JP2021113298A - 粘着剤組成物および該粘着剤組成物を用いた粘着シート - Google Patents
粘着剤組成物および該粘着剤組成物を用いた粘着シート Download PDFInfo
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- JP2021113298A JP2021113298A JP2020007711A JP2020007711A JP2021113298A JP 2021113298 A JP2021113298 A JP 2021113298A JP 2020007711 A JP2020007711 A JP 2020007711A JP 2020007711 A JP2020007711 A JP 2020007711A JP 2021113298 A JP2021113298 A JP 2021113298A
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- pressure
- sensitive adhesive
- meth
- acrylate
- adhesive
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- 239000000853 adhesive Substances 0.000 title claims abstract description 143
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 143
- 239000000203 mixture Substances 0.000 title claims abstract description 68
- 239000010410 layer Substances 0.000 claims abstract description 87
- 125000005037 alkyl phenyl group Chemical group 0.000 claims abstract description 25
- 239000012790 adhesive layer Substances 0.000 claims abstract description 12
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 143
- 239000000463 material Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 239000010703 silicon Substances 0.000 claims description 14
- 239000004642 Polyimide Substances 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 6
- ZMDDERVSCYEKPQ-UHFFFAOYSA-N Ethyl (mesitylcarbonyl)phenylphosphinate Chemical group C=1C=CC=CC=1P(=O)(OCC)C(=O)C1=C(C)C=C(C)C=C1C ZMDDERVSCYEKPQ-UHFFFAOYSA-N 0.000 claims description 4
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 abstract description 10
- 239000000758 substrate Substances 0.000 abstract description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 80
- 239000000178 monomer Substances 0.000 description 59
- 239000003431 cross linking reagent Substances 0.000 description 39
- -1 polyimide Chemical compound 0.000 description 34
- 235000012431 wafers Nutrition 0.000 description 28
- 229920005989 resin Polymers 0.000 description 21
- 239000011347 resin Substances 0.000 description 21
- 229920000178 Acrylic resin Polymers 0.000 description 16
- 239000004925 Acrylic resin Substances 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 125000000217 alkyl group Chemical group 0.000 description 15
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 15
- 239000010949 copper Substances 0.000 description 14
- 239000003999 initiator Substances 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 14
