JP2021115688A - 切削装置 - Google Patents
切削装置 Download PDFInfo
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- JP2021115688A JP2021115688A JP2020012713A JP2020012713A JP2021115688A JP 2021115688 A JP2021115688 A JP 2021115688A JP 2020012713 A JP2020012713 A JP 2020012713A JP 2020012713 A JP2020012713 A JP 2020012713A JP 2021115688 A JP2021115688 A JP 2021115688A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 208
- 238000003384 imaging method Methods 0.000 claims abstract description 131
- 238000012544 monitoring process Methods 0.000 claims abstract description 29
- 239000013307 optical fiber Substances 0.000 claims description 49
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000003860 storage Methods 0.000 claims description 7
- 238000005286 illumination Methods 0.000 claims description 4
- 239000000835 fiber Substances 0.000 abstract 4
- 230000003028 elevating effect Effects 0.000 description 13
- 238000001514 detection method Methods 0.000 description 9
- 239000006061 abrasive grain Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B25/00—Accessories or auxiliary equipment for turning-machines
- B23B25/06—Measuring, gauging, or adjusting equipment on turning-machines for setting-on, feeding, controlling, or monitoring the cutting tools or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/2452—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces
- B23Q17/2457—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves for measuring features or for detecting a condition of machine parts, tools or workpieces of tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/01—Frames, beds, pillars or like members; Arrangement of ways
- B23Q1/015—Frames, beds, pillars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
- B23Q17/0995—Tool life management
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/24—Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
- B23Q17/2404—Arrangements for improving direct observation of the working space, e.g. using mirrors or lamps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by monitoring or safety
- G05B19/4065—Monitoring tool breakage, life or condition
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Machine Tool Sensing Apparatuses (AREA)
Abstract
Description
パルス光源の繰り返し周波数=X×Y [Hz]
とすることができる。
パルス光源の繰り返し周波数=360[回]×18,000[rpm]/60[秒]
=108,000[Hz]
1A:ハウジング
3:搬出入手段
4:カセット載置領域
4A:カセット
5:仮置きテーブル
6:搬送手段
10:保持手段
10a:チャックテーブル
11:撮像手段
13:搬送手段
14:操作パネル
20:切削手段
21:ハウジング
22:切削ブレード
22a:切り刃
22b:固定リング
24:ブレードカバー
241:主部
242:可動部
25:撮像部保持ブロック
251:昇降ツマミ
252:昇降部材
252a:検出空間
26:切削水供給手段
30:監視手段
35:モニター
40:撮像部
42:第一の撮像部
421:第一のプリズム
421a:一方の端面
421b:他方の端面
422:第一の結像レンズ
423:第一の光ファイバー
423a:一方の端面
423b:他方の端面
44:第二の撮像部
441:第二のプリズム
441a:一方の端面
441b:他方の端面
442:第二の結像レンズ
443:第二の光ファイバー
443a:一方の端面
443b:他方の端面
46:第三の撮像部
462:第三の結像レンズ
463:第三の光ファイバー
463a:一方の端面
463b:他方の端面
47:コリメートレンズ
48;結像レンズ
49:集光レンズ
50:パルス光源
60:カメラ
70:ビームスプリッター
72:反射面
100:制御装置
110:記憶部
W:ウエーハ
T:ダイシングテープ
F:フレーム
Claims (7)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物を切削する切り刃が環状に配設された切削ブレードを備えた切削手段と、該切削ブレードの切り刃を監視する監視手段と、モニターと、を少なくとも備えた切削装置であって、
該監視手段は、切削ブレードの切り刃を撮像する撮像部と、パルス光を発し該撮像部による撮像領域を照明するパルス光源と、該撮像部が発する像を捉えるカメラと、を少なくとも備え、
該撮像部は、切削ブレードの切り刃の一方の側面を撮像する第一の撮像部と、他方の側面を撮像する第二の撮像部と、を備え、
該第一の撮像部は、該切り刃の一方の側面に対面する一方の端面を備えた第一のプリズムと、該第一のプリズムの他方の端面に配設される第一の結像レンズと、該第一の結像レンズに一方の端面が連結され第一の像を伝達する第一の光ファイバーとを含み、
該第二の撮像部は、該切り刃の他方の側面に対面する一方の端面を備えた第二のプリズムと、該第二のプリズムの他方の端面に配設される第二の結像レンズと、該第二の結像レンズに一方の端面が連結され第二の像を伝達する第二の光ファイバーとを含み、
該第一の光ファイバーの他方の端面から発せられる該第一の像、及び該第二の光ファイバーの他方の端面から発せられる該第二の像は、該カメラに伝達されて該モニターに表示される切削装置。 - 該撮像部は、さらに、第三の撮像部を備え、
該第三の撮像部は、該切り刃の外周端部に対面する第三の結像レンズと、該第三の結像レンズに一方の端面が連結され第三の像を伝達する第三の光ファイバーとを含み、該第三の光ファイバーの他方の端面から発せられる該第三の像は、該第一の像、及び該第二の像と共に該カメラに伝達されて該モニターに表示される請求項1に記載の切削装置。 - 該撮像部と該カメラとの間にビームスプリッターが配設され、該パルス光源が発するパルス光は該ビームスプリッターを介して該撮像部に配設された各光ファイバーの他方の端面から導入されて該切削ブレードの切り刃の撮像領域に対面する一方の端面に導かれ、該撮像領域を照明する請求項1、又は2に記載の切削装置。
- 該パルス光源は、該撮像部に配設された各光ファイバーとは別にパルス光を伝達する照明用光ファイバーを備え、該照明用光ファイバーによって該撮像領域を照明する請求項1、又は2に記載の切削装置。
