JP2021190673A - Substrate transfer unit for heat treatment device - Google Patents

Abstract

To provide a substrate transfer unit for a heat treatment device.SOLUTION: A substrate transfer unit for a heat treatment device according to the present invention includes a heat treatment apparatus including a chamber in which a heater is mounted and a large number of racks installed across the surface of the heater inside the chamber, and a ball transfer that is arranged in place so as to project along the surface of the rack and induces transport and transfer to a substrate before and after heat treatment by the heat treatment apparatus.SELECTED DRAWING: Figure 3

Description

The present invention relates to a substrate transfer unit of a heat treatment apparatus, which is used by mounting it on a rack of the heat treatment apparatus for heat-treating or transporting a glass substrate.

Flat panel displays such as organic light emitting displays and LCDs have been applied to various types of image devices such as TVs, mobile phones, monitors, etc. In recent years, in the manufacture of flat panel displays, in order to improve performance and yield. Equipment continues to be improved. The performance of the oven chamber used in the flat panel display manufacturing process is also being improved.

For example, a flat panel display such as a TFT LCD (Thin Film Transistor Liquid Crystal Display) has a thin film transistor deposition process for depositing thin film transistors, pixel electrodes, RGB pixels and common electrodes on a glass substrate, a photoresist coating process, a baking process, and the like. It is manufactured through an exposure process, a development process, an etching process, and the like.

The heat treatment device (oven chamber) used in the flat panel display manufacturing process heats a glass substrate to dry and preheat it before putting it into a photoresist coating facility using an internal heater as a heat source for a hot plate. Alternatively, it is used in a baking process in which a glass substrate coated with a photoresist film is heated for a certain period of time to cure the photoresist film.

The glass substrate heat treatment apparatus is proposed in Patent Document 1 and Patent Document 2 in "LCD glass oven chamber".

On the other hand, the size of flat panel displays tends to be continuously increased. For example, the 5th generation glass substrate has a size of 1,100 × 1,250 mm, and the 6th generation glass substrate has a size of 1800 × 2,100 mm, and the size is gradually increased.

In order to transfer the heat-treated glass substrate to the heat-treated glass substrate or the glass substrate which has been heat-treated, the heat-treated apparatus is provided with a separate transfer unit (transfer unit).

When the heat treatment apparatus is provided with a separate transfer unit, it can be used repeatedly without being corroded at high temperatures only if it has heat resistance to withstand high temperatures and hardness lower than that of the glass substrate to be heated.

Also, if the heat treatment equipment is equipped with a separate transfer unit, can any method be used to absorb impact or reduce friction during transfer or transfer of the glass substrate without damaging the glass substrate? Should be considered.

If the glass substrate is scratched when the transport unit comes into contact with the glass substrate, it is determined to be a defective product when the display is manufactured, resulting in cost loss.

If the impact is not absorbed and friction occurs during the transfer or transfer of the glass substrate, unevenness including scratches may occur on the coated surface of the glass substrate, and the glass substrate receives local thermal stress and next. There is a risk that defects will occur in the process of, or that even a slight impact will easily damage the glass.

As a result, by inducing the peripheral part of the heat treatment apparatus that heat-treats the glass substrate so that the glass substrate can be efficiently transported or loaded, high efficiency can be obtained by improving the yield of the product and reducing the cost. There is a need for a new substrate transfer unit that can be used.

Korean Publication No. 10-2020-0001672 Gazette (published January 7, 2020) Korean Registered Patent No. 10-1471028 (Public Notice on December 10, 2014) Korean Registered Patent No. 10-2081801 (published on February 26, 2020)

An object of the present invention is to provide a substrate transfer unit for a heat treatment apparatus that can be mounted on a rack of the heat treatment apparatus and used.

Another object of the present invention is to make it possible to absorb or pass the impact transmitted to the glass substrate in the process of transporting or transferring the glass substrate, thereby ensuring scratch resistance to the glass substrate. The purpose is to provide a substrate transfer unit.

Another object of the present invention is to provide a substrate transfer unit for a heat treatment apparatus, which reduces manufacturing costs and has excellent high-temperature heat resistance.

The above object is, according to the present invention, a heat treatment apparatus including a chamber in which a heater is mounted and a large number of racks installed across the surface of the heater inside the chamber, and a protrusion along the surface of the rack. It is achieved by a substrate transfer unit of a heat treatment apparatus, including a ball transfer which is arranged in place so as to guide the transfer and transfer of the substrate to and from the substrate before and after the heat treatment by the heat treatment apparatus.

