TW202011897A - 用於封裝超音波晶片的方法和設備 - Google Patents
用於封裝超音波晶片的方法和設備 Download PDFInfo
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- TW202011897A TW202011897A TW108123485A TW108123485A TW202011897A TW 202011897 A TW202011897 A TW 202011897A TW 108123485 A TW108123485 A TW 108123485A TW 108123485 A TW108123485 A TW 108123485A TW 202011897 A TW202011897 A TW 202011897A
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000004806 packaging method and process Methods 0.000 title abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 108
- 239000002184 metal Substances 0.000 claims abstract description 108
- 238000005538 encapsulation Methods 0.000 claims abstract description 9
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 230000008878 coupling Effects 0.000 claims description 15
- 238000010168 coupling process Methods 0.000 claims description 15
- 238000005859 coupling reaction Methods 0.000 claims description 15
- 238000002604 ultrasonography Methods 0.000 claims description 10
- 239000008393 encapsulating agent Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 113
- 229920002120 photoresistant polymer Polymers 0.000 description 23
- 230000008569 process Effects 0.000 description 14
- 239000000758 substrate Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000009713 electroplating Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 6
- 238000001459 lithography Methods 0.000 description 6
- 210000001519 tissue Anatomy 0.000 description 6
- CTVRBEKNQHJPLX-UHFFFAOYSA-N 1,2,5-trichloro-3-(2,4,6-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC(Cl)=CC(Cl)=C1Cl CTVRBEKNQHJPLX-UHFFFAOYSA-N 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 238000012285 ultrasound imaging Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920002577 polybenzoxazole Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 210000003484 anatomy Anatomy 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000017531 blood circulation Effects 0.000 description 1
- 230000000747 cardiac effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 210000004872 soft tissue Anatomy 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 208000024891 symptom Diseases 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0655—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of cylindrical shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/007—Interconnections between the MEMS and external electrical signals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49894—Materials of the insulating layers or coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/19—Manufacturing methods of high density interconnect preforms
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0271—Resonators; ultrasonic resonators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/024—Mixtures
- G01N2291/02475—Tissue characterisation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
- G01S7/52079—Constructional features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68359—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68372—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support a device or wafer when forming electrical connections thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
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Abstract
在此所述的是用於封裝超音波晶片的方法及設備。超音波晶片可以耦接至重分佈層以及中介層。囊封物可以囊封該超音波晶片的裝置,並且第一金屬柱可以延伸穿過該囊封物並且電耦接至該重分佈層。第二金屬柱可以延伸穿過該中介層。該中介層可包含鋁氮化物。該些第一金屬柱可以電耦接至該些第二金屬柱。印刷電路板可以耦接至該中介層。
Description
一般而言,在此所述的技術特點係有關於超音波裝置。某些態樣是關於封裝超音波晶片。
相關申請案之交互參照
本申請案根據第35號美國法典第119條(e)項主張2018年7月6日申請的美國臨時申請案序號62/694,810的益處,其具有代理人文件編號B1348.70087US00且名稱為"用於封裝超音波晶片的方法和設備",該美國臨時申請案茲在此以其整體被納入作為參考。
超音波裝置可被利用來執行診斷的成像及/或治療,其利用具有相對於人可聽見的那些聲波更高頻率的聲波。超音波成像可被用來看見內部的軟組織的身體結構,例如是用以找出疾病的來源、或是排除任何病狀。當超音波的脈衝被發送到組織之中時(例如,其係藉由利用一超音波成像裝置),聲波從該組織被反射,其中不同的組織反射不同程度的聲音。這些被反射的聲波接著可被記錄並且作為一超音波影像來顯示給操作者。該聲音信號的強度(振幅)以及該波行進穿過身體所花的時間係提供被用來產生該超音波影像的資訊。包含即時影像的許多不同類型的影像可以利用超音波裝置來加以形成。例如,影像可被產生,其展示組織的二維的橫截面、血液流動、組織隨著時間的運動、血液的位置、特定分子的存在、組織的硬度、或是一個三維的區域的解剖學。
根據至少一態樣,一種設備被提出。該設備包括:超音波晶片,其係包括頂表面以及底表面;一中介層,其包括頂表面以及底表面;以及重分佈層;其中:該超音波晶片的裝置的該頂表面耦接至該重分佈層;以及該超音波晶片的裝置的該底表面耦接至該中介層的該頂表面。
