JP2021523596A5 - - Google Patents

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Publication number
JP2021523596A5
JP2021523596A5 JP2020560906A JP2020560906A JP2021523596A5 JP 2021523596 A5 JP2021523596 A5 JP 2021523596A5 JP 2020560906 A JP2020560906 A JP 2020560906A JP 2020560906 A JP2020560906 A JP 2020560906A JP 2021523596 A5 JP2021523596 A5 JP 2021523596A5
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JP
Japan
Prior art keywords
dielectric
substrate
intermediate layer
average
layer
Prior art date
Application number
JP2020560906A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021523596A (ja
JPWO2019213048A5 (https=
Filing date
Publication date
Priority claimed from US16/396,943 external-priority patent/US11239563B2/en
Application filed filed Critical
Publication of JP2021523596A publication Critical patent/JP2021523596A/ja
Publication of JPWO2019213048A5 publication Critical patent/JPWO2019213048A5/ja
Publication of JP2021523596A5 publication Critical patent/JP2021523596A5/ja
Withdrawn legal-status Critical Current

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JP2020560906A 2018-05-01 2019-04-30 基板に接着した電磁誘電構造体およびそれを製造する方法 Withdrawn JP2021523596A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201862665072P 2018-05-01 2018-05-01
US62/665,072 2018-05-01
US201862671022P 2018-05-14 2018-05-14
US62/671,022 2018-05-14
US16/396,943 2019-04-29
US16/396,943 US11239563B2 (en) 2018-05-01 2019-04-29 Electromagnetic dielectric structure adhered to a substrate and methods of making the same
PCT/US2019/029857 WO2019213048A1 (en) 2018-05-01 2019-04-30 Electromagnetic dielectric structure adhered to a substrate and methods of making the same

Publications (3)

Publication Number Publication Date
JP2021523596A JP2021523596A (ja) 2021-09-02
JPWO2019213048A5 JPWO2019213048A5 (https=) 2022-04-27
JP2021523596A5 true JP2021523596A5 (https=) 2022-04-27

Family

ID=68383754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020560906A Withdrawn JP2021523596A (ja) 2018-05-01 2019-04-30 基板に接着した電磁誘電構造体およびそれを製造する方法

Country Status (8)

Country Link
US (2) US11239563B2 (https=)
JP (1) JP2021523596A (https=)
KR (1) KR20210003183A (https=)
CN (1) CN112055917A (https=)
DE (1) DE112019002263T5 (https=)
GB (1) GB2587724B (https=)
TW (1) TW202013666A (https=)
WO (1) WO2019213048A1 (https=)

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US11239563B2 (en) * 2018-05-01 2022-02-01 Rogers Corporation Electromagnetic dielectric structure adhered to a substrate and methods of making the same
US12441879B2 (en) 2019-08-21 2025-10-14 Ticona Llc Polymer composition for laser direct structuring
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US12209164B2 (en) 2019-09-10 2025-01-28 Ticona Llc Polymer composition and film for use in 5G applications
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US12294185B2 (en) 2019-09-10 2025-05-06 Ticona Llc Electrical connector formed from a polymer composition having a low dielectric constant and dissipation factor
US12142820B2 (en) 2019-09-10 2024-11-12 Ticona Llc 5G system containing a polymer composition
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11721888B2 (en) * 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
WO2021173412A1 (en) 2020-02-26 2021-09-02 Ticona Llc Circuit structure
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US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system
CN116162361B (zh) * 2021-11-25 2024-04-09 广东中塑新材料有限公司 低介电lcp树脂材料及其制备方法
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