- 125000000524 functional group Chemical group 0.000 description 12
- 239000011254 layer-forming composition Substances 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 10
- 239000012948 isocyanate Substances 0.000 description 10
- 229920000058 polyacrylate Polymers 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- 229920005601 base polymer Polymers 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000011049 filling Methods 0.000 description 6
- 150000002513 isocyanates Chemical class 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 6
- 239000004014 plasticizer Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 125000000623 heterocyclic group Chemical group 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 239000004611 light stabiliser Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 2
- VHFGGWSXGDWGOY-UHFFFAOYSA-N 2-isocyanatoethyl 2-methylprop-2-enoate 5-isocyanato-2-methylpent-2-enoic acid Chemical compound N(=C=O)CCC=C(C(=O)O)C.C(C(=C)C)(=O)OCCN=C=O VHFGGWSXGDWGOY-UHFFFAOYSA-N 0.000 description 2
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 150000001718 carbodiimides Chemical class 0.000 description 2
- 239000013522 chelant Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 2
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- BMZZOWWYEBTMBX-UHFFFAOYSA-N 1-ethyl-3-methylidenepyrrolidine-2,5-dione Chemical compound CCN1C(=O)CC(=C)C1=O BMZZOWWYEBTMBX-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- BFYSJBXFEVRVII-UHFFFAOYSA-N 1-prop-1-enylpyrrolidin-2-one Chemical compound CC=CN1CCCC1=O BFYSJBXFEVRVII-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 description 1
- AUZRCMMVHXRSGT-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(C)CS(O)(=O)=O AUZRCMMVHXRSGT-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- DOTJTDPXTXRURS-UHFFFAOYSA-N 3-[4-(hydroxymethyl)cyclohexyl]-2-methylprop-2-enoic acid Chemical compound OC(=O)C(C)=CC1CCC(CO)CC1 DOTJTDPXTXRURS-UHFFFAOYSA-N 0.000 description 1
- SCYHXIPBPUIIFY-UHFFFAOYSA-N 3-ethylidenepyrrolidine-2,5-dione Chemical compound CC=C1CC(=O)NC1=O SCYHXIPBPUIIFY-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- CYUZOYPRAQASLN-UHFFFAOYSA-N 3-prop-2-enoyloxypropanoic acid Chemical compound OC(=O)CCOC(=O)C=C CYUZOYPRAQASLN-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
