5 JP 2022099720 A5 JP2022099720 A5 JP 2022099720A5 JP 2020213686 A JP2020213686 A JP 2020213686A JP 2020213686 A JP2020213686 A JP 2020213686A JP 2022099720 A5 JP2022099720 A5 JP 2022099720A5
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JP
Japan
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semiconductor
semiconductor elements
bridging member
semiconductor element
semiconductor package
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JP2020213686A
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English (en)
Japanese (ja)
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JP2022099720A (ja
JP7331827B2 (ja
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Priority to JP2020213686A priority Critical patent/JP7331827B2/ja
Priority claimed from JP2020213686A external-priority patent/JP7331827B2/ja
Priority to PCT/JP2021/044454 priority patent/WO2022138068A1/ja
Priority to CN202180086569.2A priority patent/CN116783701A/zh
Publication of JP2022099720A publication Critical patent/JP2022099720A/ja
Publication of JP2022099720A5 publication Critical patent/JP2022099720A5/ja
Priority to US18/334,625 priority patent/US20230326817A1/en
Application granted granted Critical
Publication of JP7331827B2 publication Critical patent/JP7331827B2/ja
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JP2020213686A 2020-12-23 2020-12-23 半導体パッケージおよびこれを用いた電子装置 Active JP7331827B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020213686A JP7331827B2 (ja) 2020-12-23 2020-12-23 半導体パッケージおよびこれを用いた電子装置
PCT/JP2021/044454 WO2022138068A1 (ja) 2020-12-23 2021-12-03 半導体パッケージおよびこれを用いた電子装置
CN202180086569.2A CN116783701A (zh) 2020-12-23 2021-12-03 半导体封装体以及使用该半导体封装体的电子装置
US18/334,625 US20230326817A1 (en) 2020-12-23 2023-06-14 Semiconductor package and electronic device having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020213686A JP7331827B2 (ja) 2020-12-23 2020-12-23 半導体パッケージおよびこれを用いた電子装置

Publications (3)

Publication Number Publication Date
JP2022099720A JP2022099720A (ja) 2022-07-05
JP2022099720A5 true JP2022099720A5 (enExample) 2022-11-14
JP7331827B2 JP7331827B2 (ja) 2023-08-23

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ID=82159548

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JP2020213686A Active JP7331827B2 (ja) 2020-12-23 2020-12-23 半導体パッケージおよびこれを用いた電子装置

Country Status (4)

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US (1) US20230326817A1 (enExample)
JP (1) JP7331827B2 (enExample)
CN (1) CN116783701A (enExample)
WO (1) WO2022138068A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023171792A1 (enExample) 2022-03-11 2023-09-14
JP2024037592A (ja) * 2022-09-07 2024-03-19 株式会社デンソー 半導体パッケージ
TWI879544B (zh) * 2024-04-29 2025-04-01 同欣電子工業股份有限公司 功率晶片封裝結構

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0897335A (ja) * 1994-09-29 1996-04-12 Toshiba Corp 半導体封止用樹脂組成物およびそれを用いた半導体パッケージ
JP2009295763A (ja) * 2008-06-05 2009-12-17 Fujitsu Ltd 半導体実装装置及び電子機器
US8981539B2 (en) * 2013-06-10 2015-03-17 Alpha & Omega Semiconductor, Inc. Packaged power semiconductor with interconnection of dies and metal clips on lead frame
JP2015095619A (ja) * 2013-11-14 2015-05-18 株式会社デンソー モールドパッケージ
JP2015135895A (ja) * 2014-01-17 2015-07-27 パナソニックＩｐマネジメント株式会社 半導体モジュール
WO2016082138A1 (en) * 2014-11-27 2016-06-02 Dow Global Technologies Llc Composition for electrically insulating polymer-inorganic hybrid material with high thermal conductivity
JP6180646B1 (ja) * 2016-02-25 2017-08-16 三菱電機株式会社 半導体パッケージ、及びモジュール
JP7119817B2 (ja) * 2018-09-18 2022-08-17 昭和電工マテリアルズ株式会社 半導体装置

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