DE112019002263T5 - Auf ein Substrat befestigte elektromagnetische dielektrische Struktur und Verfahren zu deren Herstellung - Google Patents

Auf ein Substrat befestigte elektromagnetische dielektrische Struktur und Verfahren zu deren Herstellung Download PDF

Info

Publication number
DE112019002263T5
DE112019002263T5 DE112019002263.6T DE112019002263T DE112019002263T5 DE 112019002263 T5 DE112019002263 T5 DE 112019002263T5 DE 112019002263 T DE112019002263 T DE 112019002263T DE 112019002263 T5 DE112019002263 T5 DE 112019002263T5
Authority
DE
Germany
Prior art keywords
dielectric
substrate
dielectric structure
layer
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112019002263.6T
Other languages
German (de)
English (en)
Inventor
Stephen O'Connor
Gianni Taraschi
Christopher Brown
Kristi Pance
Karl Sprentall
Bruce Fitts
Dirk Baars
William Blasius
Murali Sethumadhavan
Roshin Rose George
Michael S. White
Michael Lunt
Sam Henson
John Dobrick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of DE112019002263T5 publication Critical patent/DE112019002263T5/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0485—Dielectric resonator antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Landscapes

  • Laminated Bodies (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Details Of Aerials (AREA)
  • Aerials With Secondary Devices (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
DE112019002263.6T 2018-05-01 2019-04-30 Auf ein Substrat befestigte elektromagnetische dielektrische Struktur und Verfahren zu deren Herstellung Withdrawn DE112019002263T5 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201862665072P 2018-05-01 2018-05-01
US62/665,072 2018-05-01
US201862671022P 2018-05-14 2018-05-14
US62/671,022 2018-05-14
US16/396,943 2019-04-29
US16/396,943 US11239563B2 (en) 2018-05-01 2019-04-29 Electromagnetic dielectric structure adhered to a substrate and methods of making the same
PCT/US2019/029857 WO2019213048A1 (en) 2018-05-01 2019-04-30 Electromagnetic dielectric structure adhered to a substrate and methods of making the same

Publications (1)

Publication Number Publication Date
DE112019002263T5 true DE112019002263T5 (de) 2021-02-18

Family

ID=68383754

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112019002263.6T Withdrawn DE112019002263T5 (de) 2018-05-01 2019-04-30 Auf ein Substrat befestigte elektromagnetische dielektrische Struktur und Verfahren zu deren Herstellung

Country Status (8)

Country Link
US (2) US11239563B2 (https=)
JP (1) JP2021523596A (https=)
KR (1) KR20210003183A (https=)
CN (1) CN112055917A (https=)
DE (1) DE112019002263T5 (https=)
GB (1) GB2587724B (https=)
TW (1) TW202013666A (https=)
WO (1) WO2019213048A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11239563B2 (en) * 2018-05-01 2022-02-01 Rogers Corporation Electromagnetic dielectric structure adhered to a substrate and methods of making the same
US12441879B2 (en) 2019-08-21 2025-10-14 Ticona Llc Polymer composition for laser direct structuring
US11637365B2 (en) 2019-08-21 2023-04-25 Ticona Llc Polymer composition for use in an antenna system
US11258184B2 (en) 2019-08-21 2022-02-22 Ticona Llc Antenna system including a polymer composition having a low dissipation factor
US12209164B2 (en) 2019-09-10 2025-01-28 Ticona Llc Polymer composition and film for use in 5G applications
US11912817B2 (en) 2019-09-10 2024-02-27 Ticona Llc Polymer composition for laser direct structuring
US11555113B2 (en) 2019-09-10 2023-01-17 Ticona Llc Liquid crystalline polymer composition
US12294185B2 (en) 2019-09-10 2025-05-06 Ticona Llc Electrical connector formed from a polymer composition having a low dielectric constant and dissipation factor
US12142820B2 (en) 2019-09-10 2024-11-12 Ticona Llc 5G system containing a polymer composition
US11646760B2 (en) 2019-09-23 2023-05-09 Ticona Llc RF filter for use at 5G frequencies
US11917753B2 (en) 2019-09-23 2024-02-27 Ticona Llc Circuit board for use at 5G frequencies
US11721888B2 (en) * 2019-11-11 2023-08-08 Ticona Llc Antenna cover including a polymer composition having a low dielectric constant and dissipation factor
WO2021173412A1 (en) 2020-02-26 2021-09-02 Ticona Llc Circuit structure
CN111864329A (zh) * 2020-08-03 2020-10-30 江西沃格光电股份有限公司 介质谐振器及其制备方法、介质滤波器和通信设备
CN112164900B (zh) * 2020-10-26 2021-09-28 北京邮电大学 一种等离子体介质谐振天线
TWI729965B (zh) * 2020-12-04 2021-06-01 財團法人金屬工業研究發展中心 複合積層板、殼體及行動通訊裝置
US11728559B2 (en) 2021-02-18 2023-08-15 Ticona Llc Polymer composition for use in an antenna system
CN116162361B (zh) * 2021-11-25 2024-04-09 广东中塑新材料有限公司 低介电lcp树脂材料及其制备方法
US20240329194A1 (en) * 2023-03-28 2024-10-03 Magna Electronics, Llc Metamaterial vehicle radar sensor assemblies

