TW202013666A - 基板上之電磁介電結構及其製作方法 - Google Patents
基板上之電磁介電結構及其製作方法 Download PDFInfo
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- TW202013666A TW202013666A TW108115067A TW108115067A TW202013666A TW 202013666 A TW202013666 A TW 202013666A TW 108115067 A TW108115067 A TW 108115067A TW 108115067 A TW108115067 A TW 108115067A TW 202013666 A TW202013666 A TW 202013666A
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- electromagnetic device
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0485—Dielectric resonator antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
Landscapes
- Laminated Bodies (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Details Of Aerials (AREA)
- Aerials With Secondary Devices (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Applications Claiming Priority (4)
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|---|---|---|---|
| US201862665072P | 2018-05-01 | 2018-05-01 | |
| US62/665,072 | 2018-05-01 | ||
| US201862671022P | 2018-05-14 | 2018-05-14 | |
| US62/671,022 | 2018-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202013666A true TW202013666A (zh) | 2020-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108115067A TW202013666A (zh) | 2018-05-01 | 2019-04-30 | 基板上之電磁介電結構及其製作方法 |
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| Country | Link |
|---|---|
| US (2) | US11239563B2 (https=) |
| JP (1) | JP2021523596A (https=) |
| KR (1) | KR20210003183A (https=) |
| CN (1) | CN112055917A (https=) |
| DE (1) | DE112019002263T5 (https=) |
| GB (1) | GB2587724B (https=) |
| TW (1) | TW202013666A (https=) |
| WO (1) | WO2019213048A1 (https=) |
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|---|---|---|---|---|
| US11239563B2 (en) * | 2018-05-01 | 2022-02-01 | Rogers Corporation | Electromagnetic dielectric structure adhered to a substrate and methods of making the same |
| US12441879B2 (en) | 2019-08-21 | 2025-10-14 | Ticona Llc | Polymer composition for laser direct structuring |
| US11637365B2 (en) | 2019-08-21 | 2023-04-25 | Ticona Llc | Polymer composition for use in an antenna system |
| US11258184B2 (en) | 2019-08-21 | 2022-02-22 | Ticona Llc | Antenna system including a polymer composition having a low dissipation factor |
| US12209164B2 (en) | 2019-09-10 | 2025-01-28 | Ticona Llc | Polymer composition and film for use in 5G applications |
| US11912817B2 (en) | 2019-09-10 | 2024-02-27 | Ticona Llc | Polymer composition for laser direct structuring |
| US11555113B2 (en) | 2019-09-10 | 2023-01-17 | Ticona Llc | Liquid crystalline polymer composition |
| US12294185B2 (en) | 2019-09-10 | 2025-05-06 | Ticona Llc | Electrical connector formed from a polymer composition having a low dielectric constant and dissipation factor |
| US12142820B2 (en) | 2019-09-10 | 2024-11-12 | Ticona Llc | 5G system containing a polymer composition |
| US11646760B2 (en) | 2019-09-23 | 2023-05-09 | Ticona Llc | RF filter for use at 5G frequencies |
| US11917753B2 (en) | 2019-09-23 | 2024-02-27 | Ticona Llc | Circuit board for use at 5G frequencies |
| US11721888B2 (en) * | 2019-11-11 | 2023-08-08 | Ticona Llc | Antenna cover including a polymer composition having a low dielectric constant and dissipation factor |
| WO2021173412A1 (en) | 2020-02-26 | 2021-09-02 | Ticona Llc | Circuit structure |
| CN111864329A (zh) * | 2020-08-03 | 2020-10-30 | 江西沃格光电股份有限公司 | 介质谐振器及其制备方法、介质滤波器和通信设备 |
| CN112164900B (zh) * | 2020-10-26 | 2021-09-28 | 北京邮电大学 | 一种等离子体介质谐振天线 |
| TWI729965B (zh) * | 2020-12-04 | 2021-06-01 | 財團法人金屬工業研究發展中心 | 複合積層板、殼體及行動通訊裝置 |
| US11728559B2 (en) | 2021-02-18 | 2023-08-15 | Ticona Llc | Polymer composition for use in an antenna system |
| CN116162361B (zh) * | 2021-11-25 | 2024-04-09 | 广东中塑新材料有限公司 | 低介电lcp树脂材料及其制备方法 |