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-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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Abstract
Description
1つの実施形態においては、上記フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキルはフェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸エチルである。
本発明の別の局面においては、粘着シートが提供される。この粘着シートは、基材と、粘着剤層と、を含む。この該粘着剤層は上記紫外線硬化型粘着剤組成物から形成される。
1つの実施形態においては、粘着シートは上記粘着剤層を少なくとも1層含む。
1つの実施形態においては、上記粘着剤層の紫外線照射後のポリイミド粘着力とシリコン粘着力との比は2以下である。
1つの実施形態においては、粘着シートは中間層をさらに含む。
1つの実施形態においては、上記中間層は上記粘着剤層と同じフェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキルを含む。
1つの実施形態においては、粘着シートは半導体ウエハ加工工程に用いられる。
1つの実施形態においては、粘着シートはバックグラインドシートとして用いられる。
1つの実施形態において、本発明の紫外線硬化型粘着剤組成物は、紫外線硬化型粘着剤と、フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキルと、を含む。フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキルは、光重合開始剤として機能し得る。光重合開始剤として、フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキルを含むことにより、紫外線照射前においては、被着体表面が組成(例えば、金属等の無機物、樹脂等の有機物)の異なる部分を有する場合であっても優れた粘着力を発揮し得る。さらに、凹凸への追従性にも優れるため、被着体表面の構造(例えば、凹凸)が複雑な場合であっても優れた粘着力を発揮し得る。また、この紫外線硬化型粘着剤組成物は紫外線照射後においては、被着体表面の組成および構造に影響されることなく、粘着力が低下し、軽剥離性を奏し得る。そのため、被着体表面への糊残りを防止し得る。
紫外線硬化型粘着剤としては、任意の適切な粘着剤を用いることができる。例えば、アクリル系粘着剤、ゴム系粘着剤、シリコーン系粘着剤、ポリビニルエーテル系粘着剤等の任意の適切な粘着剤に紫外線硬化性のモノマーおよび/またはオリゴマーを添加した粘着剤であってもよく、ベースポリマーとして炭素−炭素二重結合を側鎖または末端に有するポリマーを用いた粘着剤であってもよい。
フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキルは、光重合性開始剤として機能し、紫外線照射により上記紫外線硬化型粘着剤を硬化させ、粘着力を低下させ得る。フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキルは、室温では液体である。そのため、粘着剤組成物中により均一に分散し、より均一に光重合開始剤が分散した粘着剤層が形成される。それにより、紫外線照射後には、粘着剤層の硬化反応のバラつきが抑えられ、軽剥離性が発揮され、その結果、被着体表面への糊残りを防止し得る。
紫外線硬化型粘着剤組成物は、好ましくは架橋剤をさらに含む。架橋剤としては、例えば、イソシアネート系架橋剤、エポキシ系架橋剤、オキサゾリン系架橋剤、アジリジン系架橋剤、メラミン系架橋剤、過酸化物系架橋剤、尿素系架橋剤、金属アルコキシド系架橋剤、金属キレート系架橋剤、金属塩系架橋剤、カルボジイミド系架橋剤、アミン系架橋剤等が挙げられる。
紫外線硬化型粘着剤組成物は、任意の適切な添加剤をさらに含んでいてもよい。添加剤としては、例えば、フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキル以外の重合開始剤、活性エネルギー線重合促進剤、ラジカル捕捉剤、粘着付与剤、可塑剤(例えば、トリメリット酸エステル系可塑剤、ピロメリット酸エステル系可塑剤)、顔料、染料、充填剤、老化防止剤、導電材、帯電防止剤、紫外線吸収剤、光安定剤、剥離調整剤、軟化剤、界面活性剤、難燃剤、酸化防止剤等が挙げられる。他の添加剤は任意の適切な量で用いることができる。
B−1.粘着シートの概要
図1は、本発明の1つの実施形態による粘着シートの概略断面図である。図示例の粘着シート100は、基材10と、基材10の一方の面に配置された粘着剤層20とを備える。粘着剤層は、上記紫外線硬化型粘着剤組成物で形成される。実用的には、使用までの間、粘着剤層20を適切に保護するために、粘着剤層20にはセパレータが剥離可能に仮着される。1つの実施形態においては、粘着剤シート100は、基材10と粘着剤層20と間に中間層が形成され得る(図示せず)。