根據至少一態樣,一種方法被提出。該方法包括:耦接包括第一金屬柱的中介層至印刷電路板;以及耦接該中介層至包含第二金屬柱的經封裝的超音波晶片。
根據至少一態樣,一種方法被提出。該方法包括:在中介層中形成金屬柱;耦接該中介層至超音波晶片;以及在該超音波晶片上形成重分佈層。
習知的超音波系統是大型、複雜且昂貴的系統,其通常是只被擁有相當大的金融資源的大型醫療設施所購買的。近來,較便宜、可攜式,且較不複雜的超音波成像裝置係已經被引入。此種成像裝置可包含被單體整合到單一半導體晶粒之上的超音波換能器,以形成單體超音波裝置。此種超音波晶片的裝置的特點係被描述在2017年1月25日申請(並且被讓與給本申請案的受讓人)的名稱為“通用的超音波裝置以及相關的設備和方法”的美國專利申請案號15/415,434中,該美國專利申請案係以其整體被納入在此作為參考。
相較於例如是引線接合的其它封裝方法,本發明人已經體認到可以有助於封裝此種超音波晶片的裝置的特點。尤其,本發明人已經體認到整合型扇出(InFO)封裝以及增加了金屬柱的中介層可以提供益處於封裝超音波晶片的裝置。範例的益處包含較低的寄生電感及電阻、較高的效率、較少的發熱、較高的封裝處理量、以及改善的封裝可靠度。此外,此種封裝可以使得裝置能夠具有較小的感測器頭,其可以是有助於例如心臟應用的超音波成像應用,其中該感測器頭適合用在肋骨之間可能是所期望的。再者,此種封裝可以使得裝置能夠具有較薄的透鏡,其可以增加信號強度。
應該體認到的是,在此所述的實施例可以用許多方式的任一種來加以實施。特定的實施方式的例子只是為了舉例說明的目的而被提供在以下。應該體認到的是,這些實施例以及所提供的態樣/功能可以個別地、全部一起、或是用兩個或多個的任意組合來加以利用,因為在此所述的技術的態樣在此方面並不受限。
圖1-37描繪根據在此所述的某些實施例的在超音波晶片的裝置的利用製程的封裝期間的各種結構的橫截面。圖1是描繪耦接至載體基板106的釋放層104、以及耦接至該釋放層104的絕緣層102。該載體基板106例如可包含玻璃。該釋放層104例如可包含光熱轉換型(LTHC)塗料。該絕緣材料102例如可包含一種可以利用曝光及顯影而被圖案化的聚合物,例如是聚醯亞胺,聚苯並噁唑(PBO)、或是苯環丁烯(BCB)。
在圖2中,金屬層108被形成在該絕緣層102上。該金屬層108例如可以利用物理氣相沉積(PVD)或濺鍍來加以形成。該金屬層108例如可包含銅、或是在某些實施例中,該金屬層108可包含兩層,例如是耦接至該絕緣層102的鈦層、以及耦接至該鈦層的銅層。
在圖3中,光阻層110被形成在該金屬層108上。例如,該光阻層110可包含光阻。
在圖4中,開口被形成在該光阻層110中。例如,透過微影遮罩的曝光、接著是顯影可以在該光阻層110的透過該遮罩已被曝露到光的部分中產生開口。
在圖5中,金屬柱112利用電鍍而被形成在該光阻層110中的開口內。該金屬層108可以作為用於該電鍍的晶種層。該些金屬柱112可包含和該金屬層108相同的材料,例如是銅。應該體認到的是,儘管四個金屬柱112被展示,但是可以有二維地配置的更多的金屬柱112(例如,數十個或是數百個)。
在圖6中,該光阻層110被移除。例如,光阻剝離液可被用來移除該光阻層110。該金屬層108的先前在該光阻層110的未曝光的部分之下的部分亦被移除。例如,非等向性蝕刻可被用來移除該金屬層108,其中該金屬層108比該些金屬柱112更快地被蝕刻。
圖7是描繪耦接至絕緣層116的超音波晶片114。
在圖8中,開口被產生在該絕緣層116中(例如,其利用微影)。
在圖9中,光阻層118被形成在該絕緣層116上。
在圖10中,開口被產生在該光阻層118中(例如,其利用微影),其中被產生在該光阻層118中的開口延伸到被產生在該絕緣層116中的開口之中。
在圖11中,金屬接點120被形成在該光阻層118以及該絕緣層116中的開口之內。例如,該些金屬接點120可以藉由電鍍來加以形成,並且可包含銅或是一種銅合金。在某些實施例中,凸塊下金屬層(未顯示在圖11中)可被形成在該些金屬接點120以及該超音波晶片114之間。
在圖12中,該光阻層118被移除(例如,其利用光阻剝離液)。
在圖13中,更多的絕緣材料被加到該絕緣層116,以覆蓋該些金屬接點120。
在圖14中,晶粒附接膜(DAF)122耦接至該絕緣層102。
在圖15中,該超音波晶片114耦接至該晶粒附接膜122。
在圖16中,囊封物124被形成以囊封該超音波晶片114、該絕緣層116、該晶粒附接膜122、以及該些金屬柱112。該囊封物124可包含模製化合物、模製底膠填充、環氧樹脂、或是樹脂。該囊封物124的頂表面延伸在該絕緣層116以及該些金屬柱112的頂表面之上。
