JP2022007763A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2022007763A5 JP2022007763A5 JP2020110888A JP2020110888A JP2022007763A5 JP 2022007763 A5 JP2022007763 A5 JP 2022007763A5 JP 2020110888 A JP2020110888 A JP 2020110888A JP 2020110888 A JP2020110888 A JP 2020110888A JP 2022007763 A5 JP2022007763 A5 JP 2022007763A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- semiconductor substrate
- lower metal
- metal film
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 46
- 239000002184 metal Substances 0.000 claims description 46
- 239000004065 semiconductor Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 22
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 description 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020110888A JP2022007763A (ja) | 2020-06-26 | 2020-06-26 | 半導体装置およびその製造方法 |
| CN202180045017.7A CN115735264A (zh) | 2020-06-26 | 2021-06-23 | 半导体装置及其制造方法 |
| PCT/JP2021/023793 WO2021261521A1 (ja) | 2020-06-26 | 2021-06-23 | 半導体装置およびその製造方法 |
| US18/065,916 US20230125063A1 (en) | 2020-06-26 | 2022-12-14 | Semiconductor device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020110888A JP2022007763A (ja) | 2020-06-26 | 2020-06-26 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022007763A JP2022007763A (ja) | 2022-01-13 |
| JP2022007763A5 true JP2022007763A5 (enExample) | 2022-09-01 |
Family
ID=79281330
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020110888A Pending JP2022007763A (ja) | 2020-06-26 | 2020-06-26 | 半導体装置およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230125063A1 (enExample) |
| JP (1) | JP2022007763A (enExample) |
| CN (1) | CN115735264A (enExample) |
| WO (1) | WO2021261521A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116632053B (zh) * | 2023-07-25 | 2024-01-30 | 深圳市美浦森半导体有限公司 | 一种rc-igbt器件的控制方法 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5844767A (ja) * | 1981-09-11 | 1983-03-15 | Fujitsu Ltd | 半導体装置 |
| JPH01238162A (ja) * | 1988-03-18 | 1989-09-22 | Nec Corp | 半導体装置 |
| JPH08124877A (ja) * | 1994-10-24 | 1996-05-17 | Sanyo Electric Co Ltd | 半導体集積回路の製造方法 |
| JP2006351717A (ja) * | 2005-06-14 | 2006-12-28 | Toyota Motor Corp | 半導体装置及びその製造方法 |
| DE602007013634D1 (de) * | 2006-02-10 | 2011-05-19 | Semiconductor Energy Lab | Halbleiterbauelement und Herstellungsverfahren dafür |
| JP2008021701A (ja) * | 2006-07-11 | 2008-01-31 | Sharp Corp | 半導体装置及びその製造方法 |
| JP5457613B1 (ja) * | 2012-07-03 | 2014-04-02 | 新電元工業株式会社 | 半導体装置 |
| JP5772926B2 (ja) * | 2013-01-07 | 2015-09-02 | 株式会社デンソー | 半導体装置 |
| JP2015216200A (ja) * | 2014-05-09 | 2015-12-03 | 株式会社豊田中央研究所 | 半導体装置 |
| JP2016054250A (ja) * | 2014-09-04 | 2016-04-14 | 豊田合成株式会社 | 半導体装置、製造方法、方法 |
| JP2016143804A (ja) * | 2015-02-03 | 2016-08-08 | トヨタ自動車株式会社 | 半導体装置 |
| JP2017135283A (ja) * | 2016-01-28 | 2017-08-03 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6719090B2 (ja) * | 2016-12-19 | 2020-07-08 | パナソニックＩｐマネジメント株式会社 | 半導体素子 |
| JP2019145667A (ja) * | 2018-02-21 | 2019-08-29 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
-
2020
- 2020-06-26 JP JP2020110888A patent/JP2022007763A/ja active Pending
-
2021
- 2021-06-23 WO PCT/JP2021/023793 patent/WO2021261521A1/ja not_active Ceased
- 2021-06-23 CN CN202180045017.7A patent/CN115735264A/zh active Pending
-
2022
- 2022-12-14 US US18/065,916 patent/US20230125063A1/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016033967A5 (enExample) | ||
| JP2013197382A5 (enExample) | ||
| JP2010118246A5 (enExample) | ||
| JP2011119502A5 (enExample) | ||
| JP2014192386A5 (enExample) | ||
| JP2015508244A5 (enExample) | ||
| JP2013069808A5 (enExample) | ||
| JP2011233899A5 (enExample) | ||
| JP2019530988A5 (enExample) | ||
| JP2013069807A5 (enExample) | ||
| US9451696B2 (en) | Embedded architecture using resin coated copper | |
| JP2018026427A5 (enExample) | ||
| JP2009038358A5 (enExample) | ||
| JP2016131245A5 (enExample) | ||
| WO2014190608A1 (zh) | 一种无焊带太阳能电池组件及其制备方法 | |
| JP2022007763A5 (enExample) | ||
| JP2015002212A (ja) | チップ抵抗器、チップ抵抗器の実装構造 | |
| JP2006110626A5 (enExample) | ||
| JP2025120356A5 (enExample) | ||
| JP2018006466A5 (enExample) | ||
| JP2008543049A5 (enExample) | ||
| JP2013239677A5 (ja) | 配線基板の製造方法、配線基板製造用の構造体 | |
| JP6317895B2 (ja) | チップ抵抗器、チップ抵抗器の実装構造 | |
| JP2022175500A5 (enExample) | ||
| JP2019102774A5 (enExample) |