JP2022019451A - 導電性接着剤組成物 - Google Patents
導電性接着剤組成物 Download PDFInfo
- Publication number
- JP2022019451A JP2022019451A JP2020123302A JP2020123302A JP2022019451A JP 2022019451 A JP2022019451 A JP 2022019451A JP 2020123302 A JP2020123302 A JP 2020123302A JP 2020123302 A JP2020123302 A JP 2020123302A JP 2022019451 A JP2022019451 A JP 2022019451A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- curable component
- conductive
- adhesive composition
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 116
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 116
- 239000000203 mixture Substances 0.000 title claims abstract description 84
- 239000000843 powder Substances 0.000 claims abstract description 117
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims abstract description 93
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims abstract description 47
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 22
- 239000004925 Acrylic resin Substances 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 229920000178 Acrylic resin Polymers 0.000 claims description 11
- 238000007639 printing Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 4
- SNVLJLYUUXKWOJ-UHFFFAOYSA-N methylidenecarbene Chemical compound C=[C] SNVLJLYUUXKWOJ-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 33
- 230000000052 comparative effect Effects 0.000 description 24
- 239000012790 adhesive layer Substances 0.000 description 22
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 19
- 238000000034 method Methods 0.000 description 18
- -1 acrylic compound Chemical class 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 239000002245 particle Substances 0.000 description 13
- 238000002156 mixing Methods 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 239000003505 polymerization initiator Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229940125904 compound 1 Drugs 0.000 description 4
- 229940126214 compound 3 Drugs 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229940125782 compound 2 Drugs 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 3
- 239000010452 phosphate Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- ZNXKLRKQUSZVQY-UHFFFAOYSA-N 1,6-diisocyanatohexane ethyl carbamate 2-(phenoxymethyl)oxirane prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O.C1OC1COC1=CC=CC=C1.O=C=NCCCCCCN=C=O ZNXKLRKQUSZVQY-UHFFFAOYSA-N 0.000 description 1
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 description 1
- BTUUFEOXIVJCMZ-UHFFFAOYSA-N 1-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]-2-phenoxyundecan-2-ol Chemical compound OCCOCCOCCOCC(O)(CCCCCCCCC)OC1=CC=CC=C1 BTUUFEOXIVJCMZ-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- SDXHBDVTZNMBEW-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(O)COCCO SDXHBDVTZNMBEW-UHFFFAOYSA-N 0.000 description 1
- JQCSUVJDBHJKNG-UHFFFAOYSA-N 1-methoxy-ethyl Chemical group C[CH]OC JQCSUVJDBHJKNG-UHFFFAOYSA-N 0.000 description 1
- TZJQCUDHKUWEFU-UHFFFAOYSA-N 2,2-dimethylpentanenitrile Chemical compound CCCC(C)(C)C#N TZJQCUDHKUWEFU-UHFFFAOYSA-N 0.000 description 1
- DPGYCJUCJYUHTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yloxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)CC(C)(C)C DPGYCJUCJYUHTM-UHFFFAOYSA-N 0.000 description 1
- COXCGWKSEPPDAA-UHFFFAOYSA-N 2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)C#N COXCGWKSEPPDAA-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- HLIQLHSBZXDKLV-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol Chemical compound OCCOCC(O)OC1=CC=CC=C1 HLIQLHSBZXDKLV-UHFFFAOYSA-N 0.000 description 1
- XXHDHAPOSIFMIG-UHFFFAOYSA-N 2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]-1-phenoxyethanol Chemical compound OCCOCCOCCOCC(O)OC1=CC=CC=C1 XXHDHAPOSIFMIG-UHFFFAOYSA-N 0.000 description 1
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 1
- CKSAKVMRQYOFBC-UHFFFAOYSA-N 2-cyanopropan-2-yliminourea Chemical compound N#CC(C)(C)N=NC(N)=O CKSAKVMRQYOFBC-UHFFFAOYSA-N 0.000 description 1
- MIRQGKQPLPBZQM-UHFFFAOYSA-N 2-hydroperoxy-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)OO MIRQGKQPLPBZQM-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- UDXXYUDJOHIIDZ-UHFFFAOYSA-N 2-phosphonooxyethyl prop-2-enoate Chemical compound OP(O)(=O)OCCOC(=O)C=C UDXXYUDJOHIIDZ-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- ZVYGIPWYVVJFRW-UHFFFAOYSA-N 3-methylbutyl prop-2-enoate Chemical compound CC(C)CCOC(=O)C=C ZVYGIPWYVVJFRW-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- AXFQPWWJRHMCRU-UHFFFAOYSA-N CCOC(N)=O.CC1=CC=CC=C1.C=CC(OCC(CO)(COC(C=C)=O)COC(C=C)=O)=O.N=C=O.N=C=O Chemical compound CCOC(N)=O.CC1=CC=CC=C1.C=CC(OCC(CO)(COC(C=C)=O)COC(C=C)=O)=O.N=C=O.N=C=O AXFQPWWJRHMCRU-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GNULGOSSPWDTMD-UHFFFAOYSA-N NC(=O)OCC.C(CCCCCN=C=O)N=C=O.C(C=C)(=O)OCC(COC(C=C)=O)(COC(C=C)=O)CO Chemical compound NC(=O)OCC.C(CCCCCN=C=O)N=C=O.C(C=C)(=O)OCC(COC(C=C)=O)(COC(C=C)=O)CO GNULGOSSPWDTMD-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- JWKNCJFGBOQAQL-UHFFFAOYSA-N butyl dodecaneperoxoate Chemical compound CCCCCCCCCCCC(=O)OOCCCC JWKNCJFGBOQAQL-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
(ただし、上記式(1)または(2)におけるXは、水素原子(H)またはメチル基(CH3 )である。)
前記(A)導電性粉末および前記(B)硬化性成分の合計量を100質量部としたときに、前記(C)リン酸含有硬化性成分の含有量が0.01質量部以上5質量部以下である構成である。
本開示に係る導電性接着剤組成物が含有する(A)導電性粉末は、導電性を有する粉末(粒子)であれば特に限定されない。その材質も特に限定されないが、良好な導電性を実現する観点から相対的に低抵抗の導電性材料を挙げることができる。具体的には、例えば、金、銀、銅、およびこれらの合金を好ましく用いることができる。これらの中でも特に銀を含有する粉末を好適に用いることができる。
本開示に係る導電性接着剤組成物が含有する(B)硬化性成分は、硬化によって(A)導電性粉末同士を電気的に接続可能にするとともに被着体に接着する硬化性バインダーとして機能するものであればよい。代表的には、熱硬化性の樹脂を挙げることができる。一般的な熱硬化性の樹脂としては、例えば、アクリル樹脂、エポキシ樹脂、シリコーン樹脂、フェノール樹脂、ポリエステル樹脂、ポリウレタン樹脂、メラミン樹脂、ポリイミド樹脂等が挙げられる。これらの中でも、特に、アクリル樹脂を好適に用いることができる。なお、樹脂の種類によっては、硬化前の(B)硬化性成分は、ポリマーではなくモノマーまたはプレポリマーである場合もある。そのため、本開示においては、(B)硬化性成分は、硬化性の樹脂だけでなく、硬化することで樹脂となる硬化性組成物も含む。
本開示に係る導電性接着剤組成物は、前述した(A)導電性粉末および(B)硬化性成分を基本成分として含有し、さらに追加の硬化性成分として(C)リン酸含有硬化性成分を含有する。この(C)リン酸含有硬化性成分は、下記式(1)または(2)の一般式を有し、分子量が150~1000の範囲内である。なお、下記式(1)または(2)におけるXは、水素原子(H)またはメチル基(CH3 )である。
つまり、本開示に係る導電性接着剤組成物には、前述した(B)硬化性成分に加えて上記式(1)の化合物または上記式(2)の化合物が配合されていればよく、これら2種類がいずれも配合されてもよいし、互いに反応することによりこれら式(1)または(2)の化合物となるような化合物の組合せが配合されてもよい。