基材は、任意の適切な樹脂から構成され得る。基材層を構成する樹脂の具体例としては、ポリエステル系樹脂(ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリブチレンテレフタレート、ポリブチレンナフタレートなど)、エチレン−酢酸ビニル共重合体、エチレン−メタクリル酸メチル共重合体、ポリオレフィン系樹脂(ポリエチレン、ポリプロピレン、エチレン−プロピレン共重合体など)、ポリビニルアルコール、ポリ塩化ビニリデン、ポリ塩化ビニル、塩化ビニル−酢酸ビニル共重合体、ポリ酢酸ビニル、ポリアミド、ポリイミド、セルロース類、フッ素系樹脂、ポリエーテル、ポリスチレン系樹脂(ポリスチレンなど)、ポリカーボネート、ポリエーテルスルホン等が挙げられる。
粘着剤層は上記紫外線硬化型粘着剤組成物を用いて形成され得る。上記紫外線硬化型粘着剤組成物は、紫外線照射前においては、被着体表面の組成および構造に影響されることなく優れた粘着力を発揮し得る。また、紫外線照射時には、粘着剤層の硬化反応のバラつきが抑えられ、軽剥離性が発揮され得る。その結果、被着体表面への糊残りを防止し得る。さらに、上記紫外線硬化型粘着剤組成物を用いて形成された粘着剤層は柔軟であり、被着体の表面に凹凸があるが場合であっても追従性に優れる。そのため、表面の凹凸を有する被着体とも良好な密着性を発揮し得る。
粘着剤層形成組成物を塗布厚みが5μmとなるようセパレータに塗布し、130℃で2分間乾燥した。次いで、塗布乾燥後の粘着剤層のみを端から丸めて棒状の試料を作製し、厚み(断面積)を計測した。得られた試料を、チャック間距離10mm、引張速度50mm/分、室温の条件で、引張試験機(SHIMADZU社製、商品名「AG−IS」)で引っ張った際の最初期の傾き(ヤング率)を弾性率とした。
1つの実施形態においては、粘着シートは基材と粘着剤層との間に中間層を有する。中間層は任意の適切な材料で形成され得る。中間層は、例えば、アクリル系樹脂、ポリエチレン系樹脂、エチレン−ビニルアルコール共重合体、エチレン−酢酸ビニル系樹脂、エチレンメチルメタクリレート樹脂等の樹脂、または、粘着剤で形成され得る。中間層が粘着剤で形成される場合、粘着剤は紫外線硬化型粘着剤であってもよく、感圧性粘着剤であってもよい。
粘着シートは、任意の適切な方法により製造され得る。粘着シートは、例えば、基材上に、上記紫外線硬化型粘着剤組成物を塗工して得られ得る。塗工方法としては、バーコーター塗工、エアナイフ塗工、グラビア塗工、グラビアリバース塗工、リバースロール塗工、リップ塗工、ダイ塗工、ディップ塗工、オフセット印刷、フレキソ印刷、スクリーン印刷など種々の方法を採用することができる。また、別途、セパレータに粘着剤層を形成した後、それを基材に貼り合せる方法等を採用してもよい。
本発明の粘着シートは、紫外線照射前においては、被着体表面の組成(例えば、金属等の無機物、または、樹脂等の有機物)に影響されることなく、優れた粘着力を発揮し得る。さらに、凹凸への追従性にも優れるため、被着体表面の構造(例えば、凹凸)が複雑な場合であっても優れた粘着力を発揮し得る。また、この粘着シートは紫外線照射後においては、被着体表面の組成および構造に影響されることなく、粘着力が低下し、軽剥離性を奏し得る。そのため、被着体表面への糊残りを防止し得る。したがって、これらの特性が要求される用途に好適に用いることができる。
アクリル酸−2−エチルヘキシル100重量部と、アクリロイルモロフォリン酸25.5重量部と、アクリル酸−2−ヒドロキシルエチル18.5重量部と、重合開始剤(過酸化ベンゾイル(BPO))0.2重量部と、溶媒(トルエン)とを混合してモノマー組成物を調製した。該モノマー組成物を、1L丸底セパラブルフラスコに、セパラブルカバー、分液ロート、温度計、窒素導入管、リービッヒ冷却器、バキュームシール、撹拌棒、撹拌羽が装備された重合用実験装置に投入し、撹拌しながら、常温で6時間、窒素置換した。その後、窒素を流入下、撹拌しながら、60℃下で8時間保持して重合し、樹脂溶液を得た。
得られた樹脂溶液を室温まで冷却し、その後、該樹脂溶液に、重合性炭素−炭素二重結合を有する化合物として、2−イソシアネートエチルメタクリレート(昭和電工社製、商品名「カレンズMOI」)22.4重量部を加えた。さらに、ジラウリン酸ジブチルスズIV(和光純薬工業社製)0.11重量部を添加し、空気雰囲気下、50℃で24時間撹拌し、ポリマー溶液を得た。
ブチルアクリレート50重量部と、エチルアクリレート50重量部と、アクリル酸5重量部と、アゾビスイソブチロニトリル0.1重量部とを、トルエン中、窒素雰囲気下、60℃で6時間重合し、重量平均分子量65万のアクリル系樹脂を得た。
(粘着剤層形成組成物の調製)
製造例1で得られたポリマー溶液100重量部に、架橋剤(東ソー社製、商品名:コロネートL)2重量部、および、フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸エチル(光重合開始剤、IGM Resins社製、商品名:Omnirad TPO−L)3重量部を配合・撹拌し、紫外線硬化型粘着剤組成物を得た。
(中間層形成組成物の調製)
製造例2で得られたアクリル系樹脂100重量部に、架橋剤(東ソー社製、商品名:コロネートL)1重量部、フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸エチル(光重合開始剤、IGM Resins社製、商品名:Omnirad TPO−L)3重量部、を配合・撹拌し、中間層形成組成物を得た。
(粘着シートの作製)
基材として、ポリエチレンテレフタレートフィルム(東レ社製、製品名:ルミラーS10#100、厚み:100μm)の一方の面にコロナ処理を施したものを用いた。基材のコロナ処理面に、中間層形成組成物を塗布、乾燥し、厚み95μmの中間層を形成した。次いで、形成された中間層に粘着剤層形成組成物を乾燥後の厚みが5μmとなるよう塗布、乾燥し、粘着シート1を得た。