在圖17中,該囊封物124以及該絕緣層116的頂表面被平坦化,直到該些金屬柱112以及該金屬接點120的頂表面被露出為止。例如,化學機械平坦化(CMP)可被使用於該平坦化。
在圖18中,額外的絕緣材料被加到該絕緣層116,使得該絕緣層116覆蓋該些金屬接點120以及該些金屬柱112的頂表面。
在圖19中,開口被產生在該些金屬接點120以及該些金屬柱112之上的絕緣層116中。例如,微影可被用來產生該些開口。
在圖20中,重分佈線(RDL)126被形成在該絕緣層116中的開口中、以及在該絕緣層116上。如圖所示,該RDL 126可以電連接特定的金屬接點120至特定的金屬柱112。該RDL 126可包含金屬線路及貫孔,可以利用電鍍(包含一未被展示的晶種層的形成)來加以形成,並且可包含例如是鋁、銅、鎢的金屬、及/或這些金屬的合金。該RDL 126可包含多層的金屬線路及貫孔。
在圖21中,額外的絕緣材料被加到該絕緣層116以覆蓋該RDL 126的頂表面。
在圖22中,該載體基板106以及該釋放層104從該絕緣層102分離。例如,投射光(例如,紫外線或雷射)到該釋放層104之上可以分解該釋放層104,使得該釋放層104以及該載體基板106從該絕緣層102分離。該絕緣層102的表面亦可以被清洗以移除任何的殘留物。圖21的結構被翻轉以達成圖22的朝向。
在圖23中,開口被產生在該絕緣層102中。
在圖24中,焊料球128被設置在該絕緣層102中的開口內。在某些實施例中,該些焊料球128可以藉由電鍍來加以形成。在某些實施例中,其它形式的電連接器(例如,金屬柱)可被形成在該些開口中。在某些實施例中,凸塊下金屬層(未顯示在圖24中)可被形成在該些焊料球128以及該些金屬柱112之間。
圖25描繪耦接至載體基板136的釋放層134、耦接至該釋放層134的絕緣層132、以及耦接至該絕緣層132的中介層130。該中介層130例如可包含鋁氮化物。
在圖26中,開口被形成在該中介層130中。例如,雷射鑽孔可被用來形成該些開口。
在圖27中,金屬層138被形成在該中介層130上。該金屬層138例如可以利用濺鍍來加以形成。該金屬層138例如可包含銅、或是在某些實施例中,該金屬層138可包含兩層,例如是耦接至該中介層130的鈦層、以及耦接至該鈦層的銅層。
在圖28中,金屬柱142利用電鍍而被形成在該中介層130中的開口內。該金屬層138可以作為用於該電鍍的晶種層。該些金屬柱142可包含和該金屬層138相同的材料,例如是銅。應該體認到的是,除了作為電性繞線之外,該些金屬柱142亦可以有助於加強可能是脆性的中介層130。
在圖29中,光阻層140被形成在該金屬層138以及該些金屬柱142上。
在圖30中,該光阻層140被圖案化(例如,其係利用微影),以阻擋該些金屬柱142的頂表面。
在圖31中,該金屬層108的未被阻擋的部分被蝕刻,以電性隔離該些金屬柱142。在某些實施例中,替代性的或額外的利用微影以阻擋該些金屬柱142,定時蝕刻或是非等向性蝕刻可被使用。
在圖32中,該光阻層140被移除(例如,其利用光阻剝離液)。
在圖33中,該載體基板136以及該釋放層134從該絕緣層132分離。
在圖34中,開口被產生在該絕緣層132中。
在圖35中,焊料球144被設置在該絕緣層132中的開口內。
在圖36中,熱黏著層150耦接至該中介層130。在某些實施例中,該熱黏著層150可包含含銀的環氧樹脂。該些焊料球144耦接至印刷電路板(PCB)148。在某些實施例中,表面安裝技術(SMT)或是覆晶的焊接可被用來將該些焊料球144耦接至該PCB 148。底膠填充(例如,環氧樹脂)層146被形成在該絕緣層132以及該PCB 148之間。
在圖37中,該些焊料球128耦接至該些金屬柱142。該些金屬柱112與該些金屬柱142對準。在某些實施例中,表面安裝技術(SMT)或是覆晶的焊接可被用來將該些焊料球128耦接至該些金屬柱142。在該最終的結構中,該中介體可以提供在該超音波晶片114以及該PCB 148之間的電性繞線、以及用於該超音波晶片114的散熱器。
圖38-42係描繪根據在此所述的某些實施例的在超音波晶片的裝置的利用另一製程的封裝期間的各種結構的橫截面。圖38係描繪圖32的結構。
在圖39中,該些金屬柱142係利用電鍍而向上地延伸。如同可見的,該些金屬柱142延伸超出該中介層130的頂表面。
在圖40中,該超音波晶片114透過該晶粒附接膜122來耦接至該中介層130。
在圖41中,更多的絕緣材料被加到該絕緣層116。類似於在圖16中,該囊封物124被形成以囊封該超音波晶片114、該絕緣層116、該晶粒附接膜122、以及該些金屬柱142。類似於在圖18-21中,該RDL 126被形成。