本開示に係る導電性接着剤組成物の製造方法は特に限定されず、導電性接着剤組成物の分野で公知の方法を好適に用いることができる。代表的な一例としては、前述した各成分を所定の配合割合(質量基準)で配合し、公知の混練装置を用いてペースト化する方法が挙げられる。混練装置としては、例えば、3本ロールミル等を挙げることができる。
この(C)リン酸含有硬化性成分は、硬化接着層22において良好な接着強度を実現することに寄与するが、後述する実施例に示すように、良好な接着強度の実現だけでなく、硬化接着層22の低抵抗化を実現できることも明らかとなった。これにより、太陽電池セル21同士を硬化接着層22で良好に接着できるだけでなく、(A)導電性粉末の含有量を相対的に減少させても良好な導電性を実現することが可能になる。したがって、本開示に係る導電性接着剤組成物は、特に図3(A)に示すような太陽電池モジュール20の製造に良好に適用することができる。
(A)導電性状粉末の平均粒径(メジアン径)はレーザー回折法により評価した。(A)導電性状粉末の試料0.3gを50mlビーカーに秤量し、イソプロピルアルコール30mlを加えた後、超音波洗浄器(アズワン株式会社製USM-1)により5分間処理することで分散させ、粒度分布測定装置(日機装株式会社製マイクロトラックMT3300EXII)を用いて、メジアン径を測定して評価した。
実施例または比較例の導電性接着剤組成物を、図1に示すように、印刷機を用いてアルミナ基板12上に印刷パターン11を印刷した。この印刷パターン11は、1つの配線パターン11aと5つのパッドパターン11dとで構成されている。配線パターン11aは、両端にそれぞれ矩形状の端子11bを有し配線部11cがつづら折り状となっており、配線部11cのアスペクト比は75である。5つのパッドパターン11dは、この配線パターン11aに隣接して一列に並んで配置され、それぞれが2mm×2mmの正方形状となっている。
以下の実施例または比較例では、(A)導電性粉末として、下記表1に示す2種類のうち2種の粉末を用いた。なお、下記表1並びに表2および表3の略号は、実施例または比較例の成分を表4および表5において示すために用いている。
(実施例1)
表4に示すように、(A)導電性粉末として、表1に示す球状の銀粉1(略号A1)およびフレーク状の銀粉2(略号A2)を用い、(B)硬化性成分として、表2に示す樹脂1(略号B1)、樹脂2(略号B2)および樹脂3(略号B3)を用い、これらを表4に示す配合量(質量部)となるよう配合するとともに、(C)リン酸含有硬化性成分として、表3に示すリン酸含有化合物1(略号C1)を用い、このリン酸含有化合物1を表4に示す配合量(質量部)で配合し、これら各成分を3本ロールミルで混練した。これにより、実施例1の導電性接着剤組成物を調製(製造)した。
表4に示すように、(C)リン酸含有硬化性成分の含有量を変更するか、表3に示すリン酸含有化合物2(略号C2)を用いるか、(A)導電性粉末および(B)硬化性成分の配合比を変更した以外は、実施例1と同様にして、実施例2~6の導電性接着剤組成物を調製(製造)した。
表5に示すように、(C)リン酸含有硬化性成分として、前記の式(1)または(2)に該当しないリン酸含有化合物3(略号C3)を用いるか(比較例2)、リン酸含有化合物3を用いるとともに(A)導電性粉末および(B)硬化性成分の配合比を変更した(比較例3,4)以外は、実施例1と同様にして、比較例2~4の導電性接着剤組成物を調製(製造)した。
(実施例および比較例の対比)
実施例1~6の結果と比較例1の結果との対比から明らかなように、本開示に係る導電性接着剤組成物であれば、(C)リン酸含有硬化性成分を適切に含有することにより、硬化接着層において良好な接着強度を実現できるだけでなく、実施例1~6の結果の方が比較例1の結果よりも明らかに体積抵抗値が低下している。
11a:配線パターン
11b:端子
11c:配線部
11d:パッドパターン
12:アルミナ基板
13:リベット
20:太陽電池モジュール
21:太陽電池セル
22:硬化接着層
30:太陽電池モジュール
31:太陽電池セル
32:インターコネクタ
Claims (5)
- 前記(A)導電性粉末が、銀粉末、銀合金粉末、銀コート粉末の少なくともいずれかであることを特徴とする、
請求項1に記載の導電性接着剤組成物。 - 前記(B)硬化性成分が、アクリル樹脂、もしくは、硬化することでアクリル樹脂となる硬化性組成物であることを特徴とする、
請求項1または2に記載の導電性接着剤組成物。 - 基材上に印刷機またはディスペンサーにより塗布して用いられるものであることを特徴とする、
請求項1から3のいずれか1項に記載の導電性接着剤組成物。 - 太陽電池モジュールを構成する太陽電池セルの接着に用いられることを特徴とする、
請求項4に記載の導電性接着剤組成物。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020123302A JP2022019451A (ja) | 2020-07-17 | 2020-07-17 | 導電性接着剤組成物 |
TW110122939A TW202214804A (zh) | 2020-07-17 | 2021-06-23 | 導電性接著劑組成物 |
CN202180048171.XA CN115956109A (zh) | 2020-07-17 | 2021-07-14 | 导电性粘接剂组合物 |
PCT/JP2021/026381 WO2022014625A1 (ja) | 2020-07-17 | 2021-07-14 | 導電性接着剤組成物 |
US18/015,584 US20230323162A1 (en) | 2020-07-17 | 2021-07-14 | Conductive adhesive composition |
EP21843015.5A EP4183847A1 (en) | 2020-07-17 | 2021-07-14 | Conductive adhesive composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020123302A JP2022019451A (ja) | 2020-07-17 | 2020-07-17 | 導電性接着剤組成物 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2022019451A true JP2022019451A (ja) | 2022-01-27 |
Family
ID=79554680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020123302A Pending JP2022019451A (ja) | 2020-07-17 | 2020-07-17 | 導電性接着剤組成物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230323162A1 (ja) |
