JP2021139675A - 測定装置、基板処理システムおよび測定方法 - Google Patents

測定装置、基板処理システムおよび測定方法 Download PDF

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Publication number
JP2021139675A
JP2021139675A JP2020035893A JP2020035893A JP2021139675A JP 2021139675 A JP2021139675 A JP 2021139675A JP 2020035893 A JP2020035893 A JP 2020035893A JP 2020035893 A JP2020035893 A JP 2020035893A JP 2021139675 A JP2021139675 A JP 2021139675A
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JP
Japan
Prior art keywords
unit
substrate
pattern
imaging
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020035893A
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English (en)
Japanese (ja)
Inventor
慎 藤原
Shin Fujiwara
慎 藤原
幸太朗 尾上
Kotaro Onoe
幸太朗 尾上
茂喜 田中
Shigeki Tanaka
茂喜 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2020035893A priority Critical patent/JP2021139675A/ja
Priority to TW110105653A priority patent/TW202143352A/zh
Priority to CN202110200735.9A priority patent/CN113340337A/zh
Priority to KR1020210025478A priority patent/KR20210111689A/ko
Publication of JP2021139675A publication Critical patent/JP2021139675A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G01D21/02—Measuring two or more variables by means not covered by a single other subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/02—Means for indicating or recording specially adapted for thermometers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/20—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring contours or curvatures, e.g. determining profile
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2020035893A 2020-03-03 2020-03-03 測定装置、基板処理システムおよび測定方法 Pending JP2021139675A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020035893A JP2021139675A (ja) 2020-03-03 2020-03-03 測定装置、基板処理システムおよび測定方法
TW110105653A TW202143352A (zh) 2020-03-03 2021-02-19 測定裝置、基板處理系統及測定方法
CN202110200735.9A CN113340337A (zh) 2020-03-03 2021-02-23 测量装置、基片处理系统和测量方法
KR1020210025478A KR20210111689A (ko) 2020-03-03 2021-02-25 측정 장치, 기판 처리 시스템 및 측정 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020035893A JP2021139675A (ja) 2020-03-03 2020-03-03 測定装置、基板処理システムおよび測定方法

Publications (1)

Publication Number Publication Date
JP2021139675A true JP2021139675A (ja) 2021-09-16

Family

ID=77467895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020035893A Pending JP2021139675A (ja) 2020-03-03 2020-03-03 測定装置、基板処理システムおよび測定方法

Country Status (4)

Country Link
JP (1) JP2021139675A (zh)
KR (1) KR20210111689A (zh)
CN (1) CN113340337A (zh)
TW (1) TW202143352A (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04350613A (ja) * 1991-05-28 1992-12-04 Hitachi Ltd 画像認識装置
JP2007248086A (ja) * 2006-03-14 2007-09-27 Hitachi High-Technologies Corp 欠陥検査装置
JP2015072257A (ja) * 2013-09-09 2015-04-16 東京エレクトロン株式会社 測定装置、基板処理システムおよび測定方法
JP2019133089A (ja) * 2018-02-02 2019-08-08 キヤノン株式会社 撮像装置、その方法およびプログラム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04350613A (ja) * 1991-05-28 1992-12-04 Hitachi Ltd 画像認識装置
JP2007248086A (ja) * 2006-03-14 2007-09-27 Hitachi High-Technologies Corp 欠陥検査装置
JP2015072257A (ja) * 2013-09-09 2015-04-16 東京エレクトロン株式会社 測定装置、基板処理システムおよび測定方法
JP2019133089A (ja) * 2018-02-02 2019-08-08 キヤノン株式会社 撮像装置、その方法およびプログラム

Also Published As

Publication number Publication date
CN113340337A (zh) 2021-09-03
TW202143352A (zh) 2021-11-16
KR20210111689A (ko) 2021-09-13

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