在圖42中,類似於在圖33-36中,該載體基板136以及該釋放層134從該絕緣層132分離,該些焊料球144被形成在該些金屬柱142上,該些焊料球144耦接至該PCB 148,並且底膠填充層146被形成在該絕緣層132以及該PCB 148之間。
和圖1-37的製程相比較,圖38-42的製程可以使得該超音波晶片114能夠在製程控制、品質、以及良率可以是高的半導體晶圓代工中被結合到該中介層130。此外,儘管圖1-37的製程可能需要同時的該些焊料球128至該些金屬柱142的接合、以及該絕緣層102至該熱黏著劑150的接合,但是圖38-42的製程可以排除該熱黏著層150。
圖43描繪根據在此所述的某些實施例的用於封裝超音波晶片的範例的製程4300。在動作4302中,包含金屬柱的中介層耦接至印刷電路板。動作4302可以對應於在圖36中描繪的步驟。在動作4304中,該中介層耦接至包含金屬柱的經封裝的超音波晶片。動作4304可以對應於在圖37中描繪的步驟。該中介層可以透過熱黏著層來耦接至該經封裝的超音波晶片。
圖44描繪根據在此所述的某些實施例的用於封裝超音波晶片的範例的製程4400。在動作4402中,金屬柱被形成在中介層中。動作4402可以對應於在圖38-39中描繪的步驟。在動作4404中,該中介層耦接至超音波晶片。動作4404可以對應於在圖40中描繪的步驟。在動作4406中,重分佈層被形成在該經封裝的超音波晶片上。動作4406可以對應於在圖41中描繪的步驟。
本揭露內容的各種特點可以單獨地、組合地、或是用並未在先前敘述的實施例中明確論述的各種配置來加以利用,並且因此在其應用上並未受限於在先前的說明中所闡述、或是在圖式中所描繪的構件的細節及配置。例如,在一實施例中敘述的特點可以用任何方式來和在其它實施例中敘述的特點組合。
除非另有清楚相反的指出,否則如同在此的說明書中以及在申請專利範圍中所用的該些不定冠詞“一”以及“一個”都應該被理解為表示“至少一個”。
如同在此的說明書中以及在申請專利範圍中所用的措辭"及/或"應該被理解為表示該些因此聯合的元件的"任一或是兩者",亦即元件在某些情形中是結合地存在,而在其它情形中則是分離地存在。利用“及/或”所表列的多個元件應該用相同的方式來加以解釋,亦即因此聯合的元件的“一或多個”。除了藉由該“及/或”子句明確所指出的元件之外的其它元件可以選配地存在,不論其是否相關或不相關那些明確所指出的元件。因此,作為一非限制性的例子,在一實施例中,一對於“A及/或B”的參照當結合例如是“包括”的開放式語言而被利用時可以是指只有A(選配地包含除了B以外的元件);在另一實施例中可以是指只有B(選配地包含除了A以外的元件);在又一實施例中可以是指A及B兩者(選配地包含其它元件);依此類推。
如同在此的說明書中以及在申請專利範圍中所用的,關於一或多個元件的一表列的措辭"至少一個"應該被理解為表示至少一選自該表列的元件中的任一個或多個元件之元件,但是不一定包含明確地被表列在該表列的元件內的每一個元件的至少一個,而且並不排除在該表列的元件中之元件的任意組合。此定義亦容許除了在該措辭"至少一個"所參照到的表列的元件之內明確所指出的元件之外的元件可以選配地存在,不論其是否相關或不相關那些明確所指出的元件。因此,作為一非限制性的例子,在一實施例中,“A及B中的至少一個”(或等同的是“A或B中的至少一個”、或等同的是“A及/或B中的至少一個”)可以是指至少一個(選配地包含超過一個)A,而沒有B存在(以及選配地包含除了B以外的元件);在另一實施例中可以是指至少一個(選配地包含超過一個)B,而沒有A存在(以及選配地包含除了A以外的元件);在又一實施例中可以是指至少一個(選配地包含超過一個)A與至少一個(選配地包含超過一個)B(以及選配地包含其它元件);依此類推。
例如是“第一”、“第二”、“第三”、等等的序數術語在申請專利範圍中修飾一申請專利範圍元件的使用本身並不意味一申請專利範圍元件相對另一申請專利範圍元件的任何優先、在先或順序、或是一種方法的動作被執行所用的時間的順序,而是只被使用作為標籤來區別一具有某一名稱的申請專利範圍元件與另一具有一相同的名稱(但是為了該序數術語而使用)的元件,以區別該些申請專利範圍元件而已。
如同在此所用的,對於一介於兩個端點之間的數值的參照應該被理解為涵蓋其中該數值可以具有該些端點的任一個的情況。例如,除非另有指出,否則陳述一特徵係具有一介於A到B之間或是介於約A到B之間的值應該被理解為表示所指出的範圍係包含該些端點A及B。
該些術語“大約”及“大致”在某些實施例中可被用來表示在一目標值的±20%之內、在某些實施例中是在一目標值的±10%之內、在某些實施例中是在一目標值的±5%之內、以及另外在某些實施例中是在一目標值的±2%之內。該些術語“大約”及“大致”可包含該目標值。
