DE112019000751T5 - Härtbare Zusammensetzungen, Gegenstände daraus und Verfahren zur Herstellung und Verwendung derselben - Google Patents

Härtbare Zusammensetzungen, Gegenstände daraus und Verfahren zur Herstellung und Verwendung derselben Download PDF

Info

Publication number
DE112019000751T5
DE112019000751T5 DE112019000751.3T DE112019000751T DE112019000751T5 DE 112019000751 T5 DE112019000751 T5 DE 112019000751T5 DE 112019000751 T DE112019000751 T DE 112019000751T DE 112019000751 T5 DE112019000751 T5 DE 112019000751T5
Authority
DE
Germany
Prior art keywords
curable composition
polyamide
composition
weight
curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112019000751.3T
Other languages
German (de)
English (en)
Inventor
Li Yao
Rajdeep S. Kalgutkar
Mario A. Perez
Wayne S. Mahoney
Jeremy M. Higgins
Brett A. Beiermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of DE112019000751T5 publication Critical patent/DE112019000751T5/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J135/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J135/02—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/46—Amides together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C08G59/5013—Amines aliphatic containing more than seven carbon atoms, e.g. fatty amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D177/00—Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/02—Polyamines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
    • H01M10/625—Vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/60—Heating or cooling; Temperature control
    • H01M10/65—Means for temperature control structurally associated with the cells
    • H01M10/655—Solid structures for heat exchange or heat conduction
    • H01M10/6551—Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2220/00—Batteries for particular applications
    • H01M2220/20—Batteries in motive systems, e.g. vehicle, ship, plane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Secondary Cells (AREA)
  • Battery Mounting, Suspending (AREA)
DE112019000751.3T 2018-02-12 2019-01-31 Härtbare Zusammensetzungen, Gegenstände daraus und Verfahren zur Herstellung und Verwendung derselben Withdrawn DE112019000751T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201862629347P 2018-02-12 2018-02-12
US62/629,347 2018-02-12
PCT/IB2019/050789 WO2019155327A2 (en) 2018-02-12 2019-01-31 Curable compositions, articles therefrom, and methods of making and using same

Publications (1)

Publication Number Publication Date
DE112019000751T5 true DE112019000751T5 (de) 2020-12-17

Family

ID=67549323

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112019000751.3T Withdrawn DE112019000751T5 (de) 2018-02-12 2019-01-31 Härtbare Zusammensetzungen, Gegenstände daraus und Verfahren zur Herstellung und Verwendung derselben

Country Status (5)

Country Link
US (1) US20210122952A1 (https=)
JP (1) JP2021512990A (https=)
CN (1) CN111770947A (https=)
DE (1) DE112019000751T5 (https=)
WO (1) WO2019155327A2 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11193016B2 (en) 2018-05-09 2021-12-07 3M Innovative Properties Company Curable and cured compositions
CN110684222B (zh) * 2019-10-14 2020-12-29 深圳市峰泳科技有限公司 聚合物基复合介电材料及其制备方法
US20220411625A1 (en) * 2019-11-26 2022-12-29 Ddp Specialty Electronic Materials Us, Llc Epoxy based thermal interface material
EP4077459B1 (en) 2019-12-19 2026-04-08 3M Innovative Properties Company Two-part compositions including a uretdione-containing material and inorganic filler, products, and methods
WO2021134733A1 (zh) * 2020-01-03 2021-07-08 耐特科技材料股份有限公司 用于锂电池模块且具有抑制热失控扩散的阻燃热塑材料
EP4136183A4 (en) * 2020-04-15 2023-12-27 Henkel AG & Co. KGaA TWO-PART THERMALLY CONDUCTIVE EPOXY ADHESIVE COMPOSITION
EP4232507A1 (en) * 2020-10-22 2023-08-30 3M Innovative Properties Company Curable compositions, articles therefrom, and methods of making and using same
JP7434197B2 (ja) * 2021-02-08 2024-02-20 プライムプラネットエナジー＆ソリューションズ株式会社 組電池
KR20240005859A (ko) 2021-05-05 2024-01-12 다우 글로벌 테크놀로지스 엘엘씨 고무 상용성을 갖는 열 인터페이스 재료
CN116867862A (zh) * 2021-09-10 2023-10-10 宁德时代新能源科技股份有限公司 电池、用电装置、制造电池的方法和装置
KR102843540B1 (ko) * 2022-12-02 2025-08-08 엔브이에이치코리아(주) 배터리용 써멀베리어
JP2026034874A (ja) * 2022-12-28 2026-03-04 住友ベークライト株式会社 温調機能付きコネクターおよび樹脂バッテリーモジュール
JPWO2024162414A1 (https=) 2023-01-31 2024-08-08
EP4660275A1 (en) 2023-01-31 2025-12-10 Sekisui Chemical Co., Ltd. Curable heat-conductive adhesive agent
KR102800603B1 (ko) * 2024-03-29 2025-05-07 (주)피엠씨 무기계 난연제를 포함하는 무용제형 난연 바닥재 조성물
CN119955384B (zh) * 2024-12-17 2025-10-03 江苏达美瑞新材料有限公司 一种低温固化聚酯树脂粉末涂料及其制备方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE518342A (https=) * 1952-03-11 1900-01-01
DE3901279A1 (de) * 1989-01-18 1990-07-19 Hoechst Ag Verwendung von polyamidoaminen als haerter fuer epoxidharze und diese enthaltende haertbare mischungen
JPH09165494A (ja) * 1995-11-16 1997-06-24 Yuka Shell Epoxy Kk 硬化性エポキシ樹脂組成物およびその使用
US6008313A (en) * 1997-11-19 1999-12-28 Air Products And Chemicals, Inc. Polyamide curing agents based on mixtures of polyethyleneamines and piperazine derivatives
US6500912B1 (en) * 2000-09-12 2002-12-31 Resolution Performance Products Llc Epoxy resin system
US20090163615A1 (en) * 2005-08-31 2009-06-25 Izhar Halahmi Uv curable hybridcuring ink jet ink composition and solder mask using the same
US9840588B2 (en) * 2009-12-18 2017-12-12 Hexion Inc. Epoxy resin curing compositions and epoxy resin systems including same
CN103068946B (zh) * 2010-08-10 2015-05-06 3M创新有限公司 环氧树脂结构粘合剂
EP2468792A1 (en) * 2010-12-23 2012-06-27 3M Innovative Properties Company Curable adhesive composition
EP2495271B1 (en) * 2011-03-04 2014-04-23 3M Innovative Properties Co. Polyether hybrid epoxy curatives
KR101621991B1 (ko) * 2011-04-29 2016-05-17 주식회사 엘지화학 전지 봉지용 접착제 조성물 및 접착필름
WO2013095908A2 (en) * 2011-12-20 2013-06-27 Dow Global Technologies Llc Epoxy resin composites
BR112015008613A2 (pt) * 2012-10-24 2017-07-04 Dow Global Technologies Llc composição de poliamida, composição oligomérica, método para preparar a composição de poliamida, composição curável, processo para preparar um termofixo e artigo
WO2015023640A1 (en) * 2013-08-13 2015-02-19 3M Innovative Properties Company Nanocomposites containing silica nanoparticles and dispersant, composites, articles, and methods of making same
US10011699B2 (en) * 2014-08-29 2018-07-03 3M Innovative Properties Company Inductively curable composition
WO2017220137A1 (en) * 2016-06-22 2017-12-28 Evonik Degussa Gmbh Curable liquid epoxy resin compositions useful as underfill material for semiconductor devices
WO2018005416A1 (en) * 2016-06-30 2018-01-04 3M Innovative Properties Company Dual curable thiol-ene composition, comprising a polythiol, an unsaturated compound, a photoinitiator and an organic hydroperoxide, as well as a cross-linked polymer sealant prepared therefrom for use in aerospace
DE102016220092A1 (de) * 2016-10-14 2018-04-19 Robert Bosch Gmbh Halbzeug zur Kontaktierung von Bauteilen

