JP2021139675A - 測定装置、基板処理システムおよび測定方法 - Google Patents
測定装置、基板処理システムおよび測定方法 Download PDFInfo
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- JP2021139675A JP2021139675A JP2020035893A JP2020035893A JP2021139675A JP 2021139675 A JP2021139675 A JP 2021139675A JP 2020035893 A JP2020035893 A JP 2020035893A JP 2020035893 A JP2020035893 A JP 2020035893A JP 2021139675 A JP2021139675 A JP 2021139675A
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- 239000000758 substrate Substances 0.000 title claims abstract description 208
- 238000005259 measurement Methods 0.000 title claims abstract description 89
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- 238000003384 imaging method Methods 0.000 claims abstract description 238
- 238000001514 detection method Methods 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims description 94
- 230000008569 process Effects 0.000 claims description 77
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/20—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring contours or curvatures, e.g. determining profile
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020035893A JP2021139675A (ja) | 2020-03-03 | 2020-03-03 | 測定装置、基板処理システムおよび測定方法 |
TW110105653A TW202143352A (zh) | 2020-03-03 | 2021-02-19 | 測定裝置、基板處理系統及測定方法 |
CN202110200735.9A CN113340337A (zh) | 2020-03-03 | 2021-02-23 | 测量装置、基片处理系统和测量方法 |
KR1020210025478A KR20210111689A (ko) | 2020-03-03 | 2021-02-25 | 측정 장치, 기판 처리 시스템 및 측정 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020035893A JP2021139675A (ja) | 2020-03-03 | 2020-03-03 | 測定装置、基板処理システムおよび測定方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2021139675A true JP2021139675A (ja) | 2021-09-16 |
Family
ID=77467895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020035893A Pending JP2021139675A (ja) | 2020-03-03 | 2020-03-03 | 測定装置、基板処理システムおよび測定方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2021139675A (zh) |
KR (1) | KR20210111689A (zh) |
CN (1) | CN113340337A (zh) |
TW (1) | TW202143352A (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04350613A (ja) * | 1991-05-28 | 1992-12-04 | Hitachi Ltd | 画像認識装置 |
JP2007248086A (ja) * | 2006-03-14 | 2007-09-27 | Hitachi High-Technologies Corp | 欠陥検査装置 |
JP2015072257A (ja) * | 2013-09-09 | 2015-04-16 | 東京エレクトロン株式会社 | 測定装置、基板処理システムおよび測定方法 |
JP2019133089A (ja) * | 2018-02-02 | 2019-08-08 | キヤノン株式会社 | 撮像装置、その方法およびプログラム |
-
2020
- 2020-03-03 JP JP2020035893A patent/JP2021139675A/ja active Pending
-
2021
- 2021-02-19 TW TW110105653A patent/TW202143352A/zh unknown
- 2021-02-23 CN CN202110200735.9A patent/CN113340337A/zh active Pending
- 2021-02-25 KR KR1020210025478A patent/KR20210111689A/ko unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04350613A (ja) * | 1991-05-28 | 1992-12-04 | Hitachi Ltd | 画像認識装置 |
JP2007248086A (ja) * | 2006-03-14 | 2007-09-27 | Hitachi High-Technologies Corp | 欠陥検査装置 |
JP2015072257A (ja) * | 2013-09-09 | 2015-04-16 | 東京エレクトロン株式会社 | 測定装置、基板処理システムおよび測定方法 |
JP2019133089A (ja) * | 2018-02-02 | 2019-08-08 | キヤノン株式会社 | 撮像装置、その方法およびプログラム |
Also Published As
Publication number | Publication date |
---|---|
CN113340337A (zh) | 2021-09-03 |
TW202143352A (zh) | 2021-11-16 |
KR20210111689A (ko) | 2021-09-13 |
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