再者,在此使用的措辭及術語係為了說明之目的,因而不應該被視為限制性的。“包含”、“包括”、或是“具有”、“內含”、“涉及”、以及其變化的在此的使用係意謂涵蓋被列出在後面的項目及其等同物、以及額外的項目。
以上已經敘述至少一實施例的數個特點,將體認到的是各種的改變、修改、以及改良都將會輕易地被熟習此項技術者所思及。此種改變、修改、以及改良係欲為了此揭露內容之目的。於是,先前的說明及圖式只是舉例而已。
102:絕緣層/絕緣材料
104:釋放層
106:載體基板
108:金屬層
110:光阻層
112:金屬柱
114:超音波晶片
116:絕緣層
118:光阻層
120:金屬接點
122:晶粒附接膜(DAF)
124:囊封物
126:重分佈線(RDL)
128:焊料球
130:中介層
132:絕緣層
134:釋放層
136:載體基板
138:金屬層
140:光阻層
142:金屬柱
144:焊料球
146:底膠填充層
148:印刷電路板(PCB)
150:熱黏著層/熱黏著劑
4300:製程
4302:動作
4304:動作
4400:製程
4402:動作
4404:動作
4406:動作
各種的特點及實施例將會參考以下的範例且非限制性的圖來加以描述。應該體認到的是,該些圖並不一定按照比例繪製。出現在多個圖中的項目在它們出現的所有圖中都藉由相同或一類似的元件符號來加以指出。
圖1-37描繪根據在此所述的某些實施例的在超音波晶片的裝置的利用一製程的封裝期間的各種結構的橫截面;
圖38-42描繪根據在此所述的某些實施例的在超音波晶片的裝置的利用另一製程的封裝期間的各種結構的橫截面;
圖43描繪根據在此所述的某些實施例的用於封裝超音波晶片的範例的製程;以及
圖44描繪根據在此所述的某些實施例的用於封裝超音波晶片的範例的製程。
102:絕緣層
112:金屬柱
114:超音波晶片
116:絕緣層
120:金屬接點
124:囊封物
126:重分佈線(RDL)
128:焊料球
130:中介層
132:絕緣層
142:金屬柱
144:焊料球
146:底膠填充層
148:印刷電路板(PCB)
150:熱黏著層
Claims (29)
- 一種設備,其包括: 超音波晶片,其包括頂表面以及底表面; 中介層,其包括頂表面以及底表面;以及 重分佈層; 其中: 該超音波晶片的裝置的該頂表面耦接至該重分佈層;以及 該超音波晶片的裝置的該底表面耦接至該中介層的該頂表面。
- 如請求項1所述之設備,其進一步包括: 囊封該超音波晶片的裝置的囊封物;以及 第一金屬柱,其延伸穿過該囊封物,並且電耦接至該重分佈層。
- 如請求項2所述之設備,其中該中介層包括延伸穿過該中介層的第二金屬柱。
- 如請求項3所述之設備,其中該中介層包括鋁氮化物。
- 如請求項3所述之設備,其中該些第一金屬柱電耦接至該些第二金屬柱。
- 如請求項3所述之設備,其中該些第一金屬柱與該些第二金屬柱對準。
- 如請求項3所述之設備,其中焊料球將該些第一金屬柱電耦接至該些第二金屬柱。
- 如請求項2所述之設備,其進一步包括耦接至該中介層的該底表面的印刷電路板。
- 如請求項3所述之設備,其進一步包括耦接至該中介層的該底表面的印刷電路板。
- 如請求項9所述之設備,其中焊料球電耦接該些第二金屬柱至該印刷電路板。
- 如請求項1所述之設備,其中該超音波晶片透過熱黏著劑來耦接至該中介層。
- 如請求項1所述之設備,其進一步包括: 囊封該超音波晶片的裝置的囊封物;以及 金屬柱,其延伸穿過該中介層以及該囊封物,並且電耦接至該重分佈層。
- 如請求項12所述之設備,其中該中介層包括鋁氮化物。
- 如請求項11所述之設備,其進一步包括耦接至該中介層的該底表面的印刷電路板。
- 如請求項14所述之設備,其中焊料球係將該些金屬柱電耦接至該印刷電路板。
- 一種方法,其係包括: 耦接包括第一金屬柱的中介層至印刷電路板;以及 耦接該中介層至包含第二金屬柱的經封裝的超音波晶片。
- 如請求項16所述之方法,其中該經封裝的超音波晶片的裝置包括: 囊封該超音波晶片的裝置的囊封體;以及 重分佈層,其耦接至該超音波晶片的裝置; 其中該些第二金屬柱延伸穿過該囊封體並且電耦接至該重分佈層。
- 如請求項16所述之方法,其中該些第一金屬柱延伸穿過該中介層。
- 如請求項16所述之方法,其中該中介層包括鋁氮化物。
- 如請求項16所述之方法,其中將該中介層耦接至該經封裝的超音波晶片包括將該些第一金屬柱電耦接至該些第二金屬柱。
- 如請求項16所述之方法,其中將該中介層耦接至該經封裝的超音波晶片包括對準該些第一金屬柱與該些第二金屬柱。
- 如請求項16所述之方法,其中將該中介層耦接至該經封裝的超音波晶片包括透過焊料球來電耦接該些第一金屬柱至該些第二金屬柱。
