JP2021111642A - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP2021111642A JP2021111642A JP2020000538A JP2020000538A JP2021111642A JP 2021111642 A JP2021111642 A JP 2021111642A JP 2020000538 A JP2020000538 A JP 2020000538A JP 2020000538 A JP2020000538 A JP 2020000538A JP 2021111642 A JP2021111642 A JP 2021111642A
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- 238000012545 processing Methods 0.000 title claims abstract description 167
- 238000012937 correction Methods 0.000 claims abstract description 128
- 238000003754 machining Methods 0.000 claims abstract description 101
- 238000004364 calculation method Methods 0.000 claims description 75
- 238000003384 imaging method Methods 0.000 claims description 15
- 238000001514 detection method Methods 0.000 description 17
- 238000010586 diagram Methods 0.000 description 16
- 244000309466 calf Species 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000284 extract Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000000295 complement effect Effects 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
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- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/06—Work-clamping means
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- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q5/00—Driving or feeding mechanisms; Control arrangements therefor
- B23Q5/22—Feeding members carrying tools or work
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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Abstract
Description
本発明の実施形態1に係る加工装置を図面に基いて説明する。図1は、実施形態1に係る加工装置の要部を示す斜視図である。図2は、図1に示された加工装置の加工対象の被加工物の斜視図である。図3は、図1に示された加工装置の保持ユニットと第2のカメラを示す斜視図である。図4は、図1に示された加工装置の加工領域と撮影領域を模式的に示す平面図である。図5は、図1に示された加工装置の表示ユニットが表示する第1の画像及び第2の画像の一例を示す図である。図6は、図1に示された加工装置の表示ユニットが表示する第1の画像及び第2の画像の他の例を示す図である。図7は、図1に示された加工装置の補正量算出部が補正量を算出する際に切削溝を形成する被加工物の斜視図である。
本発明の実施形態2に係る加工装置を図面に基いて説明する。図18は、実施形態2に係る加工装置の要部の構成を示す斜視図である。図19は、図18に示された加工装置の保持ユニットと第2のカメラを示す斜視図である。なお、図18及び図19は、実施形態1と同一部分に同一符号を付して説明を省略する。
3 加工領域
4 所定距離
5 撮影領域
10 保持ユニット
12 チャックテーブル
20 切削ユニット(加工ユニット)
30 加工送りユニット
33 ガイドレール
40 割り出し送りユニット
50 カメラ
51 第1のカメラ
52 第2のカメラ
61 マーク
100 制御ユニット
101 補正量算出部
103 座標記憶部
110 表示ユニット
123 透明部材
124 保持面
200,200−1 被加工物
208 マーク
301,301−2,301−3,301−4,301−5 第1の画像
302,302−2,302−3,302−4,302−5 第2の画像
400 切削溝(加工痕)
402,403 両端部(2点)
X 加工送り方向
Y 割り出し送り方向
Claims (6)
- 被加工物を保持する回転可能なチャックテーブルを有する保持ユニットと、該チャックテーブルに保持された被加工物を加工する加工ユニットと、該保持ユニットをX軸方向に加工送りする加工送りユニットと、Y軸方向に該加工ユニットを割り出し送りする割り出し送りユニットと、該チャックテーブルに保持された被加工物を撮影する割り出し送り方向に移動可能なカメラと、各構成要素を制御する制御ユニットと、を含む加工装置であって、
該加工送りユニットは、
被加工物を該加工ユニットで加工する加工領域と、該加工領域からX軸方向に所定距離離れた位置で被加工物を該カメラで撮影する撮影領域との間で該保持ユニットをガイドレールに沿って移動させ、
該制御ユニットは、
該チャックテーブルを加工送りしつつ該加工ユニットで被加工物に直線状の加工痕を作成後、該チャックテーブルを該撮影領域に移動させて該加工痕を該カメラで撮影し、1本の該加工痕の加工送り方向に離れた2点のY座標から、Y軸方向の補正値又は該チャックテーブルの補正角度を算出する補正量算出部と、を備え、
該撮影領域で該チャックテーブルを加工送りする際に該カメラの位置をY方向に補正又は該チャックテーブルを該補正角度回転させる加工装置。 - 該チャックテーブルは、被加工物を保持する保持面に透明部材を有し、
該カメラは、該透明部材を挟んで上下となる位置に、該加工ユニット近傍の第1のカメラと、該第1のカメラより該加工ユニットから遠い第2のカメラとを有し、
該制御ユニットは、該第1のカメラで撮影した領域に第2のカメラを位置付けて該第1のカメラと該第2のカメラの位置ずれをX、Y座標で記憶する座標記憶部と、をさらに備え、該座標記憶部に記憶されたX、Y座標に基づいて該第1のカメラで撮影した領域に該第2のカメラを位置づける請求項1に記載の加工装置。 - 該第1のカメラで撮影した第1の画像と、該第2のカメラで撮影した第2の画像を表示する表示ユニットをさらに備え、
該表示ユニットには、一方の該画像が加工送り方向が反転した状態で、該第1の画像及び該第2の画像を重ねて、又は加工送り方向に並んで表示する請求項2に記載の加工装置。 - 被加工物を保持する回転可能なチャックテーブルを有する保持ユニットと、該チャックテーブルに保持された被加工物を加工する加工ユニットと、該保持ユニットをX軸方向に加工送りする加工送りユニットと、Y軸方向に該加工ユニットを割り出し送りする割り出し送りユニットと、該チャックテーブルに保持された被加工物を撮影するY軸方向に移動可能なカメラと、各構成要素を制御する制御ユニットと、を含み構成される加工装置であって、
該加工送りユニットは、
被加工物を該加工ユニットで加工する加工領域と、該加工領域から所定距離離れた位置で被加工物を該カメラで撮影する撮影領域との間で該保持ユニットをガイドレールに沿って移動させ、
該カメラは、該加工ユニット近傍の第1のカメラと、該第1のカメラより該加工ユニットから離れた第2のカメラとを有し、
該制御ユニットは、
該第1のカメラで被加工物又は該チャックテーブルの直線状のマークを撮影し、該チャックテーブルを回転させて該マークの向きを該加工送り方向と平行に調整した後に、該チャックテーブルを該撮影領域に移動させて該マークを該第2のカメラで撮影し、該マークの該加工送り方向に離れた2点のX、Y座標から、Y軸方向の補正値又は補正角度を算出する補正量算出部と、を備え、
該撮影領域で該チャックテーブルを加工送りして撮影する際に該補正値に基づいて該カメラを割り出し送り又は該チャックテーブルを回転させる加工装置。 - 該チャックテーブルは、被加工物を保持する保持面に透明部材を有し、
該カメラは、該透明部材を挟んで上下となる位置に、該加工ユニット近傍の第1のカメラと、該第1のカメラより該加工ユニットから遠い第2のカメラとを有し、
該制御ユニットは、該第1のカメラで撮影した領域に第2のカメラを位置付けて該第1のカメラと該第2のカメラの位置ずれをX、Y座標で記憶する座標記憶部と、をさらに備え、該座標記憶部に記憶されたX、Y座標に基づいて該第1のカメラで撮影した領域に該第2のカメラを位置づける請求項4に記載の加工装置。 - 該第1のカメラで撮影した第1の画像と、該第2のカメラで撮影した第2の画像を表示する表示ユニットをさらに備え、
該表示ユニットには、一方の該画像が加工送り方向が反転した状態で、該第1の画像及び該第2の画像を重ねて、又は加工送り方向に並んで表示する請求項5に記載の加工装置。
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