According to the embodiment of the present invention, the ball transfer includes a head block that protrudes in the vertical direction on the surface of the rack and has a housing formed inside, and a ball that is housed in the housing and supports the substrate from the vertical direction. A base block assembled by an insert method on a rack inside a chamber of the heat treatment apparatus to elastically support the head block, and intervening between the head block and the base block, the head block and the base block It can be configured to include a cushioning spring that forms an elastic deformation space between them.

According to the embodiment of the present invention, the lower end portion of the head block and the upper end portion of the base block can each be configured by a flange portion having a wide surface on which a buffer spring is fixed.

According to the embodiment of the present invention, the housing of the head block can be filled with a large number of granular rolling balls that induce the rotational and rolling motion of the balls that support the substrate loaded on the upper portion.

According to an embodiment of the present invention, the base block prevents a lower assembly head assembled by an insert method along an assembly hole provided on a rack inside a chamber of the heat treatment apparatus, and a downward detachment of the assembly head. Therefore, the upper part can be configured with a flange having an expanded area as compared with the lower part.

According to the embodiment of the present invention, the buffer spring is a straight coil spring, a conical spiral coil spring having a wider lower portion than the upper portion, and a pot-shaped spiral coil having a narrow upper and lower portions and a wide middle. It can be configured with any one selected from the springs.

According to an embodiment of the present invention, the cushioning spring can be composed of an inconel spring.

The substrate transfer unit of the heat treatment apparatus according to the present invention has a ball transfer inside the chamber of the heat treatment apparatus so that it can be mounted on the rack of the heat treatment apparatus and used. While reducing the amount, there is an effect that the glass substrate can be effectively transported or transferred from the heat treatment apparatus.

The substrate transfer unit of the heat treatment apparatus according to the present invention has scratch resistance to the glass substrate so as to be able to absorb or pass the impact transmitted to the glass substrate in the process of transporting or transferring the glass substrate from the heat treatment apparatus. By ensuring the above, there is an effect that the production yield of a high-quality glass substrate can be obtained.

The substrate transfer unit of the heat treatment apparatus according to the present invention has a temperature of about 705 ° C. by forming a transfer unit including ball transfer using an inconel spring, which is a nickel-chromium heat-resistant alloy steel that can be used even at high temperatures. It can secure high temperature durability without oxidation, has excellent resistance to relaxation, and has the effect of being able to be used repeatedly at high temperatures.

It is an example explaining the chamber of a heat treatment apparatus. It is an example which shows the chamber of the heat treatment apparatus which concerns on one Embodiment of this invention, and the substrate transfer unit installed inside the chamber. It is an example explaining the substrate transfer unit of the heat treatment apparatus which concerns on one Embodiment of this invention. It is an example which excerpts and shows the ball transfer which constitutes the substrate transfer unit of the heat treatment apparatus which concerns on one Embodiment of this invention. It is an example of a ball rolling rotary ball transfer constituting a substrate transport unit according to an embodiment of the present invention. It is an example of the ball fixed type ball transfer which constitutes the substrate transfer unit which concerns on one Embodiment of this invention. An example showing an inconnell coil spring according to an embodiment of the present invention, (a) is a straight type coil spring, (b) a conical spiral coil spring, and (c) is a pot type spiral coil spring. Is an example showing.

Hereinafter, the specific contents of the "base transfer unit of the heat treatment apparatus" according to the preferred embodiment of the present invention will be described with reference to the accompanying drawings.

Among the terms used in the description of the present invention, "heat treatment apparatus" may be mixed with "LCD glass oven chamber". "Substrate" may be mixed with "glass substrate".

FIG. 1 is an example illustrating a heat treatment apparatus.

As shown in FIG. 1, the heat treatment apparatus 100 includes a chamber 110 in which a heater 200 is installed, and is configured to perform a function of charging process gas to heat or dry the substrate GL.

The chamber 110 is provided on one side with an input port 111 through which a substrate GL such as a glass light emitting display device or an LCD glass substrate (hereinafter referred to as “substrate GL” or “glass substrate”) that requires heat drying is passed.

A heater 200 is mounted on the chamber 110, and the heat generated energy is configured to heat the substrate GL charged through the charging port 111 or evaporate and dry the water content.