粘着剤層形成組成物における光重合開始剤の種類、含有量、および、架橋剤の含有量、ならびに、中間層形成組成物における光重合開始剤の含有量を表1に記載のように変更した以外は実施例1と同様にして、粘着シートC1〜C6を作製した。
(1)粘着力
被着体としてSiミラーウエハ(信越化学製)、非感光性ポリイミドがコーティングされたウエハ(KSTワールド製)、銅板(神戸製鋼社製、商品名:KLH−194−H)を用いて、シリコン粘着力(Si粘着力)、ポリイミド粘着力(PI粘着力)、銅粘着力(Cu粘着力)をそれぞれ測定した。被着体はトルエン、メタノール、トルエンの順で洗浄・乾燥して前処理し、次いで各実施例または比較例の粘着シートを貼り付け、常温で30分間保管した。その後、UV照射前のもの、および、UV照射(1000mJ/cm2)を高圧水銀灯(70mW/cm2、日東精機社製、製品名:UM−810)で約12秒間照射)した後(UV照射後)のものについて、それぞれ以下の条件で粘着力(N/20mm)を測定した。また、粘着剤層の黄変の有無、および、糊残りの有無を目視で確認した。
<粘着力測定条件>
引張速度:300mm/分
剥離角度:180°
温度:23℃
湿度:50%RH
テープ幅:20mm
各実施例および比較例で用いた粘着剤層形成組成物を塗布厚みが5μmとなるようセパレータに塗布し、130℃×2分間乾燥した。次いで、塗布乾燥後の粘着剤層のみを端から丸めて棒状の試料を作製し、厚み(断面積)を計測した。得られた試料を、チャック間距離10mm、引張速度50mm/分、室温の条件で、引張試験機(SHIMADZU社製、商品名「AG−IS」)で引っ張った際の最初期の傾き(ヤング率)を弾性率とした。
ダミーバンプウエハ(均一に高さ45μm、径25μm、ピッチ55μm)が形成された300mmφウエハに、各実施例および比較例で得られた粘着シートを以下の条件で貼り付けたものを試料とした。この試料を用いて、以下の方法により、剥離力、埋まり性、および、糊残りの有無を評価した。
貼り付け条件
装置:日東精機社製、商品名:DR−3000III
圧力:0.5MPa
貼付速度:10mm/秒
温度:室温
<バンプウエハ剥離力>
各実施例および比較例で得られた粘着シートに、テープ流れ方向(MD方向)にスリット(20mm幅)を入れたものを試料として用いた。この試料を、上記の条件でダミーバンプウエハが形成されたウエハに貼り付けた。貼り付け後、常温で30分間保管した。次いで、UV照射(1000mJ/cm2)を高圧水銀灯(70mW/cm2、日東精機社製、製品名:UM−810)で12秒間行った。次いで、粘着テープを、室温で、引張速度300mm/分、剥離角度180°で剥離し、剥離力(N/mm)を測定した。
<埋まり性および糊残り>
粘着シートを貼り合わせたバンプウエハを、該ウエハのVノッチが0時方向となるよう静置した。次いで、ウエハの0時方向、3時方向、6時方向、9時方向、および、中央部を光学顕微鏡(倍率250倍)で各部分を観察し、以下の基準で評価した。次いで、UV照射(1000mJ/cm2)を高圧水銀灯(70mW/cm2、日東精機社製、製品名:UM−810)で12秒間行った。その後、粘着シートを剥離し、剥離後のバンプウエハ表面を光学顕微鏡(倍率250倍)で観察し、以下の基準で評価した。
埋まり性評価基準
3:全ての部分においてバンプ間に粘着剤層が気泡なく埋め込まれている
2:一部ではバンプ間では気泡が見られるが、概ね粘着剤層が気泡なく埋め込まれている
1:全ての部分においてバンプ間で気泡が見られる
糊残り評価基準
3:糊残りなし
2:微小な糊残り
1:重度の糊残り
0:剥離不可
20 粘着剤層
100 粘着シート
Claims (9)
- 紫外線硬化型粘着剤と、フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキルと、を含む、紫外線硬化型粘着剤組成物。
- 前記フェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキルがフェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸エチルである、請求項1に記載の紫外線硬化型粘着剤組成物。
- 基材と、粘着剤層と、を含む、粘着シートであって、
該粘着剤層が請求項1または2に記載の紫外線硬化型粘着剤組成物から形成される、粘着シート。 - 前記粘着剤層を少なくとも1層含む、請求項3に記載の粘着シート。
- 前記粘着剤層の紫外線照射後のポリイミド粘着力とシリコン粘着力との比が2以下である、請求項3または4に記載の粘着シート。
- 中間層をさらに含む、請求項3から5のいずれかに記載の粘着シート。
- 前記中間層が前記粘着剤層と同じフェニル(2,4,6−トリメチルベンゾイル)ホスフィン酸アルキルを含む、請求項6に記載の粘着シート。
- 半導体ウエハ加工工程に用いられる、請求項3から7のいずれかに記載の粘着シート。
- バックグラインドシートとして用いられる、請求項8に記載の粘着シート。
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JP3491911B2 (ja) | 1992-07-29 | 2004-02-03 | リンテック株式会社 | 半導体ウエハ加工用粘着シート |
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