JP2021160352A5 - - Google Patents

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Publication number
JP2021160352A5
JP2021160352A5 JP2021003721A JP2021003721A JP2021160352A5 JP 2021160352 A5 JP2021160352 A5 JP 2021160352A5 JP 2021003721 A JP2021003721 A JP 2021003721A JP 2021003721 A JP2021003721 A JP 2021003721A JP 2021160352 A5 JP2021160352 A5 JP 2021160352A5
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JP
Japan
Prior art keywords
superstrate
blank
tapered edge
edge region
coating
Prior art date
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Application number
JP2021003721A
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English (en)
Japanese (ja)
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JP7504035B2 (ja
JP2021160352A (ja
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Publication date
Priority claimed from US16/834,465 external-priority patent/US12136564B2/en
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Publication of JP2021160352A publication Critical patent/JP2021160352A/ja
Publication of JP2021160352A5 publication Critical patent/JP2021160352A5/ja
Application granted granted Critical
Publication of JP7504035B2 publication Critical patent/JP7504035B2/ja
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JP2021003721A 2020-03-30 2021-01-13 スーパーストレート及びその製造方法 Active JP7504035B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/834,465 2020-03-30
US16/834,465 US12136564B2 (en) 2020-03-30 2020-03-30 Superstrate and method of making it

Publications (3)

Publication Number Publication Date
JP2021160352A JP2021160352A (ja) 2021-10-11
JP2021160352A5 true JP2021160352A5 (enExample) 2023-10-17
JP7504035B2 JP7504035B2 (ja) 2024-06-21

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ID=77854686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021003721A Active JP7504035B2 (ja) 2020-03-30 2021-01-13 スーパーストレート及びその製造方法

Country Status (5)

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US (1) US12136564B2 (enExample)
JP (1) JP7504035B2 (enExample)
KR (1) KR102946143B1 (enExample)
CN (1) CN113471101B (enExample)
TW (1) TWI834943B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11562924B2 (en) * 2020-01-31 2023-01-24 Canon Kabushiki Kaisha Planarization apparatus, planarization process, and method of manufacturing an article
US12325046B2 (en) * 2022-06-28 2025-06-10 Canon Kabushiki Kaisha Superstrate including a body and layers and methods of forming and using the same
US11878935B1 (en) * 2022-12-27 2024-01-23 Canon Kabushiki Kaisha Method of coating a superstrate
US20240411225A1 (en) * 2023-06-09 2024-12-12 Canon Kabushiki Kaisha System including heating means and actinic radiation source and a method of using the same
US20260022241A1 (en) * 2024-07-19 2026-01-22 Canon Kabushiki Kaisha Curable composition and coated superstrate

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3918221B2 (ja) 1997-03-12 2007-05-23 ソニー株式会社 保護膜形成装置及び保護膜形成方法
US6140254A (en) 1998-09-18 2000-10-31 Alliedsignal Inc. Edge bead removal for nanoporous dielectric silica coatings
US20080160129A1 (en) * 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
WO2008149544A1 (ja) 2007-06-04 2008-12-11 Scivax Corporation 型、微細加工品およびそれらの製造方法
US7824846B2 (en) * 2007-09-19 2010-11-02 International Business Machines Corporation Tapered edge bead removal process for immersion lithography
JP4609562B2 (ja) * 2008-09-10 2011-01-12 日立電線株式会社 微細構造転写用スタンパ及びその製造方法
RU2449415C1 (ru) * 2010-10-25 2012-04-27 Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации Способ изготовления высоковольтного силового полупроводникового прибора
JP6083565B2 (ja) 2013-04-09 2017-02-22 パナソニックＩｐマネジメント株式会社 微細構造体の製造方法
US10354858B2 (en) 2013-12-31 2019-07-16 Texas Instruments Incorporated Process for forming PZT or PLZT thinfilms with low defectivity
JP2015170828A (ja) 2014-03-11 2015-09-28 富士フイルム株式会社 プラズマエッチング方法およびパターン化基板の製造方法
JP6385131B2 (ja) * 2014-05-13 2018-09-05 株式会社ディスコ ウェーハの加工方法
JP2017010962A (ja) * 2015-06-16 2017-01-12 株式会社東芝 デバイス基板およびデバイス基板の製造方法並びに半導体装置の製造方法
JP6649600B2 (ja) 2015-08-03 2020-02-19 三菱自動車工業株式会社 電動車両の回生制御装置
US10627719B2 (en) 2016-08-12 2020-04-21 Inpria Corporation Methods of reducing metal residue in edge bead region from metal-containing resists
JP2019016616A (ja) * 2017-07-03 2019-01-31 大日本印刷株式会社 インプリントモールド及びその製造方法、並びに配線基板の製造方法
KR102447277B1 (ko) 2017-11-17 2022-09-26 삼성전자주식회사 스핀 코터 및 이를 구비하는 기판처리 장치와 기판처리 시스템
KR102521991B1 (ko) 2018-03-15 2023-04-13 어플라이드 머티어리얼스, 인코포레이티드 반도체 디바이스 패키지 제작 프로세스들을 위한 평탄화
US11137536B2 (en) * 2018-07-26 2021-10-05 Facebook Technologies, Llc Bragg-like gratings on high refractive index material
KR102810856B1 (ko) * 2019-09-02 2025-05-20 삼성전자주식회사 반도체 소자 제조 장치, 반도체 소자 검사 장치 및 반도체 소자 제조 방법

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