- 該監視手段によって撮像された該切削ブレードの切り刃の像を記憶する記憶部を備えた請求項1乃至4のいずれかに記載の切削装置。
- 該切削ブレードの切り刃が一回転する際に該監視手段が該切り刃を撮像する回数をXとし、該切削ブレードを回転させる回転軸の1秒間の回転数をYとしたとき、
パルス光源の繰り返し周波数=X×Y [Hz]
とする請求項1乃至5のいずれかに記載された切削装置。 - 該切削ブレードの切り刃を挟むように配設された発光素子及び受光素子と、該切削ブレードを回転させる回転軸に配設されたロータリーエンコーダと、を備え、
該受光素子の受光量が変化した際に該ロータリーエンコーダによって検出される値に対応するタイミングで該パルス光源からパルス光を発するように制御して、該受光素子の受光量が変化した領域を該撮像部によって撮像する撮像領域として照明し撮像する請求項1乃至6のいずれかに記載された切削装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020012713A JP7420571B2 (ja) | 2020-01-29 | 2020-01-29 | 切削装置 |
KR1020200184903A KR20210097017A (ko) | 2020-01-29 | 2020-12-28 | 절삭 장치 |
US17/144,265 US20210229186A1 (en) | 2020-01-29 | 2021-01-08 | Cutting machine |
CN202110108309.2A CN113183338A (zh) | 2020-01-29 | 2021-01-27 | 切削装置 |
TW110103200A TW202128344A (zh) | 2020-01-29 | 2021-01-28 | 切削裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020012713A JP7420571B2 (ja) | 2020-01-29 | 2020-01-29 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
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JP2021115688A true JP2021115688A (ja) | 2021-08-10 |
JP7420571B2 JP7420571B2 (ja) | 2024-01-23 |
Family
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Family Applications (1)
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JP2020012713A Active JP7420571B2 (ja) | 2020-01-29 | 2020-01-29 | 切削装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20210229186A1 (ja) |
JP (1) | JP7420571B2 (ja) |
KR (1) | KR20210097017A (ja) |
CN (1) | CN113183338A (ja) |
TW (1) | TW202128344A (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06140497A (ja) * | 1992-10-27 | 1994-05-20 | Hitachi Ltd | ピックアップ装置 |
JP2014179538A (ja) * | 2013-03-15 | 2014-09-25 | Techno Horon:Kk | ダイシング装置 |
JP2018062052A (ja) * | 2016-10-14 | 2018-04-19 | 株式会社ディスコ | 切削方法及び切削装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4590058B2 (ja) * | 2000-04-12 | 2010-12-01 | 株式会社ディスコ | 切削装置の切削ブレード検出機構 |
US6533641B1 (en) * | 2000-09-21 | 2003-03-18 | Advanced Micro Devices, Inc. | Grinding arrangement and method for real-time viewing of samples during cross-sectioning |
JP2002343746A (ja) * | 2001-05-14 | 2002-11-29 | Tokyo Seimitsu Co Ltd | インターロック付ダイシング装置 |
US6633379B2 (en) * | 2001-06-08 | 2003-10-14 | Semiconductor 300 Gmbh & Co. Kg | Apparatus and method for measuring the degradation of a tool |
US8346346B1 (en) * | 2005-01-24 | 2013-01-01 | The Board Of Trustees Of The Leland Stanford Junior University | Optical analysis system and approach therefor |
JP2007042855A (ja) | 2005-08-03 | 2007-02-15 | Disco Abrasive Syst Ltd | ブレード検出手段を備えた切削装置 |
JP4791813B2 (ja) * | 2005-12-08 | 2011-10-12 | 株式会社ディスコ | 切削装置 |
US20110043612A1 (en) * | 2009-07-31 | 2011-02-24 | Inneroptic Technology Inc. | Dual-tube stereoscope |
JP2012040651A (ja) * | 2010-08-20 | 2012-03-01 | Disco Corp | 切削ブレード検出機構 |
WO2013102900A1 (en) * | 2012-01-04 | 2013-07-11 | Mike Goldstein | Inspection device for mechanical instruments and uses thereof |
JP6974087B2 (ja) * | 2017-09-14 | 2021-12-01 | 株式会社ディスコ | 切削装置 |
-
2020
- 2020-01-29 JP JP2020012713A patent/JP7420571B2/ja active Active
- 2020-12-28 KR KR1020200184903A patent/KR20210097017A/ko unknown
-
2021
- 2021-01-08 US US17/144,265 patent/US20210229186A1/en active Pending
- 2021-01-27 CN CN202110108309.2A patent/CN113183338A/zh active Pending
- 2021-01-28 TW TW110103200A patent/TW202128344A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06140497A (ja) * | 1992-10-27 | 1994-05-20 | Hitachi Ltd | ピックアップ装置 |
JP2014179538A (ja) * | 2013-03-15 | 2014-09-25 | Techno Horon:Kk | ダイシング装置 |
JP2018062052A (ja) * | 2016-10-14 | 2018-04-19 | 株式会社ディスコ | 切削方法及び切削装置 |
Also Published As
Publication number | Publication date |
---|---|
JP7420571B2 (ja) | 2024-01-23 |
US20210229186A1 (en) | 2021-07-29 |
KR20210097017A (ko) | 2021-08-06 |
TW202128344A (zh) | 2021-08-01 |
CN113183338A (zh) | 2021-07-30 |
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