JP2021510233A - マイクロ発光素子 - Google Patents
マイクロ発光素子 Download PDFInfo
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- JP2021510233A JP2021510233A JP2020526217A JP2020526217A JP2021510233A JP 2021510233 A JP2021510233 A JP 2021510233A JP 2020526217 A JP2020526217 A JP 2020526217A JP 2020526217 A JP2020526217 A JP 2020526217A JP 2021510233 A JP2021510233 A JP 2021510233A
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- light emitting
- micro light
- emitting diode
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- 239000007779 soft material Substances 0.000 claims abstract description 12
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- 229920005989 resin Polymers 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 22
- 239000011358 absorbing material Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 10
- 229910002704 AlGaN Inorganic materials 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 238000007373 indentation Methods 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000000994 depressogenic effect Effects 0.000 claims description 3
- 229910052755 nonmetal Inorganic materials 0.000 claims description 3
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- 229920002050 silicone resin Polymers 0.000 claims 2
- 230000031700 light absorption Effects 0.000 claims 1
- 238000002310 reflectometry Methods 0.000 claims 1
- 229910002601 GaN Inorganic materials 0.000 description 8
- 229920001296 polysiloxane Polymers 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000605 extraction Methods 0.000 description 4
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 238000005411 Van der Waals force Methods 0.000 description 2
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- 230000005496 eutectics Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
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- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000002144 chemical decomposition reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
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- 238000002834 transmittance Methods 0.000 description 1
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Abstract
Description
110 フレーム 200 マイクロ発光ダイオード、
120 犠牲層 210 発光拡張構造
130 転写材料層 220 電極
131 凹み 300 封止基板
132 穴
120 犠牲層
130 転写材料層
131 凹み
132 穴
140 遮光層
200 マイクロ発光ダイオード
210 発光拡張構造
220 電極
300 封止基板
Claims (38)
- 転写材料層とマイクロ発光ダイオードとを含むマイクロ発光素子であって、
前記転写材料層は、少なくとも前記マイクロ発光ダイオードのトップ面とサイド面を覆い、
前記転写材料層は、少なくとも転写状態と安定状態とに分けられ、
前記転写状態において前記転写材料層は軟質材であり、
前記安定状態において前記マイクロ発光ダイオードは前記転写材料層の凹みに配置されていることを特徴とするマイクロ発光素子。 - 前記マイクロ発光ダイオードは、前記凹みによる押圧によって発生するクランプ力を受けることを特徴とする請求項1に記載のマイクロ発光素子。
- 前記転写材料層の材料は、BCB樹脂、シリコーン又はエポキシ樹脂を含むことを特徴とする請求項1に記載のマイクロ発光素子。
- 前記凹みは、平滑な陥入開口を有することを特徴とする請求項1に記載のマイクロ発光素子。
- 前記凹みの深さが0.1〜5μmであることを特徴とする請求項1に記載のマイクロ発光素子。
- 前記凹みの深さが0.5〜1.5μmであることを特徴とする請求項1に記載のマイクロ発光素子。
- 前記マイクロ発光素子は更に、前記転写材料層の前記マイクロ発光ダイオードから離れた一側に設けられた犠牲層を含むことを特徴とする請求項1に記載のマイクロ発光素子。
- 前記犠牲層の前記転写材料層から離れた一側には、光透過性または光不透過性のフレームが設けられていることを特徴とする請求項7に記載のマイクロ発光素子。
- 前記犠牲層の材料は、GaN、AlGaN、InGaN、GaSiN、GaMgNのうち1つまたはそれ以上の組み合わせを含むことを特徴とする請求項7に記載のマイクロ発光素子。