More specifically, from a planar heating element in which upper / lower heat transfer hot plates (not shown) that generate heat by receiving the heat of the heater 200 are arranged in a layered laminated type on the upper / lower part of the heater 200. It may be configured and placed in a mounting mold in the chamber 110 to heat the substrate GL or to evaporate and dry the moisture.

Further, in the peripheral portion of the chamber 110, in order to improve the heating and drying efficiency of the substrate GL, an intake port 112 for inflowing a fluid containing a process gas and an exhaust port 113 for exhausting the fluid in the chamber 110 are provided in the chamber. It can be configured to include a frame 120 with a lug 121 that supports and supports 110, and a conductive portion 130 to which a large number of bus bars 131 that connect a heating wire of a heater 200 to energize an electric current are connected.

A large number of racks 140 that cross the surface of the heater 200 are provided inside the chamber 110, and can be configured to carry or transfer the glass substrate GL before and after the heat treatment step.

However, the conventional heat treatment apparatus 100 lacks an effective transfer unit capable of effectively transporting or transferring the glass substrate GL.

Therefore, when operating the conventional heat treatment apparatus 100, for example, after the glass substrate GL is charged and the heating step is performed, the heat-treated substrate GL is transmitted to the glass substrate GL in the work process of transporting or transferring the heat-treated substrate GL. It is difficult to effectively absorb the impact.

Further, since scratches may occur on the surface of the substrate GL in the process of transporting or transferring the substrate GL, there is a problem that it is difficult to manufacture a high-quality glass substrate and the manufacturing yield is low.

Thereby, according to the present invention, by arranging the ball transfer around the rack configured inside the chamber of the heat treatment apparatus, the glass substrate is effectively transferred or loaded from the heat treatment apparatus while reducing the additional equipment cost. We present a substrate transfer unit for heat treatment equipment.

Further, the present invention ensures scratch resistance to the glass substrate by making it possible to absorb or pass the impact transmitted to the glass substrate in the process of transporting or transferring the glass substrate from the heat treatment apparatus. We present a substrate transfer unit for heat treatment equipment that guides the production yield of high quality glass substrates.

Further, in the present invention, a transfer unit including a ball transfer is configured by using an inconel spring, which is a nickel-chromium heat-resistant alloy steel that can be used even at a high temperature, so that the temperature is high without being oxidized at a temperature of about 705 ° C. Presenting a substrate transfer unit of a heat treatment apparatus capable of ensuring durability, having excellent resistance to relaxation, and being able to be used repeatedly at high temperatures.

FIG. 2 is an example showing a chamber of the heat treatment apparatus according to the embodiment of the present invention and a substrate transfer unit installed in the chamber.

FIG. 3 is an example illustrating a substrate transfer unit of the heat treatment apparatus according to the embodiment of the present invention.

As shown in FIGS. 2 and 3, the substrate transfer unit A of the heat treatment apparatus 100 according to the present invention can be configured by installing the rack 140 installed in the chamber 110 of the heat treatment apparatus 100 at the center.

Its main part is a heat treatment apparatus 100 including a chamber 110 in which the heater 200 is arranged and a large number of racks 140 installed across the surface of the heater 200 in the chamber 110, as shown in FIGS. 2 and 3. It is composed.

Further, the substrate transfer unit A of the heat treatment apparatus is arranged in an appropriate position so as to project along the surface of the rack 140 installed in the chamber 110 of the heat treatment apparatus 100, and is a ball transfer that guides the transfer and transfer of the substrate GL. It can be configured to include 300.

FIG. 4 is an example showing an excerpt of a ball transfer constituting a substrate transfer unit of the heat treatment apparatus according to the embodiment of the present invention.

FIG. 5 is an example of a ball rolling rotary ball transfer constituting a substrate transport unit according to an embodiment of the present invention.

FIG. 6 is an example of a ball-fixed ball transfer constituting a substrate transfer unit according to an embodiment of the present invention.

As shown in FIGS. 4 to 6, the ball transfer 300 is composed of a head block 301 that protrudes in the direction perpendicular to the surface of the rack 140 installed in the chamber 110 of the heat treatment apparatus 100 and has a housing 302 formed inside. To.

Further, the ball transfer includes a ball 330 housed in the housing 302 and vertically supporting the substrate GL.

Further, the ball transfer includes a base block 310 which is assembled by an insert method on a rack 140 inside the chamber 110 of the heat treatment apparatus 100 in order to elastically support the head block 301.