| US20240329194A1 (en) * | 2023-03-28 | 2024-10-03 | Magna Electronics, Llc | Metamaterial vehicle radar sensor assemblies |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6198450B1 (en) | 1995-06-20 | 2001-03-06 | Naoki Adachi | Dielectric resonator antenna for a mobile communication |
| US6075485A (en) * | 1998-11-03 | 2000-06-13 | Atlantic Aerospace Electronics Corp. | Reduced weight artificial dielectric antennas and method for providing the same |
| JP2001024420A (ja) * | 1999-07-06 | 2001-01-26 | Mitsumi Electric Co Ltd | アンテナ素子 |
| JP2003212649A (ja) * | 2002-01-16 | 2003-07-30 | Murata Mfg Co Ltd | 高周波用誘電体磁器、誘電体共振器、誘電体フィルタ、誘電体デュプレクサおよび通信機装置 |
| GB0207052D0 (en) * | 2002-03-26 | 2002-05-08 | Antenova Ltd | Novel dielectric resonator antenna resonance modes |
| JP3843428B2 (ja) * | 2002-10-31 | 2006-11-08 | ソニーケミカル＆インフォメーションデバイス株式会社 | チップ状アンテナ素子及びその製造方法、並びにアンテナ実装プリント配線基板 |
| JP2005064548A (ja) * | 2003-08-08 | 2005-03-10 | Tdk Corp | 誘電体共振アンテナ |
| JP4371141B2 (ja) * | 2004-03-01 | 2009-11-25 | 株式会社村田製作所 | 絶縁体セラミック組成物、絶縁性セラミック焼結体および積層型セラミック電子部品 |
| US7071879B2 (en) * | 2004-06-01 | 2006-07-04 | Ems Technologies Canada, Ltd. | Dielectric-resonator array antenna system |
| EP1797617A4 (en) * | 2004-10-01 | 2009-08-12 | Rochemont L Pierre De | CERAMIC ANTENNA MODULE AND MANUFACTURING METHOD THEREFOR |
| US7876283B2 (en) * | 2005-12-15 | 2011-01-25 | Stmicroelectronics S.A. | Antenna having a dielectric structure for a simplified fabrication process |
| US20080129617A1 (en) * | 2006-12-04 | 2008-06-05 | Agc Automotive Americas R&D, Inc. | Wideband Dielectric Antenna |
| US8497804B2 (en) * | 2008-10-31 | 2013-07-30 | Medtronic, Inc. | High dielectric substrate antenna for implantable miniaturized wireless communications and method for forming the same |
| CN101593866B (zh) * | 2009-06-30 | 2013-07-10 | 华南理工大学 | 带有t型匹配网络的介质谐振uhf rfid标签天线 |
| US20110163921A1 (en) * | 2010-01-06 | 2011-07-07 | Psion Teklogix Inc. | Uhf rfid internal antenna for handheld terminals |
| US8841777B2 (en) * | 2010-01-12 | 2014-09-23 | International Business Machines Corporation | Bonded structure employing metal semiconductor alloy bonding |
| US8354339B2 (en) * | 2010-07-20 | 2013-01-15 | International Business Machines Corporation | Methods to form self-aligned permanent on-chip interconnect structures |
| WO2016182571A1 (en) * | 2015-05-13 | 2016-11-17 | Intel Corporation | Package with bi-layered dielectric structure |
| CN104993239A (zh) * | 2015-07-16 | 2015-10-21 | 清华大学 | 一种高隔离度低交叉极化的三极化介质谐振天线 |
| US10374315B2 (en) | 2015-10-28 | 2019-08-06 | Rogers Corporation | Broadband multiple layer dielectric resonator antenna and method of making the same |
| CN105924151A (zh) * | 2016-04-20 | 2016-09-07 | 苏州艾福电子通讯股份有限公司 | 微波介质陶瓷粉及其方法、微波介质陶瓷、微波元器件 |
| US10062656B2 (en) * | 2016-08-15 | 2018-08-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Composite bond structure in stacked semiconductor structure |
| CN106356616A (zh) * | 2016-09-19 | 2017-01-25 | 西南交通大学 | 一种应用于wlan频段的介质谐振器天线 |
| GB2575946B (en) * | 2017-06-07 | 2022-12-14 | Rogers Corp | Dielectric resonator antenna system |
| US10910722B2 (en) * | 2018-01-15 | 2021-02-02 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US10892544B2 (en) * | 2018-01-15 | 2021-01-12 | Rogers Corporation | Dielectric resonator antenna having first and second dielectric portions |
| US11239563B2 (en) * | 2018-05-01 | 2022-02-01 | Rogers Corporation | Electromagnetic dielectric structure adhered to a substrate and methods of making the same |
| US11552390B2 (en) * | 2018-09-11 | 2023-01-10 | Rogers Corporation | Dielectric resonator antenna system |
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| KR20210003183A (ko) | 2021-01-11 |
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| WO2019213048A1 (en) | 2019-11-07 |
| US20220158351A1 (en) | 2022-05-19 |
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| US11545753B2 (en) | 2023-01-03 |
| CN112055917A (zh) | 2020-12-08 |
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