JP2022096760A - 基板洗浄方法および基板洗浄装置 - Google Patents

基板洗浄方法および基板洗浄装置 Download PDF

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Publication number
JP2022096760A
JP2022096760A JP2020209907A JP2020209907A JP2022096760A JP 2022096760 A JP2022096760 A JP 2022096760A JP 2020209907 A JP2020209907 A JP 2020209907A JP 2020209907 A JP2020209907 A JP 2020209907A JP 2022096760 A JP2022096760 A JP 2022096760A
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JP
Japan
Prior art keywords
substrate
cleaning
nozzle
gas
supplying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020209907A
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English (en)
Japanese (ja)
Other versions
JP7526085B2 (ja
Inventor
大輝 日野出
Daiki Hinode
昂史 逸見
Takafumi Itsumi
喬 太田
Takashi Ota
恭平 中西
Kyohei Nakanishi
和彦 中澤
Kazuhiko Nakazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2020209907A priority Critical patent/JP7526085B2/ja
Priority to TW110144954A priority patent/TWI797862B/zh
Priority to KR1020210179787A priority patent/KR102671168B1/ko
Priority to CN202111545593.6A priority patent/CN114649193A/zh
Publication of JP2022096760A publication Critical patent/JP2022096760A/ja
Application granted granted Critical
Publication of JP7526085B2 publication Critical patent/JP7526085B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2020209907A 2020-12-18 2020-12-18 基板洗浄方法および基板洗浄装置 Active JP7526085B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020209907A JP7526085B2 (ja) 2020-12-18 2020-12-18 基板洗浄方法および基板洗浄装置
TW110144954A TWI797862B (zh) 2020-12-18 2021-12-02 基板洗淨方法及基板洗淨裝置
KR1020210179787A KR102671168B1 (ko) 2020-12-18 2021-12-15 기판 세정 방법 및 기판 세정 장치
CN202111545593.6A CN114649193A (zh) 2020-12-18 2021-12-16 基板清洗方法及基板清洗装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020209907A JP7526085B2 (ja) 2020-12-18 2020-12-18 基板洗浄方法および基板洗浄装置

Publications (2)

Publication Number Publication Date
JP2022096760A true JP2022096760A (ja) 2022-06-30
JP7526085B2 JP7526085B2 (ja) 2024-07-31

Family

ID=81992398

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020209907A Active JP7526085B2 (ja) 2020-12-18 2020-12-18 基板洗浄方法および基板洗浄装置

Country Status (4)

Country Link
JP (1) JP7526085B2 (ko)
KR (1) KR102671168B1 (ko)
CN (1) CN114649193A (ko)
TW (1) TWI797862B (ko)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3777542B2 (ja) * 2001-04-03 2006-05-24 東京エレクトロン株式会社 ノズル装置及び塗布装置及び塗布方法
JP4172769B2 (ja) 2003-03-10 2008-10-29 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2004319720A (ja) * 2003-04-16 2004-11-11 Sony Corp 基板洗浄装置および基板洗浄方法
JP2010080583A (ja) 2008-09-25 2010-04-08 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5208666B2 (ja) 2008-10-10 2013-06-12 大日本スクリーン製造株式会社 基板処理装置
US9378988B2 (en) * 2011-07-20 2016-06-28 SCREEN Holdings Co., Ltd. Substrate processing apparatus and substrate processing method using processing solution
JP6338904B2 (ja) 2014-03-24 2018-06-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US9601358B2 (en) * 2014-08-15 2017-03-21 SCREEN Holdings Co., Ltd. Substrate treatment apparatus, and substrate treatment method
JP6487168B2 (ja) 2014-09-29 2019-03-20 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6352827B2 (ja) 2015-02-12 2018-07-04 株式会社テックインテック 基板処理装置
US10403533B2 (en) * 2015-05-04 2019-09-03 Applied Materials, Inc. Substrate rotary loader
JP6116629B2 (ja) * 2015-08-11 2017-04-19 株式会社ハーモテック 吸引装置
JP2017069336A (ja) * 2015-09-29 2017-04-06 東京エレクトロン株式会社 基板処理装置、吸着保持部の洗浄方法および記憶媒体
JP6762824B2 (ja) * 2016-09-26 2020-09-30 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
KR20220088339A (ko) 2022-06-27
KR102671168B1 (ko) 2024-05-31
TWI797862B (zh) 2023-04-01
TW202230500A (zh) 2022-08-01
CN114649193A (zh) 2022-06-21
JP7526085B2 (ja) 2024-07-31

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