Further, the ball transfer can be configured to include a buffer spring 320 that is interposed between the head block 301 and the base block 310 and forms an elastic deformation space between the head block 301 and the base block 310.

Through such a ball transfer 300, the shock absorbing spring 320 receives the impact of the vertical load W1 transmitted to the glass substrate during the transfer or transfer process of the substrate GL before and after the heat treatment of the glass substrate GL using the heat treatment apparatus 100. By effectively absorbing through the substrate, damage to the substrate can be minimized.

The lateral load S1 applied to the substrate GL can be passed through the ball 330 as it is without frictional resistance, so that scratch resistance to the glass substrate GL can be ensured.

Further, in the ball transfer 300 constituting the substrate transfer unit A of the heat treatment apparatus 100, as shown in FIGS. 4 to 6, the lower end portion of the head block 301 and the upper end portion of the base block 310 each stably hold the spring 320. It can be composed of flange portions 303, 313 having a wide surface having an expanded diameter or width as compared with the upper portion of the head block 301 and the lower portion of the base block 310 for fixing without idleness.

Further, as shown in FIGS. 4 to 6, in the ball transfer 300 constituting the substrate transfer unit A of the heat treatment apparatus 100, the rotation of the ball 330 that supports the substrate GL loaded on the housing 302 of the head block 301 is rotated. A large number of rolling balls 331 that induce rolling motion can be filled in the empty space of the housing 302.

When a large number of rolling balls 331 that induce the rotational and rolling motion of the balls 330 that support the substrate GL are filled in the empty space of the housing 302 of the head block 301, and the main balls 330 are inserted into the space for assembly. , The rolling motion of the main ball 330 itself can be induced according to the vertical and horizontal loads W1 and S1 transmitted from the substrate GL.

As a result, the ball 330 can respond by rolling action to the vertical and horizontal loads W1 and S1 transmitted to the substrate GL, so that the frictional resistance due to the vertical and horizontal loads W1 and S1 transmitted to the substrate GL is minimized. Damage due to surface scratches or friction on the substrate GL can be effectively reduced to the limit.

Further, in the ball transfer 300 constituting the substrate transfer unit A of the heat treatment apparatus 100, as shown in FIGS. 4 to 6, the base block 310 is provided in the assembly hole 141 on the rack 140 inside the chamber 110 of the heat treatment apparatus 100. It can be configured to include the lower assembly head 311 which is assembled by the insert method along the above.

Further, the ball transfer can be configured with a flange portion 313 whose upper portion has an expanded area as compared to the lower portion in order to prevent the assembly head 311 from coming off downward.

7 (a), (b) and (c) are examples showing the Inconel coil spring according to the embodiment of the present invention.

As shown in FIG. 7, a buffer spring 320 having various shapes and structures can be applied to the ball transfer 300 constituting the substrate transfer unit A of the heat treatment apparatus 100 according to the present invention.

Preferably, the Inconel coil springs as shown in FIGS. 7 (a), (b) and (c) can be selectively applied.

For example, a straight coil spring, a conical spiral coil spring having a wider lower portion than the upper portion, and a pot-shaped spiral coil spring having a narrow upper portion and a narrow lower portion and a wide middle portion can be selected.

FIG. 7A is an example in which a straight coil spring can be applied to ball transfer as a cushioning spring 320.

The straight coil spring is distorted by the vertical load W1 transmitted via the ball 330 by deforming the elastic deformation space between the upper head block 301 and the lower base block 310 with a uniform force distribution. It can be an advantageous shape that shrinks and deforms without shrinking and can absorb and relax the impact transmitted to the substrate GL in a relatively stable and uniform distribution.

FIG. 7B is an example in which a conical spiral coil spring can be applied to ball transfer as a buffer spring 320.

Since the cushioning reaction at the upper part of the conical spiral coil spring is more sensitive than that at the lower part, it can quickly respond to the vertical load W1 transmitted to the substrate GL to induce a minute contraction deformation. The shape may be advantageous for absorbing and mitigating the minute impact transmitted to the substrate GL.

FIG. 7C is an example in which a pot-shaped spiral coil spring can be applied to ball transfer as a buffer spring 320.

The pot-shaped spiral coil spring has uniform cushioning at the top and bottom, and the vertical load W1 transmitted from the substrate GL is quickly absorbed and relaxed at the top and bottom of the spring, and the impact transmitted to the substrate GL is released. By dispersing in the intermediate portion, the shape may be advantageous for absorbing and mitigating the fine impact transmitted to the substrate GL.

