JP2021519948A - フォトニクス構造光信号伝送領域の作製 - Google Patents

フォトニクス構造光信号伝送領域の作製 Download PDF

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JP2021519948A
JP2021519948A JP2020553629A JP2020553629A JP2021519948A JP 2021519948 A JP2021519948 A JP 2021519948A JP 2020553629 A JP2020553629 A JP 2020553629A JP 2020553629 A JP2020553629 A JP 2020553629A JP 2021519948 A JP2021519948 A JP 2021519948A
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layer
silicon nitride
optical signal
signal transmission
transmission region
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JPWO2019195367A5 (https=
JP2021519948A5 (https=
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クールボー、ダグラス
リーク、ジェラルド、ジュニア．
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ザ リサーチ ファンデーション フォー ザ ステート ユニバーシティ オブ ニューヨーク
ザ リサーチ ファンデーション フォー ザ ステート ユニバーシティ オブ ニューヨーク
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Publication of JP2021519948A publication Critical patent/JP2021519948A/ja
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • H10W10/011—Manufacture or treatment of isolation regions comprising dielectric materials
    • H10W10/012—Manufacture or treatment of isolation regions comprising dielectric materials using local oxidation of silicon [LOCOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/10—Isolation regions comprising dielectric materials
    • H10W10/13—Isolation regions comprising dielectric materials formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12061—Silicon
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12107—Grating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Woven Fabrics (AREA)
JP2020553629A 2018-04-05 2019-04-03 フォトニクス構造光信号伝送領域の作製 Pending JP2021519948A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862653232P 2018-04-05 2018-04-05
US62/653,232 2018-04-05
US16/372,763 US10816724B2 (en) 2018-04-05 2019-04-02 Fabricating photonics structure light signal transmission regions
US16/372,763 2019-04-02
PCT/US2019/025503 WO2019195367A1 (en) 2018-04-05 2019-04-03 Fabricating photonics structure light signal transmission regions

Publications (3)

Publication Number Publication Date
JP2021519948A true JP2021519948A (ja) 2021-08-12
JPWO2019195367A5 JPWO2019195367A5 (https=) 2022-04-08
JP2021519948A5 JP2021519948A5 (https=) 2022-04-08

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US (3) US10816724B2 (https=)
EP (1) EP3776031B1 (https=)
JP (1) JP2021519948A (https=)
KR (1) KR102806076B1 (https=)
SG (1) SG11202009806YA (https=)
TW (1) TWI776040B (https=)
WO (1) WO2019195367A1 (https=)

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TWI851601B (zh) 2018-11-21 2024-08-11 紐約州立大學研究基金會 光子光電系統及其製造方法
TWI829761B (zh) 2018-11-21 2024-01-21 紐約州立大學研究基金會 具有積體雷射的光學結構
US11550099B2 (en) 2018-11-21 2023-01-10 The Research Foundation For The State University Of New York Photonics optoelectrical system
KR20220086548A (ko) 2019-06-18 2022-06-23 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 포토닉스 구조 도전성 광 경로 제조
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US12147083B2 (en) * 2020-12-16 2024-11-19 Intel Corporation Hybrid manufacturing for integrating photonic and electronic components
US11500151B2 (en) * 2021-02-22 2022-11-15 Taiwan Semiconductor Manufacturing Company Limited Semiconductor arrangement and method of making
US11569268B1 (en) * 2021-08-05 2023-01-31 Globalfoundries U.S. Inc. Photonics chips including a fully-depleted silicon-on-insulator field-effect transistor
US11835764B2 (en) * 2022-01-31 2023-12-05 Globalfoundries U.S. Inc. Multiple-core heterogeneous waveguide structures including multiple slots
US20240377660A1 (en) * 2023-05-11 2024-11-14 Taiwan Semiconductor Manufacturing Co., Ltd. Optical devices and methods of manufacture

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