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6198450B1 (en) 1995-06-20 2001-03-06 Naoki Adachi Dielectric resonator antenna for a mobile communication
US6075485A (en) * 1998-11-03 2000-06-13 Atlantic Aerospace Electronics Corp. Reduced weight artificial dielectric antennas and method for providing the same
JP2001024420A (ja) * 1999-07-06 2001-01-26 Mitsumi Electric Co Ltd アンテナ素子
JP2003212649A (ja) * 2002-01-16 2003-07-30 Murata Mfg Co Ltd 高周波用誘電体磁器、誘電体共振器、誘電体フィルタ、誘電体デュプレクサおよび通信機装置
GB0207052D0 (en) * 2002-03-26 2002-05-08 Antenova Ltd Novel dielectric resonator antenna resonance modes
JP3843428B2 (ja) * 2002-10-31 2006-11-08 ソニーケミカル＆インフォメーションデバイス株式会社 チップ状アンテナ素子及びその製造方法、並びにアンテナ実装プリント配線基板
JP2005064548A (ja) * 2003-08-08 2005-03-10 Tdk Corp 誘電体共振アンテナ
JP4371141B2 (ja) * 2004-03-01 2009-11-25 株式会社村田製作所 絶縁体セラミック組成物、絶縁性セラミック焼結体および積層型セラミック電子部品
US7071879B2 (en) * 2004-06-01 2006-07-04 Ems Technologies Canada, Ltd. Dielectric-resonator array antenna system
EP1797617A4 (en) * 2004-10-01 2009-08-12 Rochemont L Pierre De CERAMIC ANTENNA MODULE AND MANUFACTURING METHOD THEREFOR
US7876283B2 (en) * 2005-12-15 2011-01-25 Stmicroelectronics S.A. Antenna having a dielectric structure for a simplified fabrication process
US20080129617A1 (en) * 2006-12-04 2008-06-05 Agc Automotive Americas R&D, Inc. Wideband Dielectric Antenna
US8497804B2 (en) * 2008-10-31 2013-07-30 Medtronic, Inc. High dielectric substrate antenna for implantable miniaturized wireless communications and method for forming the same
CN101593866B (zh) * 2009-06-30 2013-07-10 华南理工大学 带有t型匹配网络的介质谐振uhf rfid标签天线
US20110163921A1 (en) * 2010-01-06 2011-07-07 Psion Teklogix Inc. Uhf rfid internal antenna for handheld terminals
US8841777B2 (en) * 2010-01-12 2014-09-23 International Business Machines Corporation Bonded structure employing metal semiconductor alloy bonding
US8354339B2 (en) * 2010-07-20 2013-01-15 International Business Machines Corporation Methods to form self-aligned permanent on-chip interconnect structures
WO2016182571A1 (en) * 2015-05-13 2016-11-17 Intel Corporation Package with bi-layered dielectric structure
CN104993239A (zh) * 2015-07-16 2015-10-21 清华大学 一种高隔离度低交叉极化的三极化介质谐振天线
US10374315B2 (en) 2015-10-28 2019-08-06 Rogers Corporation Broadband multiple layer dielectric resonator antenna and method of making the same
CN105924151A (zh) * 2016-04-20 2016-09-07 苏州艾福电子通讯股份有限公司 微波介质陶瓷粉及其方法、微波介质陶瓷、微波元器件
US10062656B2 (en) * 2016-08-15 2018-08-28 Taiwan Semiconductor Manufacturing Co., Ltd. Composite bond structure in stacked semiconductor structure
CN106356616A (zh) * 2016-09-19 2017-01-25 西南交通大学 一种应用于wlan频段的介质谐振器天线
GB2575946B (en) * 2017-06-07 2022-12-14 Rogers Corp Dielectric resonator antenna system
US10910722B2 (en) * 2018-01-15 2021-02-02 Rogers Corporation Dielectric resonator antenna having first and second dielectric portions
US10892544B2 (en) * 2018-01-15 2021-01-12 Rogers Corporation Dielectric resonator antenna having first and second dielectric portions
US11239563B2 (en) * 2018-05-01 2022-02-01 Rogers Corporation Electromagnetic dielectric structure adhered to a substrate and methods of making the same
US11552390B2 (en) * 2018-09-11 2023-01-10 Rogers Corporation Dielectric resonator antenna system