The cushioning spring 320 is preferably configured using an inconel spring, which is a nickel-chromium heat resistant alloy steel that can be used even at high temperatures.

Inconel springs are springs made from a heat-resistant alloy material made mainly of nickel with 15% chromium, 6-7% iron, 2.5% titanium, 1% or less aluminum, manganese, and silicon. Can be.

Since the Inconel spring manufactured of the heat-resistant alloy material has good heat resistance, it has the advantage that it does not oxidize in the oxidizing airflow and is not immersed in the atmosphere even if it is placed in the vicinity of the heat treatment device at 900 ° C or higher. There is.

Further, since the mechanical properties such as elongation, tensile strength, and yield point do not change up to about 600 ° C., it can be selected as a preferable material that can be installed in the peripheral portion of the chamber of the heat treatment apparatus.

The transport unit including the ball transfer to which the Inconel spring is applied does not oxidize at temperatures inside and outside of about 705 ° C, which is the temperature around the chamber of the heat treatment device, so high temperature durability can be ensured and resistance to relaxation is ensured. Therefore, it can be installed in the chamber of a high-temperature heat treatment device and used repeatedly without replacement.

As described above, the substrate transfer unit of the heat treatment apparatus according to the present invention has a relatively simple configuration by configuring a ball transfer in the chamber of the heat treatment apparatus so that it can be mounted on the rack of the heat treatment apparatus and used. There is an advantage that the glass substrate can be effectively transported or transferred from the heat treatment apparatus while reducing the additional equipment cost through the heat treatment apparatus.

Further, the substrate transfer unit of the heat treatment apparatus according to the present invention can absorb or pass the impact transmitted to the glass substrate in the process of transporting or transferring the glass substrate from the heat treatment apparatus so as to withstand the glass substrate. By ensuring scratchability, there is an advantage that the manufacturing yield of a high-quality glass substrate can be obtained.

Although the present invention has been described with reference to one of the illustrated embodiments, the present invention is not limited to the embodiments and can be modified or modified without departing from the gist of the present invention. It should be understood that the changes are also included in the technical idea of the present invention.

A Board transfer unit GL board (glass board)
100 Heat treatment device 110 Chamber 140 Rack 141 Assembly hole 200 Heater 300 Ball transfer 301 Head block 302 Housing 303 Flange 310 Base block 311 Assembly head 320 Buffer spring 330 Ball (main ball)
331 Rolling ball (sub ball)

Claims (7)

A chamber in which the heater is mounted and a heat treatment apparatus including a large number of racks installed across the surface of the heater inside the chamber.
A substrate transfer unit for a heat treatment apparatus, comprising a ball transfer that is arranged in place so as to project along the surface of the rack and induces transfer and transfer to the substrate before and after heat treatment by the heat treatment apparatus. The ball transfer protrudes in the direction perpendicular to the surface of the rack, and a head block having a housing formed inside the head block.
A ball housed in the housing and vertically supporting the substrate,
A base block assembled by an insert method on a rack inside the chamber of the heat treatment apparatus to elastically support the head block, and a base block.
The substrate transfer unit for a heat treatment apparatus according to claim 1, further comprising a cushioning spring that is interposed between the head block and the base block and forms an elastic deformation space between the head block and the base block. The substrate transfer unit of the heat treatment apparatus according to claim 1, wherein the lower end portion of the head block and the upper end portion of the base block are each composed of a flange portion for fixing a buffer spring. The heat treatment apparatus according to claim 1, wherein the housing of the head block is filled with a large number of rolling balls that induce a rotational rolling motion of a ball that supports a substrate loaded on the upper portion. Board transfer unit. The lower assembly head in which the base block is assembled by an insert method along the assembly hole provided on the rack inside the chamber of the heat treatment apparatus, and the upper part is compared with the lower part in order to prevent the assembly head from being detached downward. The substrate transfer unit of the heat treatment apparatus according to claim 1, wherein the substrate transfer unit is composed of a flange portion having an expanded area. The cushioning spring is selected from a straight coil spring, a conical spiral coil spring having a wider lower part than the upper part, and a pot-shaped spiral coil spring having a narrow upper part and a narrow lower part and a wide middle part. The substrate transfer unit of the heat treatment apparatus according to claim 2, wherein the number is one. The substrate transfer unit of the heat treatment apparatus according to claim 2, wherein the cushioning spring is made of an inconel spring.

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