JP2021512990A5 - - Google Patents
Info
- Publication number
- JP2021512990A5 JP2021512990A5 JP2020543015A JP2020543015A JP2021512990A5 JP 2021512990 A5 JP2021512990 A5 JP 2021512990A5 JP 2020543015 A JP2020543015 A JP 2020543015A JP 2020543015 A JP2020543015 A JP 2020543015A JP 2021512990 A5 JP2021512990 A5 JP 2021512990A5
- Authority
- JP
- Japan
- Prior art keywords
- curable composition
- composition according
- polyamide
- weight
- present
- Prior art date
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862629347P | 2018-02-12 | 2018-02-12 | |
| US62/629,347 | 2018-02-12 | ||
| PCT/IB2019/050789 WO2019155327A2 (en) | 2018-02-12 | 2019-01-31 | Curable compositions, articles therefrom, and methods of making and using same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021512990A JP2021512990A (ja) | 2021-05-20 |
| JP2021512990A5 true JP2021512990A5 (https=) | 2022-02-08 |
| JPWO2019155327A5 JPWO2019155327A5 (https=) | 2022-02-08 |
Family
ID=67549323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020543015A Withdrawn JP2021512990A (ja) | 2018-02-12 | 2019-01-31 | 硬化性組成物、それから製造された物品、並びにその製造方法及び使用 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20210122952A1 (https=) |
| JP (1) | JP2021512990A (https=) |
| CN (1) | CN111770947A (https=) |
| DE (1) | DE112019000751T5 (https=) |
| WO (1) | WO2019155327A2 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11193016B2 (en) | 2018-05-09 | 2021-12-07 | 3M Innovative Properties Company | Curable and cured compositions |
| CN110684222B (zh) * | 2019-10-14 | 2020-12-29 | 深圳市峰泳科技有限公司 | 聚合物基复合介电材料及其制备方法 |
| US20220411625A1 (en) * | 2019-11-26 | 2022-12-29 | Ddp Specialty Electronic Materials Us, Llc | Epoxy based thermal interface material |
| EP4077459B1 (en) | 2019-12-19 | 2026-04-08 | 3M Innovative Properties Company | Two-part compositions including a uretdione-containing material and inorganic filler, products, and methods |
| WO2021134733A1 (zh) * | 2020-01-03 | 2021-07-08 | 耐特科技材料股份有限公司 | 用于锂电池模块且具有抑制热失控扩散的阻燃热塑材料 |
| EP4136183A4 (en) * | 2020-04-15 | 2023-12-27 | Henkel AG & Co. KGaA | TWO-PART THERMALLY CONDUCTIVE EPOXY ADHESIVE COMPOSITION |
| EP4232507A1 (en) * | 2020-10-22 | 2023-08-30 | 3M Innovative Properties Company | Curable compositions, articles therefrom, and methods of making and using same |
| JP7434197B2 (ja) * | 2021-02-08 | 2024-02-20 | プライムプラネットエナジー＆ソリューションズ株式会社 | 組電池 |
| KR20240005859A (ko) | 2021-05-05 | 2024-01-12 | 다우 글로벌 테크놀로지스 엘엘씨 | 고무 상용성을 갖는 열 인터페이스 재료 |
| CN116867862A (zh) * | 2021-09-10 | 2023-10-10 | 宁德时代新能源科技股份有限公司 | 电池、用电装置、制造电池的方法和装置 |
| KR102843540B1 (ko) * | 2022-12-02 | 2025-08-08 | 엔브이에이치코리아(주) | 배터리용 써멀베리어 |
| JP2026034874A (ja) * | 2022-12-28 | 2026-03-04 | 住友ベークライト株式会社 | 温調機能付きコネクターおよび樹脂バッテリーモジュール |
| JPWO2024162414A1 (https=) | 2023-01-31 | 2024-08-08 | ||
| EP4660275A1 (en) | 2023-01-31 | 2025-12-10 | Sekisui Chemical Co., Ltd. | Curable heat-conductive adhesive agent |
| KR102800603B1 (ko) * | 2024-03-29 | 2025-05-07 | (주)피엠씨 | 무기계 난연제를 포함하는 무용제형 난연 바닥재 조성물 |
| CN119955384B (zh) * | 2024-12-17 | 2025-10-03 | 江苏达美瑞新材料有限公司 | 一种低温固化聚酯树脂粉末涂料及其制备方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE518342A (https=) * | 1952-03-11 | 1900-01-01 | ||
| DE3901279A1 (de) * | 1989-01-18 | 1990-07-19 | Hoechst Ag | Verwendung von polyamidoaminen als haerter fuer epoxidharze und diese enthaltende haertbare mischungen |
| JPH09165494A (ja) * | 1995-11-16 | 1997-06-24 | Yuka Shell Epoxy Kk | 硬化性エポキシ樹脂組成物およびその使用 |
| US6008313A (en) * | 1997-11-19 | 1999-12-28 | Air Products And Chemicals, Inc. | Polyamide curing agents based on mixtures of polyethyleneamines and piperazine derivatives |
| US6500912B1 (en) * | 2000-09-12 | 2002-12-31 | Resolution Performance Products Llc | Epoxy resin system |
| US20090163615A1 (en) * | 2005-08-31 | 2009-06-25 | Izhar Halahmi | Uv curable hybridcuring ink jet ink composition and solder mask using the same |
| US9840588B2 (en) * | 2009-12-18 | 2017-12-12 | Hexion Inc. | Epoxy resin curing compositions and epoxy resin systems including same |
| CN103068946B (zh) * | 2010-08-10 | 2015-05-06 | 3M创新有限公司 | 环氧树脂结构粘合剂 |
| EP2468792A1 (en) * | 2010-12-23 | 2012-06-27 | 3M Innovative Properties Company | Curable adhesive composition |
| EP2495271B1 (en) * | 2011-03-04 | 2014-04-23 | 3M Innovative Properties Co. | Polyether hybrid epoxy curatives |
| KR101621991B1 (ko) * | 2011-04-29 | 2016-05-17 | 주식회사 엘지화학 | 전지 봉지용 접착제 조성물 및 접착필름 |
| WO2013095908A2 (en) * | 2011-12-20 | 2013-06-27 | Dow Global Technologies Llc | Epoxy resin composites |
| BR112015008613A2 (pt) * | 2012-10-24 | 2017-07-04 | Dow Global Technologies Llc | composição de poliamida, composição oligomérica, método para preparar a composição de poliamida, composição curável, processo para preparar um termofixo e artigo |
| WO2015023640A1 (en) * | 2013-08-13 | 2015-02-19 | 3M Innovative Properties Company | Nanocomposites containing silica nanoparticles and dispersant, composites, articles, and methods of making same |
| US10011699B2 (en) * | 2014-08-29 | 2018-07-03 | 3M Innovative Properties Company | Inductively curable composition |
| WO2017220137A1 (en) * | 2016-06-22 | 2017-12-28 | Evonik Degussa Gmbh | Curable liquid epoxy resin compositions useful as underfill material for semiconductor devices |
| WO2018005416A1 (en) * | 2016-06-30 | 2018-01-04 | 3M Innovative Properties Company | Dual curable thiol-ene composition, comprising a polythiol, an unsaturated compound, a photoinitiator and an organic hydroperoxide, as well as a cross-linked polymer sealant prepared therefrom for use in aerospace |
| DE102016220092A1 (de) * | 2016-10-14 | 2018-04-19 | Robert Bosch Gmbh | Halbzeug zur Kontaktierung von Bauteilen |
-
2019
- 2019-01-31 JP JP2020543015A patent/JP2021512990A/ja not_active Withdrawn
- 2019-01-31 DE DE112019000751.3T patent/DE112019000751T5/de not_active Withdrawn
- 2019-01-31 WO PCT/IB2019/050789 patent/WO2019155327A2/en not_active Ceased
- 2019-01-31 CN CN201980012826.0A patent/CN111770947A/zh not_active Withdrawn
- 2019-01-31 US US15/733,482 patent/US20210122952A1/en not_active Abandoned
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