JP2021529459A5 - - Google Patents
Info
- Publication number
- JP2021529459A5 JP2021529459A5 JP2020571590A JP2020571590A JP2021529459A5 JP 2021529459 A5 JP2021529459 A5 JP 2021529459A5 JP 2020571590 A JP2020571590 A JP 2020571590A JP 2020571590 A JP2020571590 A JP 2020571590A JP 2021529459 A5 JP2021529459 A5 JP 2021529459A5
- Authority
- JP
- Japan
- Prior art keywords
- metal pillar
- interposer layer
- ultrasonic
- layer
- bonded
- Prior art date
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862694810P | 2018-07-06 | 2018-07-06 | |
| US62/694,810 | 2018-07-06 | ||
| PCT/US2019/040516 WO2020010207A1 (en) | 2018-07-06 | 2019-07-03 | Methods and apparatuses for packaging an ultrasound-on-a-chip |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021529459A JP2021529459A (ja) | 2021-10-28 |
| JPWO2020010207A5 JPWO2020010207A5 (https=) | 2022-07-11 |
| JP2021529459A5 true JP2021529459A5 (https=) | 2022-07-11 |
Family
ID=69059840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020571590A Pending JP2021529459A (ja) | 2018-07-06 | 2019-07-03 | 超音波オンチップをパッケージングする方法及び装置 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US11018068B2 (https=) |
| EP (1) | EP3818372B1 (https=) |
| JP (1) | JP2021529459A (https=) |
| KR (1) | KR20210030951A (https=) |
| CN (1) | CN112368574B (https=) |
| AU (1) | AU2019297412A1 (https=) |
| CA (1) | CA3105492A1 (https=) |
| TW (1) | TW202011897A (https=) |
| WO (1) | WO2020010207A1 (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112075090B (zh) | 2018-05-03 | 2022-10-14 | 蝴蝶网络有限公司 | 用于cmos传感器上的超声换能器的压力端口 |
| CA3105492A1 (en) * | 2018-07-06 | 2020-01-09 | Butterfly Network, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
| AU2019350989A1 (en) | 2018-09-28 | 2021-03-25 | Butterfly Network, Inc. | Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities |
| US11626343B2 (en) * | 2018-10-30 | 2023-04-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device with enhanced thermal dissipation and method for making the same |
| CA3118563A1 (en) | 2018-11-13 | 2020-05-22 | Butterfly Network, Inc. | Getter technology for micromachined ultrasonic transducer cavities |
| WO2020102492A1 (en) | 2018-11-15 | 2020-05-22 | Butterfly Network, Inc. | Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices |
| AU2019392906A1 (en) | 2018-12-07 | 2021-07-22 | Octant, Inc. | Systems for protein-protein interaction screening |
| TW202045099A (zh) | 2019-02-07 | 2020-12-16 | 美商蝴蝶網路公司 | 用於微加工超音波傳感器裝置的雙層金屬電極 |
| US11583894B2 (en) | 2019-02-25 | 2023-02-21 | Bfly Operations, Inc. | Adaptive cavity thickness control for micromachined ultrasonic transducer devices |
| US11484911B2 (en) | 2019-04-12 | 2022-11-01 | Bfly Operations, Inc. | Bottom electrode via structures for micromachined ultrasonic transducer devices |
| CN114555248A (zh) | 2019-04-12 | 2022-05-27 | 布弗莱运营公司 | 用于微加工超声换能器器件的分段式吸气剂开口 |
| US11501562B2 (en) | 2019-04-30 | 2022-11-15 | Bfly Operations, Inc. | Ultrasound face scanning and identification apparatuses and methods |
| US11684951B2 (en) | 2019-08-08 | 2023-06-27 | Bfly Operations, Inc. | Micromachined ultrasonic transducer devices having truncated circle shaped cavities |
| US11676922B2 (en) * | 2019-10-28 | 2023-06-13 | Qualcomm Incorporated | Integrated device comprising interconnect structures having an inner interconnect, a dielectric layer and a conductive layer |
| US11988640B2 (en) | 2020-03-11 | 2024-05-21 | Bfly Operations, Inc. | Bottom electrode material stack for micromachined ultrasonic transducer devices |
| US11776820B2 (en) * | 2020-09-30 | 2023-10-03 | Huawei Technologies Co., Ltd. | Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method |
| TW202239483A (zh) | 2021-03-04 | 2022-10-16 | 美商蝴蝶營運公司 | 具有不均勻柱腳的電容式微加工超音波換能器 |
| TW202240165A (zh) | 2021-03-04 | 2022-10-16 | 美商蝴蝶營運公司 | 具有柱腳的微加工超音波換能器 |
| WO2022212671A1 (en) | 2021-04-01 | 2022-10-06 | Bfly Operations, Inc. | Apparatuses and methods for configuring ultrasound devices |
| KR20230084968A (ko) | 2021-12-06 | 2023-06-13 | 삼성전자주식회사 | 반도체 패키지 및 반도체 패키지의 제조 방법 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7327554B2 (en) * | 2003-03-19 | 2008-02-05 | Ngk Spark Plug Co., Ltd. | Assembly of semiconductor device, interposer and substrate |
| US20060055024A1 (en) * | 2004-09-14 | 2006-03-16 | Staktek Group, L.P. | Adapted leaded integrated circuit module |
| US7741686B2 (en) | 2006-07-20 | 2010-06-22 | The Board Of Trustees Of The Leland Stanford Junior University | Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame |
| DE102007026445A1 (de) | 2007-06-06 | 2008-12-11 | Robert Bosch Gmbh | Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements |
| KR20100057596A (ko) | 2007-07-03 | 2010-05-31 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 존재 검출을 위한 박막 검출기 |
| US7843022B2 (en) | 2007-10-18 | 2010-11-30 | The Board Of Trustees Of The Leland Stanford Junior University | High-temperature electrostatic transducers and fabrication method |
| US7781238B2 (en) | 2007-12-06 | 2010-08-24 | Robert Gideon Wodnicki | Methods of making and using integrated and testable sensor array |
| NZ589503A (en) | 2008-05-07 | 2013-07-26 | Signostics Ltd | Docking system for medical diagnostic scanning using a handheld device |
| US7838337B2 (en) * | 2008-12-01 | 2010-11-23 | Stats Chippac, Ltd. | Semiconductor device and method of forming an interposer package with through silicon vias |
| US7790492B1 (en) | 2009-06-13 | 2010-09-07 | Mwm Acoustics, Llc | Method for fabricating a transducer package with the transducer die unsupported by a substrate |
| US8207652B2 (en) | 2009-06-16 | 2012-06-26 | General Electric Company | Ultrasound transducer with improved acoustic performance |
| WO2011155638A1 (en) * | 2010-06-11 | 2011-12-15 | Nec Corporation | Method of redistributing functional element |
| SG190288A1 (en) * | 2010-12-01 | 2013-06-28 | 1366 Tech Inc | Making semiconductor bodies from molten material using a free-standing interposer sheet |
| US8614488B2 (en) * | 2010-12-08 | 2013-12-24 | Ying-Nan Wen | Chip package and method for forming the same |
| WO2014123922A1 (en) | 2013-02-05 | 2014-08-14 | Butterfly Network, Inc. | Cmos ultrasonic transducers and related apparatus and methods |
| US10058891B2 (en) | 2013-02-05 | 2018-08-28 | Sound Technology Inc. | Ultrasound device |
| JP6232124B2 (ja) | 2013-03-15 | 2017-11-15 | バタフライ ネットワーク，インコーポレイテッド | 相補型金属酸化膜半導体（ｃｍｏｓ）超音波振動子およびその形成方法 |
| US9633869B2 (en) * | 2013-08-16 | 2017-04-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packages with interposers and methods for forming the same |
| KR102237662B1 (ko) | 2014-04-18 | 2021-04-09 | 버터플라이 네트워크, 인크. | 상보적 금속 산화물 반도체(ｃｍｏｓ) 웨이퍼들 내의 초음파 트랜스듀서들 및 관련 장치 및 방법들 |
| US9252127B1 (en) | 2014-07-10 | 2016-02-02 | Invensas Corporation | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture |
| US9067779B1 (en) | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US20160009544A1 (en) * | 2015-03-02 | 2016-01-14 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| US10276541B2 (en) * | 2015-06-30 | 2019-04-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | 3D package structure and methods of forming same |
| TWI721183B (zh) * | 2016-06-20 | 2021-03-11 | 美商蝴蝶網路公司 | 用於微製造超音波傳感器的電接點配置 |
| US9922896B1 (en) | 2016-09-16 | 2018-03-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Info structure with copper pillar having reversed profile |
| CN106449554B (zh) * | 2016-12-06 | 2019-12-17 | 苏州源戍微电子科技有限公司 | 带有封闭空腔的芯片嵌入式封装结构及其制作方法 |
| US10196261B2 (en) | 2017-03-08 | 2019-02-05 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
| EP3642611B1 (en) | 2017-06-21 | 2024-02-14 | Butterfly Network, Inc. | Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections |
| CN108155160A (zh) * | 2018-01-29 | 2018-06-12 | 中芯长电半导体（江阴）有限公司 | 指纹识别芯片的封装结构及封装方法 |
| WO2019152340A1 (en) | 2018-01-30 | 2019-08-08 | Butterfly Network, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
| EP3762155B1 (en) | 2018-03-09 | 2023-12-13 | BFLY Operations, Inc. | Methods for fabricating ultrasound transducer devices |
| TW201947717A (zh) | 2018-05-03 | 2019-12-16 | 美商蝴蝶網路公司 | 用於超音波晶片的垂直封裝及相關方法 |
| CA3105492A1 (en) | 2018-07-06 | 2020-01-09 | Butterfly Network, Inc. | Methods and apparatuses for packaging an ultrasound-on-a-chip |
-
2019
- 2019-07-03 CA CA3105492A patent/CA3105492A1/en active Pending
- 2019-07-03 CN CN201980045060.6A patent/CN112368574B/zh active Active
- 2019-07-03 AU AU2019297412A patent/AU2019297412A1/en not_active Abandoned
- 2019-07-03 KR KR1020217003420A patent/KR20210030951A/ko not_active Ceased
- 2019-07-03 EP EP19830619.3A patent/EP3818372B1/en active Active
- 2019-07-03 US US16/502,553 patent/US11018068B2/en active Active
- 2019-07-03 WO PCT/US2019/040516 patent/WO2020010207A1/en not_active Ceased
- 2019-07-03 JP JP2020571590A patent/JP2021529459A/ja active Pending
- 2019-07-03 TW TW108123485A patent/TW202011897A/zh unknown
-
2021
- 2021-03-04 US US17/191,829 patent/US11676874B2/en active Active
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