- 前記マイクロ発光ダイオードは、フェイスアップ型マイクロ発光ダイオード、フリップ型マイクロ発光ダイオード、または垂直型マイクロ発光ダイオードであることを特徴とする請求項1〜9の何れか1項に記載のマイクロ発光素子。
- 前記転写材料層には、光不透過性材料が用いられ、前記光不透過性材料は少なくとも反射材または光吸収材を含むことを特徴とする請求項1〜9の何れか1項に記載のマイクロ発光素子。
- 前記マイクロ発光ダイオードの前記トップ面に対応する位置にある前記転写材料層には、光射出孔が設けられていることを特徴とする請求項11に記載のマイクロ発光素子。
- 転写材料層と複数のマイクロ発光ダイオードを含むマイクロ発光素子アレイであって、
前記転写材料層は、少なくとも前記マイクロ発光ダイオードのトップ面、又は、サイド面を覆い、
前記転写材料層は、少なくとも転写状態と安定状態とを有し、
前記転写状態では、前記転写材料層は軟質材であり、
前記安定状態では、前記マイクロ発光ダイオードが前記転写材料層の凹みに配置されていることを特徴とするマイクロ発光素子アレイ。 - 前記マイクロ発光ダイオードは、前記凹みによる押圧によって発生するクランプ力を受けることを特徴とする請求項13に記載のマイクロ発光素子アレイ。
- 前記転写材料層の材料は、BCB樹脂、シリコーン又はエポキシ樹脂を含むことを特徴とする請求項13に記載のマイクロ発光素子アレイ。
- 前記凹みは、平滑な陥入開口を有することを特徴とする請求項13に記載のマイクロ発光素子アレイ。
- 前記凹みの深さが0.1〜5μmであることを特徴とする請求項13に記載のマイクロ発光素子アレイ。
- 前記凹みの深さが0.5〜1.5μmであることを特徴とする請求項13に記載のマイクロ発光素子アレイ。
- 更に、前記転写材料層の前記マイクロ発光ダイオードから離れた一側に設けられた犠牲層を含むことを特徴とする請求項13に記載のマイクロ発光素子アレイ。
- 前記犠牲層は、透明材であることを特徴とする請求項19に記載のマイクロ発光素子アレイ。
- 前記犠牲層の材料は、GaN、AlGaN、InGaN、GaSiN、GaMgNのうち1つまたはそれ以上の組み合わせを含むことを特徴とする請求項19に記載のマイクロ発光素子アレイ。
- 前記転写材料層には、光不透過性材料が用いられ、前記光不透過性材料は少なくとも反射材または光吸収材を含むことを特徴とする請求項13に記載のマイクロ発光素子アレイ。
- 前記マイクロ発光ダイオードの前記トップ面に対応する位置にある前記転写材料層には、光射出孔が設けられていることを特徴とする請求項22に記載のマイクロ発光素子アレイ。
- 前記マイクロ発光ダイオードは、フェイスアップ型マイクロ発光ダイオード、フリップ型マイクロ発光ダイオード、または垂直型マイクロ発光ダイオードであることを特徴とする請求項13に記載のマイクロ発光素子アレイ。
- 隣接する前記マイクロ発光ダイオード間の前記転写材料層の前記マイクロ発光ダイオードから離れた一面は、遮光層を有することを特徴とする請求項13〜21の何れか1項に記載のマイクロ発光素子アレイ。
- 前記遮光層は、モザイク状に前記転写材料層内に設けられていることを特徴とする請求項25に記載のマイクロ発光素子アレイ。
- 前記遮光層は、反射性または光吸収性を有することを特徴とする請求項25に記載のマイクロ発光素子アレイ。
- 前記遮光層は、金属または非金属を含むことを特徴とする請求項25に記載のマイクロ発光素子アレイ。
- 前記マイクロ発光素子アレイは、前記マイクロ発光ダイオードの一側に前記マイクロ発光ダイオードと接合される接合基板を含んでいることを特徴とする請求項13に記載のマイクロ発光素子アレイ。
- 前記マイクロ発光ダイオードは、赤色発光ダイオード、青色発光ダイオード、緑色発光ダイオードまたはそれらの組み合わせを含むことを特徴とする請求項13に記載のマイクロ発光素子アレイ。
- (1)フレームを用意するステップと、
(2)前記フレームに犠牲層を設けるステップと、
(3)前記犠牲層の表面に転写材料層を設け、前記転写材料層は、少なくとも転写状態と安定状態とを有し、少なくとも前記転写状態において前記転写材料層は軟質材であるステップと、
(4)前記転写材料層を用いて前記マイクロ発光ダイオードアレイを転写し、前記マイクロ発光ダイオードによる押圧により前記転写材料層が陥没し、凹みを形成し、その深さは0.1〜5μmであり、前記マイクロ発光ダイオードが前記転写材料層の前記凹みに挟み込まれることによりマイクロ発光素子アレイを得るステップとを
有することを特徴とするマイクロ発光素子アレイの製造方法。 - 前記凹みの深さが0.5〜1.5μmであることを特徴とする請求項31に記載の製造方法。
- 前記ステップ(4)で得られた前記マイクロ発光素子アレイが基板に接合されるステップ(5)を更に含むことを特徴とする請求項31に記載の製造方法。
- 前記ステップ(5)の後に、前記犠牲層と前記フレームとを除去することを特徴とする請求項33に記載の製造方法。
- 前記ステップ(2)の後で且つ前記ステップ(3)の前に、前記犠牲層の前記フレームから離れた表面に分散して遮光層が設けられ、前記遮光層は隣接する前記マイクロ発光ダイオード間の前記犠牲層に対応する位置に分布していることを特徴とする請求項31〜34の何れか1項に記載の製造方法。
- 前記ステップ(3)では前記転写材料層は、光不透過性材料が用いられ、前記光不透過性材料は少なくとも反射材または光吸収材を含むことを特徴とする請求項31に記載の製造方法。
- 前記ステップ(4)の後に、前記転写材料層に対する孔開け工程を少なくとも含み、前記マイクロ発光ダイオードに近い領域の前記転写材料層の一部を除去し、前記マイクロ発光ダイオードのトップ面の一部、又は、全部を露出させるようにすることを特徴とする請求項36に記載の製造方法。
- 前記転写材料層を用いて前記マイクロ発光ダイオードアレイを転写するステップを有し、転写の方法にはインプリント加工またはピックアップ加工を含むことを特徴とする請求項31に記載の製造方法。
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CN113066812A (zh) | 2021-07-02 |
US11616094B2 (en) | 2023-03-28 |
KR102397321B1 (ko) | 2022-05-12 |
US20200321392A1 (en) | 2020-10-08 |
CN113066812B (zh) | 2023-05-05 |
JP7106640B2 (ja) | 2022-07-26 |
WO2019119706A1 (zh) | 2019-06-27 |
CN108258006B (zh) | 2021-04-06 |
KR20200084043A (ko) | 2020-07-09 |
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