JP2022014482A - 温度センサ - Google Patents
温度センサ Download PDFInfo
- Publication number
- JP2022014482A JP2022014482A JP2020116778A JP2020116778A JP2022014482A JP 2022014482 A JP2022014482 A JP 2022014482A JP 2020116778 A JP2020116778 A JP 2020116778A JP 2020116778 A JP2020116778 A JP 2020116778A JP 2022014482 A JP2022014482 A JP 2022014482A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- thermocouple
- temperature sensor
- extension
- measuring body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 49
- 239000011888 foil Substances 0.000 claims description 37
- 238000002791 soaking Methods 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 abstract 2
- 238000010168 coupling process Methods 0.000 abstract 2
- 238000005859 coupling reaction Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 30
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910001374 Invar Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910000629 Rh alloy Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PXXKQOPKNFECSZ-UHFFFAOYSA-N platinum rhodium Chemical compound [Rh].[Pt] PXXKQOPKNFECSZ-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
2:熱電対
3:フラットケーブル(延長体)
4:温度測定体
5:均熱板
6:感温部
7:凹部
8:ハウジング
9:絶縁性フィルム
10:導体箔
11:熱電対用導体箔(延長体素線)
12:温度測定体用導体箔
13:接続部
14:保護管
50:計測器
100、110:温度センサ
Claims (4)
- 異種の導体で構成され接合点を感温部とした対をなす熱電対素線を有する熱電対と、
同種の導体で構成され一端部は前記熱電対素線に対して前記感温部が位置する側とは逆側で接続され他端部は計測器に接続される対をなす延長体素線を有する延長体と、
前記熱電対素線と前記延長体素線の接続部に重なる位置に設けられる温度測定体と、を備え、
前記温度測定体で測定した前記接続部の温度に基づいて前記感温部での温度が計測される温度センサ。 - 対をなす前記熱電対素線と前記延長体素線を複数備えるとともに前記接続部を複数備え、
複数の前記接続部に跨がって設けられる均熱板を備える請求項1に記載の温度センサ。 - 前記延長体素線は、銅又は銅を主成分とする合金で形成されている請求項1又は2に記載の温度センサ。
- 前記延長体は、フラットケーブルであって、
前記フラットケーブルは、前記延長体素線としての熱電対用導体箔と、前記温度測定体と前記計測器とを接続する温度測定体用導体箔と、当該熱電対用導体箔と当該温度測定体用導体箔とが設けられた絶縁性フィルムと、を含んで構成される請求項1~3の何れか一項に記載の温度センサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020116778A JP6831965B1 (ja) | 2020-07-07 | 2020-07-07 | 温度センサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020116778A JP6831965B1 (ja) | 2020-07-07 | 2020-07-07 | 温度センサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6831965B1 JP6831965B1 (ja) | 2021-02-24 |
JP2022014482A true JP2022014482A (ja) | 2022-01-20 |
Family
ID=74661630
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020116778A Active JP6831965B1 (ja) | 2020-07-07 | 2020-07-07 | 温度センサ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6831965B1 (ja) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55137340U (ja) * | 1980-04-02 | 1980-09-30 | ||
US4718777A (en) * | 1986-02-28 | 1988-01-12 | John Fluke Mfg. Co., Inc. | Isothermal block for temperature measurement system using a thermocouple |
JPH04165643A (ja) * | 1990-10-30 | 1992-06-11 | Tokyo Electron Sagami Ltd | 熱処理装置の温度測定方法 |
JPH07286909A (ja) * | 1994-04-15 | 1995-10-31 | Toshiba Corp | 熱電対基準ブロック |
JPH08219898A (ja) * | 1995-02-13 | 1996-08-30 | Mitsubishi Materials Corp | 熱電センサーモジュール |
JP2000241257A (ja) * | 1999-02-24 | 2000-09-08 | Hayashi Denko Kk | 絶縁性基板の温度センサ装置 |
JP2003086649A (ja) * | 2001-09-07 | 2003-03-20 | Anritsu Keiki Kk | 温度センサ付きウエハ |
JP2003177065A (ja) * | 2001-12-11 | 2003-06-27 | Yamatake Corp | 測温装置 |
JP2005315783A (ja) * | 2004-04-30 | 2005-11-10 | Anritsu Keiki Kk | 冷接点用プリント基板 |
JP2010190735A (ja) * | 2009-02-18 | 2010-09-02 | Geomatec Co Ltd | 測温素子及び温度計測器 |
-
2020
- 2020-07-07 JP JP2020116778A patent/JP6831965B1/ja active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55137340U (ja) * | 1980-04-02 | 1980-09-30 | ||
US4718777A (en) * | 1986-02-28 | 1988-01-12 | John Fluke Mfg. Co., Inc. | Isothermal block for temperature measurement system using a thermocouple |
JPH04165643A (ja) * | 1990-10-30 | 1992-06-11 | Tokyo Electron Sagami Ltd | 熱処理装置の温度測定方法 |
JPH07286909A (ja) * | 1994-04-15 | 1995-10-31 | Toshiba Corp | 熱電対基準ブロック |
JPH08219898A (ja) * | 1995-02-13 | 1996-08-30 | Mitsubishi Materials Corp | 熱電センサーモジュール |
JP2000241257A (ja) * | 1999-02-24 | 2000-09-08 | Hayashi Denko Kk | 絶縁性基板の温度センサ装置 |
JP2003086649A (ja) * | 2001-09-07 | 2003-03-20 | Anritsu Keiki Kk | 温度センサ付きウエハ |
JP2003177065A (ja) * | 2001-12-11 | 2003-06-27 | Yamatake Corp | 測温装置 |
JP2005315783A (ja) * | 2004-04-30 | 2005-11-10 | Anritsu Keiki Kk | 冷接点用プリント基板 |
JP2010190735A (ja) * | 2009-02-18 | 2010-09-02 | Geomatec Co Ltd | 測温素子及び温度計測器 |
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JP6831965B1 (ja) | 2021-02-24 |
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