- 如請求項16所述之方法,其中將該中介層耦接至該印刷電路板包括透過焊料球來電耦接該印刷電路板至該些第二金屬柱。
- 如請求項16所述之方法,其中將該中介層耦接至該經封裝的超音波晶片包括透過熱黏著劑來耦接該中介層至該經封裝的超音波晶片。
- 一種方法,其包括: 在中介層中形成金屬柱; 耦接該中介層至超音波晶片;以及 在該超音波晶片上形成重分佈層。
- 請求項25所述之方法,其中在該中介層中形成該些金屬柱包括形成該些金屬柱以使得該些金屬柱延伸超出該中介層的頂表面。
- 請求項25所述之方法,其進一步包括將該些金屬柱以及該超音波晶片的裝置囊封在囊封物中。
- 請求項25所述之方法,其中該中介層包括鋁氮化物。
- 請求項25所述之方法,其中形成該重分佈層包括電耦接該重分佈層至該超音波晶片以及該些金屬柱。
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Country | Link |
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US (2) | US11018068B2 (zh) |
EP (1) | EP3818372A4 (zh) |
JP (1) | JP2021529459A (zh) |
KR (1) | KR20210030951A (zh) |
CN (1) | CN112368574B (zh) |
AU (1) | AU2019297412A1 (zh) |
CA (1) | CA3105492A1 (zh) |
TW (1) | TW202011897A (zh) |
WO (1) | WO2020010207A1 (zh) |
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-
2019
- 2019-07-03 TW TW108123485A patent/TW202011897A/zh unknown
- 2019-07-03 CA CA3105492A patent/CA3105492A1/en active Pending
- 2019-07-03 JP JP2020571590A patent/JP2021529459A/ja active Pending
- 2019-07-03 EP EP19830619.3A patent/EP3818372A4/en active Pending
- 2019-07-03 KR KR1020217003420A patent/KR20210030951A/ko not_active Application Discontinuation
- 2019-07-03 WO PCT/US2019/040516 patent/WO2020010207A1/en unknown
- 2019-07-03 CN CN201980045060.6A patent/CN112368574B/zh active Active
- 2019-07-03 US US16/502,553 patent/US11018068B2/en active Active
- 2019-07-03 AU AU2019297412A patent/AU2019297412A1/en not_active Abandoned
-
2021
- 2021-03-04 US US17/191,829 patent/US11676874B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3818372A1 (en) | 2021-05-12 |
US20200013691A1 (en) | 2020-01-09 |
CA3105492A1 (en) | 2020-01-09 |
JP2021529459A (ja) | 2021-10-28 |
CN112368574B (zh) | 2023-08-01 |
US20210296195A1 (en) | 2021-09-23 |
US11676874B2 (en) | 2023-06-13 |
CN112368574A (zh) | 2021-02-12 |
KR20210030951A (ko) | 2021-03-18 |
WO2020010207A1 (en) | 2020-01-09 |
AU2019297412A1 (en) | 2021-01-28 |
EP3818372A4 (en) | 2022-04-06 |
US11018068B2 (en) | 2021-05-25 |
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