Also Published As

Publication number Publication date
GB2587724A (en) 2021-04-07
US11239563B2 (en) 2022-02-01
GB202018311D0 (en) 2021-01-06
JP2021523596A (ja) 2021-09-02
KR20210003183A (ko) 2021-01-11
US20190341696A1 (en) 2019-11-07
WO2019213048A1 (en) 2019-11-07
US20220158351A1 (en) 2022-05-19
TW202013666A (zh) 2020-04-01
GB2587724B (en) 2023-02-01
US11545753B2 (en) 2023-01-03
CN112055917A (zh) 2020-12-08

Similar Documents

Publication Publication Date Title
DE112019002263T5 (de) Auf ein Substrat befestigte elektromagnetische dielektrische Struktur und Verfahren zu deren Herstellung
DE112015004703B4 (de) Magnetodielektrisches substrat, schaltungsmaterial und anordnung, die dieses aufweist
TWI720109B (zh) 包含六方晶系鐵氧體纖維之磁介電材料、其製作及使用方法
DE112016001291B4 (de) Magnetodielektrisches substrat sowie dessen herstellung, schaltungsmaterial sowie dessen herstellung und eine anordnung mit demschaltungsmaterial sowie schaltung und herstellung der schaltung, antenne und hf-bauelement
DE112019001476T5 (de) Schmelzverarbeitbarer thermoplastischer Verbundwerkstoff mit einem multimodalen dielektrischen Füllstoff
DE112015004511T5 (de) Magneto-dielektrisches Substrat, Schaltkreis-Material und Anordnung mit diesen
DE112020003417T5 (de) Magneto-dielektrische Materialien, Verfahren zu ihrer Herstellung und ihre Verwendungen
KR20200105671A (ko) 코어-쉘 입자, 자기-유전체 물질, 제조 방법, 및 이의 용도
DE112015004698T5 (de) Gruppenvorrichtung, Schaltungsmaterial und Baugruppe damit
DE112018002940T5 (de) Dielektrisches Resonator-Antennensystem
DE112019006028T5 (de) Dielektrische elektromagnetische Struktur und Verfahren zur Herstellung dieser Struktur
DE112018002313T5 (de) Elektromagnetischer Reflektor zur Verwendung in einem dielektrischen Resonator-Antennensystem
DE112019005002T5 (de) Gedruckte Leiterplatten-Substrate, bestehend aus einem beschichteten Bornitrid
TW201628263A (zh) 磁─介電基材

Legal Events

Date Code Title Description
R083 Amendment of/additions to inventor(s)
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee