CN111770947A - 可固化组合物、由其制得的制品,及其制造和使用方法 - Google Patents

可固化组合物、由其制得的制品,及其制造和使用方法 Download PDF

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Publication number
CN111770947A
CN111770947A CN201980012826.0A CN201980012826A CN111770947A CN 111770947 A CN111770947 A CN 111770947A CN 201980012826 A CN201980012826 A CN 201980012826A CN 111770947 A CN111770947 A CN 111770947A
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curable composition
composition
polyamide
cured
substrate
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Chinese (zh)
Inventor
姚犁
拉杰迪普·S·卡尔古特卡尔
马里奥·A·佩雷斯
韦恩·S·莫尼
杰里米·M·希金斯
布雷特·A·拜尔曼
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J135/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J135/02Homopolymers or copolymers of esters
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
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    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • C08G59/245Di-epoxy compounds carbocyclic aromatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44Amides
    • C08G59/46Amides together with other curing agents
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    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5006Amines aliphatic
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    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5006Amines aliphatic
    • C08G59/5013Amines aliphatic containing more than seven carbon atoms, e.g. fatty amines
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    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5033Amines aromatic
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    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02Polyamines
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    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D177/00Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D177/06Polyamides derived from polyamines and polycarboxylic acids
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    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/02Polyamines
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    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
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    • C09J11/04Non-macromolecular additives inorganic
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    • C09J177/00Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
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    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/62Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/625Vehicles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/60Heating or cooling; Temperature control
    • H01M10/65Means for temperature control structurally associated with the cells
    • H01M10/655Solid structures for heat exchange or heat conduction
    • H01M10/6551Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators
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    • C08K9/06Ingredients treated with organic substances with silicon-containing compounds
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    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00Batteries for particular applications
    • H01M2220/20Batteries in motive systems, e.g. vehicle, ship, plane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
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  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Secondary Cells (AREA)
  • Battery Mounting, Suspending (AREA)
CN201980012826.0A 2018-02-12 2019-01-31 可固化组合物、由其制得的制品,及其制造和使用方法 Withdrawn CN111770947A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862629347P 2018-02-12 2018-02-12
US62/629,347 2018-02-12
PCT/IB2019/050789 WO2019155327A2 (en) 2018-02-12 2019-01-31 Curable compositions, articles therefrom, and methods of making and using same

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US (1) US20210122952A1 (https=)
JP (1) JP2021512990A (https=)
CN (1) CN111770947A (https=)
DE (1) DE112019000751T5 (https=)
WO (1) WO2019155327A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116323774A (zh) * 2020-10-22 2023-06-23 3M创新有限公司 可固化组合物、由其制得的制品,及其制造和使用方法
CN119955384A (zh) * 2024-12-17 2025-05-09 江苏达美瑞新材料有限公司 一种低温固化聚酯树脂粉末涂料及其制备方法

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US11193016B2 (en) 2018-05-09 2021-12-07 3M Innovative Properties Company Curable and cured compositions
CN110684222B (zh) * 2019-10-14 2020-12-29 深圳市峰泳科技有限公司 聚合物基复合介电材料及其制备方法
US20220411625A1 (en) * 2019-11-26 2022-12-29 Ddp Specialty Electronic Materials Us, Llc Epoxy based thermal interface material
EP4077459B1 (en) 2019-12-19 2026-04-08 3M Innovative Properties Company Two-part compositions including a uretdione-containing material and inorganic filler, products, and methods
WO2021134733A1 (zh) * 2020-01-03 2021-07-08 耐特科技材料股份有限公司 用于锂电池模块且具有抑制热失控扩散的阻燃热塑材料
EP4136183A4 (en) * 2020-04-15 2023-12-27 Henkel AG & Co. KGaA TWO-PART THERMALLY CONDUCTIVE EPOXY ADHESIVE COMPOSITION
JP7434197B2 (ja) * 2021-02-08 2024-02-20 プライムプラネットエナジー&ソリューションズ株式会社 組電池
KR20240005859A (ko) 2021-05-05 2024-01-12 다우 글로벌 테크놀로지스 엘엘씨 고무 상용성을 갖는 열 인터페이스 재료
CN116867862A (zh) * 2021-09-10 2023-10-10 宁德时代新能源科技股份有限公司 电池、用电装置、制造电池的方法和装置
KR102843540B1 (ko) * 2022-12-02 2025-08-08 엔브이에이치코리아(주) 배터리용 써멀베리어
JP2026034874A (ja) * 2022-12-28 2026-03-04 住友ベークライト株式会社 温調機能付きコネクターおよび樹脂バッテリーモジュール
JPWO2024162414A1 (https=) 2023-01-31 2024-08-08
EP4660275A1 (en) 2023-01-31 2025-12-10 Sekisui Chemical Co., Ltd. Curable heat-conductive adhesive agent
KR102800603B1 (ko) * 2024-03-29 2025-05-07 (주)피엠씨 무기계 난연제를 포함하는 무용제형 난연 바닥재 조성물

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US2705223A (en) * 1952-03-11 1955-03-29 Gen Mills Inc Thermosetting resinous compositions from epoxy resins and polyamides derived from polymeric fat acids
US5017675A (en) * 1989-01-18 1991-05-21 Hoechst Ag Use of polyamidoamines as curing agents for epoxy resins and curable mixtures containing these substances wherein the acid component has oxyalkylene(repeating)units
CN1222540A (zh) * 1997-11-19 1999-07-14 气体产品与化学公司 以聚乙烯胺与哌嗪衍生物的混合物为基的聚酰胺熟化剂
US6500912B1 (en) * 2000-09-12 2002-12-31 Resolution Performance Products Llc Epoxy resin system
CN103068946A (zh) * 2010-08-10 2013-04-24 3M创新有限公司 环氧树脂结构粘合剂
US20130255879A1 (en) * 2010-12-23 2013-10-03 Pierre R. Bieber Curable adhesive composition
CN103391955A (zh) * 2011-03-04 2013-11-13 3M创新有限公司 聚醚混合环氧固化剂
CN104736595A (zh) * 2012-10-24 2015-06-24 陶氏环球技术有限公司 用于环氧树脂的聚酰胺硬化剂

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CN116323774A (zh) * 2020-10-22 2023-06-23 3M创新有限公司 可固化组合物、由其制得的制品,及其制造和使用方法
CN119955384A (zh) * 2024-12-17 2025-05-09 江苏达美瑞新材料有限公司 一种低温固化聚酯树脂粉末涂料及其制备方法

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US20210122952A1 (en) 2021-04-29

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