EP (1) | EP4183847A1 (ja) |
JP (1) | JP2022019451A (ja) |
CN (1) | CN115956109A (ja) |
TW (1) | TW202214804A (ja) |
WO (1) | WO2022014625A1 (ja) |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001257220A (ja) * | 2000-03-13 | 2001-09-21 | Sumitomo Bakelite Co Ltd | ダイアタッチペースト及び半導体装置 |
JP2004043602A (ja) * | 2002-07-10 | 2004-02-12 | Bridgestone Corp | 異方性導電フィルム |
JP2012041541A (ja) * | 2011-09-21 | 2012-03-01 | Sony Chemical & Information Device Corp | 回路接続材料及びそれを用いた接続方法並びに接続構造体 |
JP2013098230A (ja) * | 2011-10-28 | 2013-05-20 | Dexerials Corp | 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法 |
JP2014170794A (ja) * | 2013-03-01 | 2014-09-18 | Dexerials Corp | 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法 |
JP2015074770A (ja) * | 2013-10-11 | 2015-04-20 | デクセリアルズ株式会社 | 接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体 |
JP5746797B1 (ja) * | 2013-09-05 | 2015-07-08 | 積水化学工業株式会社 | 硬化性組成物及び接続構造体 |
JP2016044222A (ja) * | 2014-08-21 | 2016-04-04 | 日立化成株式会社 | 接着剤組成物及び接続構造体 |
WO2016140204A1 (ja) * | 2015-03-02 | 2016-09-09 | 株式会社スリーボンド | 熱硬化型導電性接着剤 |
WO2016171253A1 (ja) * | 2015-04-23 | 2016-10-27 | 日立化成株式会社 | 接着剤組成物及び接続構造体 |
JP2017145382A (ja) * | 2016-02-15 | 2017-08-24 | 太陽インキ製造株式会社 | 導電性接着剤とその製造方法、硬化物および電子部品 |
WO2018043505A1 (ja) * | 2016-08-30 | 2018-03-08 | 日立化成株式会社 | 接着剤組成物 |
JP2018133331A (ja) * | 2017-02-15 | 2018-08-23 | デクセリアルズ株式会社 | 異方性導電接続構造体、異方性導電接続構造体の製造方法、異方性導電フィルム、及び異方性導電ペースト |
JP2020164744A (ja) * | 2019-03-29 | 2020-10-08 | 太陽インキ製造株式会社 | 導電性接着剤およびシリンジ |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2431438B1 (en) | 2010-09-20 | 2012-11-28 | Henkel AG & Co. KGaA | Electrically conductive adhesives |
-
2020
- 2020-07-17 JP JP2020123302A patent/JP2022019451A/ja active Pending
-
2021
- 2021-06-23 TW TW110122939A patent/TW202214804A/zh unknown
- 2021-07-14 EP EP21843015.5A patent/EP4183847A1/en active Pending
- 2021-07-14 CN CN202180048171.XA patent/CN115956109A/zh active Pending
- 2021-07-14 US US18/015,584 patent/US20230323162A1/en active Pending
- 2021-07-14 WO PCT/JP2021/026381 patent/WO2022014625A1/ja unknown
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001257220A (ja) * | 2000-03-13 | 2001-09-21 | Sumitomo Bakelite Co Ltd | ダイアタッチペースト及び半導体装置 |
JP2004043602A (ja) * | 2002-07-10 | 2004-02-12 | Bridgestone Corp | 異方性導電フィルム |
JP2012041541A (ja) * | 2011-09-21 | 2012-03-01 | Sony Chemical & Information Device Corp | 回路接続材料及びそれを用いた接続方法並びに接続構造体 |
JP2013098230A (ja) * | 2011-10-28 | 2013-05-20 | Dexerials Corp | 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法 |
JP2014170794A (ja) * | 2013-03-01 | 2014-09-18 | Dexerials Corp | 導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法 |
JP5746797B1 (ja) * | 2013-09-05 | 2015-07-08 | 積水化学工業株式会社 | 硬化性組成物及び接続構造体 |
JP2015074770A (ja) * | 2013-10-11 | 2015-04-20 | デクセリアルズ株式会社 | 接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体 |
JP2016044222A (ja) * | 2014-08-21 | 2016-04-04 | 日立化成株式会社 | 接着剤組成物及び接続構造体 |
WO2016140204A1 (ja) * | 2015-03-02 | 2016-09-09 | 株式会社スリーボンド | 熱硬化型導電性接着剤 |
WO2016171253A1 (ja) * | 2015-04-23 | 2016-10-27 | 日立化成株式会社 | 接着剤組成物及び接続構造体 |
JP2017145382A (ja) * | 2016-02-15 | 2017-08-24 | 太陽インキ製造株式会社 | 導電性接着剤とその製造方法、硬化物および電子部品 |
WO2018043505A1 (ja) * | 2016-08-30 | 2018-03-08 | 日立化成株式会社 | 接着剤組成物 |
JP2018133331A (ja) * | 2017-02-15 | 2018-08-23 | デクセリアルズ株式会社 | 異方性導電接続構造体、異方性導電接続構造体の製造方法、異方性導電フィルム、及び異方性導電ペースト |
JP2020164744A (ja) * | 2019-03-29 | 2020-10-08 | 太陽インキ製造株式会社 | 導電性接着剤およびシリンジ |
Also Published As
Publication number | Publication date |
---|---|
US20230323162A1 (en) | 2023-10-12 |
TW202214804A (zh) | 2022-04-16 |
CN115956109A (zh) | 2023-04-11 |
WO2022014625A1 (ja) | 2022-01-20 |
EP4183847A1 (en) | 2023-05-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100671312B1 (ko) | 배선단자 접속용 필름 | |
EP2297262B1 (en) | Silver coated flaky material filled conductive curable composition and the application in die attach | |
JP5855459B2 (ja) | 回路部材の接続構造体 | |
JP5454578B2 (ja) | 接着剤組成物、接続構造体、接続構造体の製造方法及び接着剤組成物の応用 | |
JP5823117B2 (ja) | 異方性導電フィルム、接合体、及び接合体の製造方法 | |
JP4752986B1 (ja) | 回路接続用接着フィルム及び回路接続構造体 | |
KR20090065462A (ko) | 회로 접속 재료 및 회로 부재의 접속 구조 | |
CN109312200B (zh) | 热固化型导电性胶粘剂 | |
JP6600167B2 (ja) | 樹脂組成物、及び、樹脂組成物を含む導電性接着剤 | |
JP4852785B2 (ja) | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 | |
JP5577635B2 (ja) | 接着剤組成物、回路接続用接着剤及び回路接続体 | |
KR101131163B1 (ko) | 신뢰성이 향상된 이방 전도성 필름용 조성물 및 이를 이용한 이방 전도성 필름 | |
KR102193517B1 (ko) | 접착제 조성물, 필름상 접착제, 접착 시트, 회로 접속체, 회로 부재의 접속 방법, 접착제 조성물의 용도, 필름상 접착제의 용도 및 접착 시트의 용도 | |
WO2022014626A1 (ja) | 導電性接着剤組成物 | |
WO2022014625A1 (ja) | 導電性接着剤組成物 | |
JP4788036B2 (ja) | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 | |
JP4752107B2 (ja) | 回路接続用フィルム状接着剤、回路端子の接続構造および回路端子の接続方法 | |
KR102275926B1 (ko) | 접속 방법 및 접합체 | |
JP2022155933A (ja) | 導電性接着剤組成物 | |
KR100922658B1 (ko) | 이방도전 필름 및 이를 이용한 회로판 | |
JP2022155932A (ja) | 導電性接着剤組成物 | |
JP2023134038A (ja) | 回路接続用接着剤フィルム、並びに、回路接続構造体及びその製造方法 | |
WO2023243621A1 (ja) | 導電性樹脂組成物およびその硬化物 | |
JP2006012804A (ja) | 接着剤、配線端子の接続方法及び配線構造体 | |
KR20080103462A (ko) | 접착제 조성물 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20201110 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20201110 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210120 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210525 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210720 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20210921 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211215 |
|
C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20211215 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20211227 |
|
C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20211228 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20220225 |
|
C211 | Notice of termination of reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C211 Effective date: 20220301 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20221115 |
|
C22 | Notice of designation (change) of administrative judge |
Free format text: JAPANESE INTERMEDIATE CODE: C22 Effective date: 20230207 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230817 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231225 |