Also Published As

Publication number Publication date
WO2019155327A3 (en) 2019-10-03
WO2019155327A2 (en) 2019-08-15
CN111770947A (zh) 2020-10-13
JP2021512990A (ja) 2021-05-20
US20210122952A1 (en) 2021-04-29

Similar Documents

Publication Publication Date Title
DE112019000751T5 (de) Härtbare Zusammensetzungen, Gegenstände daraus und Verfahren zur Herstellung und Verwendung derselben
DE112018005226T5 (de) Härtbare zusammensetzungen, gegenstände daraus und verfahren zu deren herstellung und verwendung
DE60223258T2 (de) Polysilazanmodifizierte polyaminhärtungsmittel für epoxidharze
KR102393692B1 (ko) 열 경화성 수지 조성물
US11193016B2 (en) Curable and cured compositions
JP2016501922A (ja) 高温用途用の強靭化された硬化可能エポキシ組成物
EP0379107A2 (de) Verwendung von polyamidoaminen als Härter für Epoxidharze und diese enthaltende härtbare Mischungen
JPH0834831A (ja) アミン変性されたエポキシ樹脂組成物
KR100854544B1 (ko) 에폭시-말단의 에스테르를 포함하는 망상구조 중합체
KR20200072358A (ko) 자동차용 이액형 접착제 조성물, 이의 경화물 및 자동차 소재 접착방법
JP6968018B2 (ja) エポキシ樹脂粉体塗料
WO2019088122A1 (ja) 熱硬化性樹脂組成物及びその製造方法
EP2519583B1 (en) Epoxy compositions and surfacing films therefrom
JP6704344B2 (ja) カチオン性アルキド樹脂
JP3902140B2 (ja) エポキシ樹脂組成物
KR102454135B1 (ko) 지방산 개질된 산 무수물기반 에폭시 화합물을 포함하는 이액형 에폭시 접착제 조성물 및 이로부터 제조된 경화물
JP2004026880A (ja) ガスバリア性樹脂組成物、塗料および接着剤
EP3320014B1 (de) Härtbare zusammensetzungen
JP4590927B2 (ja) 接着剤組成物
EP4453060B1 (en) Process for preparing a reshapable thermoset resin material
JP2016222777A (ja) ポリエステル変性エポキシ樹脂及び接着剤
DE1158255B (de) Verwendung von Mischungen aus Polyamiden und haertbaren Epoxydverbindungen zur Herstellung von Formkoerpern, einschliesslich Flaechengebilden
JP2019143106A (ja) 変性ポリフェニレンエーテル樹脂系高分子化合物、及び該高分子化合物を含む樹脂組成物
JP2004315652A (ja) エポキシ樹脂組成物及びこれを用いた床材
CN118434788A (zh) 用于制备可再成形的热固性树脂材料的方法

Legal Events

Date Code Title Description
R409 Internal rectification of the legal status completed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: C08G0059440000

Ipc: C08L0077000000

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee