JP2022010604A - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP2022010604A
JP2022010604A JP2020111268A JP2020111268A JP2022010604A JP 2022010604 A JP2022010604 A JP 2022010604A JP 2020111268 A JP2020111268 A JP 2020111268A JP 2020111268 A JP2020111268 A JP 2020111268A JP 2022010604 A JP2022010604 A JP 2022010604A
Authority
JP
Japan
Prior art keywords
fixed
mold portion
cap
power elements
pressing piece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020111268A
Other languages
English (en)
Japanese (ja)
Inventor
隆人 徳永
Takahito Tokunaga
直人 中山
Naoto Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Sankyo Corp
Original Assignee
Nidec Sankyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Sankyo Corp filed Critical Nidec Sankyo Corp
Priority to JP2020111268A priority Critical patent/JP2022010604A/ja
Priority to CN202110725509.2A priority patent/CN113939083A/zh
Publication of JP2022010604A publication Critical patent/JP2022010604A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/56—Insulating bodies
    • H01B17/58—Tubes, sleeves, beads, or bobbins through which the conductor passes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2020111268A 2020-06-29 2020-06-29 電子機器 Pending JP2022010604A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2020111268A JP2022010604A (ja) 2020-06-29 2020-06-29 電子機器
CN202110725509.2A CN113939083A (zh) 2020-06-29 2021-06-29 电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020111268A JP2022010604A (ja) 2020-06-29 2020-06-29 電子機器

Publications (1)

Publication Number Publication Date
JP2022010604A true JP2022010604A (ja) 2022-01-17

Family

ID=79274279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020111268A Pending JP2022010604A (ja) 2020-06-29 2020-06-29 電子機器

Country Status (2)

Country Link
JP (1) JP2022010604A (zh)
CN (1) CN113939083A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024070581A1 (ja) * 2022-09-26 2024-04-04 ローム株式会社 電力変換ユニット

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1167313C (zh) * 2000-01-10 2004-09-15 神达电脑股份有限公司 带有耐热绝缘护套的电路板及其制作方法
JP3910383B2 (ja) * 2001-07-17 2007-04-25 株式会社日立製作所 パワーモジュールおよびインバータ
JP3740117B2 (ja) * 2002-11-13 2006-02-01 三菱電機株式会社 電力用半導体装置
JP5379816B2 (ja) * 2011-02-23 2013-12-25 三菱電機株式会社 電力用半導体装置
JP2012256750A (ja) * 2011-06-09 2012-12-27 Mitsubishi Electric Corp 発熱部品の固定方法、及び発熱部品の固定構造
JP6409879B2 (ja) * 2014-12-08 2018-10-24 株式会社村田製作所 パッケージ型パワー半導体、および、パッケージ型パワー半導体の実装構造
EP3240026A4 (en) * 2014-12-24 2018-09-05 NSK Ltd. Power semiconductor module and electric power steering device employing same
JP6274196B2 (ja) * 2015-12-16 2018-02-07 株式会社オートネットワーク技術研究所 電気接続箱
CN107170714B (zh) * 2017-06-14 2020-01-14 扬州国扬电子有限公司 一种低寄生电感功率模块及双面散热低寄生电感功率模块
JP2020005402A (ja) * 2018-06-28 2020-01-09 富士電機株式会社 電力変換装置およびパワー半導体モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024070581A1 (ja) * 2022-09-26 2024-04-04 ローム株式会社 電力変換ユニット

Also Published As

Publication number Publication date
CN113939083A (zh) 2022-01-14

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