JP2021515983A5 - - Google Patents
Info
- Publication number
- JP2021515983A5 JP2021515983A5 JP2020546450A JP2020546450A JP2021515983A5 JP 2021515983 A5 JP2021515983 A5 JP 2021515983A5 JP 2020546450 A JP2020546450 A JP 2020546450A JP 2020546450 A JP2020546450 A JP 2020546450A JP 2021515983 A5 JP2021515983 A5 JP 2021515983A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit die
- channels
- solid circuit
- channel
- substrate
- Prior art date
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862639234P | 2018-03-06 | 2018-03-06 | |
| US62/639,234 | 2018-03-06 | ||
| PCT/IB2019/051585 WO2019171214A1 (en) | 2018-03-06 | 2019-02-27 | Automatic registration between circuit dies and interconnects |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021515983A JP2021515983A (ja) | 2021-06-24 |
| JPWO2019171214A5 JPWO2019171214A5 (https=) | 2022-03-10 |
| JP2021515983A5 true JP2021515983A5 (https=) | 2022-03-10 |
Family
ID=67846934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020546450A Pending JP2021515983A (ja) | 2018-03-06 | 2019-02-27 | 回路ダイと相互接続部との間の自動位置合わせ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20210035875A1 (https=) |
| EP (1) | EP3762965A1 (https=) |
| JP (1) | JP2021515983A (https=) |
| CN (1) | CN111819686A (https=) |
| TW (1) | TW201943010A (https=) |
| WO (1) | WO2019171214A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020058815A1 (en) | 2018-09-17 | 2020-03-26 | 3M Innovative Properties Company | Flexible device including conductive traces with enhanced stretchability |
| EP3906759A4 (en) | 2018-12-31 | 2022-10-12 | 3M Innovative Properties Company | Flexible circuits on soft substrates |
| US11937381B2 (en) | 2018-12-31 | 2024-03-19 | 3M Innovative Properties Company | Forming electrical interconnections using capillary microfluidics |
| US12020951B2 (en) | 2019-04-29 | 2024-06-25 | 3M Innovative Properties Company | Methods for registration of circuit dies and electrical interconnects |
| CN114746988A (zh) | 2019-12-04 | 2022-07-12 | 3M创新有限公司 | 包括微图案并使用部分固化以粘附管芯的电路 |
| EP4094289A1 (en) | 2020-01-24 | 2022-11-30 | 3M Innovative Properties Company | Electrical connections to embedded electronic components |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5454161A (en) * | 1993-04-29 | 1995-10-03 | Fujitsu Limited | Through hole interconnect substrate fabrication process |
| JPH06350233A (ja) * | 1993-06-10 | 1994-12-22 | Sankyo Seiki Mfg Co Ltd | 回路基板 |
| WO2006100790A1 (ja) * | 2005-03-22 | 2006-09-28 | Cluster Technology Co., Ltd. | 配線基板の製造方法及び配線基板 |
| JP2006332615A (ja) * | 2005-04-25 | 2006-12-07 | Brother Ind Ltd | パターン形成方法 |
| JP2008211150A (ja) * | 2007-02-28 | 2008-09-11 | Seiko Instruments Inc | ３次元構造体部品、及びその製造方法 |
| JP5606908B2 (ja) * | 2007-07-19 | 2014-10-15 | クラリアント・インターナショナル・アクチェンゲゼルシャフト | 微細伝導性構造体を表面に製造する方法 |
| CN102157510B (zh) * | 2010-02-12 | 2013-11-06 | 亿光电子工业股份有限公司 | 近接传感器封装结构及其制作方法 |
| JP2011249357A (ja) * | 2010-05-21 | 2011-12-08 | Panasonic Electric Works Co Ltd | 回路基板および回路基板の製造方法 |
| CN103190204B (zh) * | 2010-11-03 | 2016-11-16 | 3M创新有限公司 | 具有无引线接合管芯的柔性led器件 |
| KR101968635B1 (ko) * | 2012-11-22 | 2019-04-12 | 삼성전자주식회사 | 잉크젯 프린팅을 이용한 배선 형성 방법 |
| JP2017147269A (ja) * | 2016-02-15 | 2017-08-24 | 株式会社デンソー | 車両用電装部品の製造方法 |
-
2019
- 2019-02-27 CN CN201980017362.2A patent/CN111819686A/zh not_active Withdrawn
- 2019-02-27 JP JP2020546450A patent/JP2021515983A/ja active Pending
- 2019-02-27 US US16/976,126 patent/US20210035875A1/en not_active Abandoned
- 2019-02-27 EP EP19763578.2A patent/EP3762965A1/en not_active Withdrawn
- 2019-02-27 WO PCT/IB2019/051585 patent/WO2019171214A1/en not_active Ceased
- 2019-03-05 TW TW108107253A patent/TW201943010A/zh unknown
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