JP7475781B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP7475781B2 JP7475781B2 JP2020111521A JP2020111521A JP7475781B2 JP 7475781 B2 JP7475781 B2 JP 7475781B2 JP 2020111521 A JP2020111521 A JP 2020111521A JP 2020111521 A JP2020111521 A JP 2020111521A JP 7475781 B2 JP7475781 B2 JP 7475781B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
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- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
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- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
本発明の他の態様によれば、表面に設定されている複数の分割予定ラインによって区画された複数の領域の各々にデバイスが設けられている板状の被加工物の該表面側を保持した状態で該被加工物を加工する加工装置であって、一面と、該一面とは反対側に位置する他面と、を含み、該一面から該他面まで透明材で形成されている所定の領域を有する板状の保持部材を有し、該被加工物の該表面側を保持するチャックテーブルと、該チャックテーブルで該表面が保持された該被加工物を加工して、該被加工物に加工溝を形成する加工ユニットと、第1の撮像素子を有し、該チャックテーブルの上方に配置され、該チャックテーブルで保持された該被加工物の裏面側を撮像する第1の撮像ユニットと、第2の撮像素子を有し、該チャックテーブルの下方に配置され、該第1の撮像ユニットで撮像する領域と該被加工物の厚さ方向で対応する領域において該被加工物の該表面側を、該保持部材を介して撮像する第2の撮像ユニットと、該第1の撮像ユニット及び該第2の撮像ユニットの少なくともいずれかで取得した該被加工物の画像を表示する表示装置と、画像処理を実行するプログラムが記憶された記憶装置と、該プログラムに従って画像を処理する処理装置と、を有し、該裏面側に形成された該加工溝を該第1の撮像ユニットで撮像した第1の画像と、該表面側に形成された該加工溝を該第2の撮像ユニットで撮像した第2の画像と、の向きが一致する様に、該第1の画像及び該第2の画像のいずれかを所定方向で反転させ、且つ、該第1の画像及び該第2の画像の両方にエッジ検出を施し、該第1の画像及び該第2の画像の両方の切削溝の縁部が表示される様に該エッジ検出が施された該第1の画像及び該第2の画像を重ねた状態で、該第1の画像における該加工溝と、該第2の画像における該加工溝との両方を該表示装置に表示させる制御部と、を備えることを特徴とする加工装置が提供される。
4:基台
4a,4b,4d:開口
4c:支持構造
6:カセット
10:チャックテーブル
11:被加工物
11a:表面
11b:裏面
11c,11c1,11c2:切削溝
12:保持部材
12a:一面
12b:他面
12c1:第1吸引路
12c2:第2吸引路
12c3:点
12d:開口部
12e:外周吸引路
12f:吸引路
13:分割予定ライン
14:吸引源
15:デバイス
16:枠体
16a:開口部
16b:プーリー部
17:テープ
18:X軸移動テーブル
18a:底板
18b:側板
18c:天板
18d:空間
19:フレーム
20:X軸ガイドレール
20a:X軸リニアスケール
21:被加工物ユニット
22:X軸ボールネジ
23a:表面画像
23b:裏面画像
23c:重畳画像
24:X軸パルスモーター
26:X軸移動機構
28:ベルト
30:回転駆動源
30a:プーリー
32:Y軸移動機構
34:Y軸ガイドレール
36:Y軸移動テーブル
38:Y軸ボールネジ
40:Y軸パルスモーター
42:Z軸移動機構
42a:支持構造
44:Z軸ガイドレール
46:Z軸移動プレート
48:Z軸ボールネジ
50:Z軸パルスモーター
52:支持アーム
54:下方撮像ユニット
56:低倍率カメラ
56a:照明装置
58:高倍率カメラ
58a:照明装置
60:加工ユニット移動機構
62:Y軸ガイドレール
64:Y軸移動プレート
66:Y軸ボールネジ
68:Y軸パルスモーター
70:Z軸移動プレート
72:Z軸ガイドレール
74:Z軸ボールネジ
76:Z軸パルスモーター
78:切削ユニット
80:スピンドルハウジング
82a:スピンドル
82b:切削ブレード
84:上方撮像ユニット
86:洗浄ユニット
88:洗浄テーブル
90:ノズル
92:タッチパネル
94:制御部
96:記憶装置
102:レーザー加工装置
104:静止基台
106:Y軸移動テーブル
108:Y軸ガイドレール
108a:Y軸スケール
110:Y軸ボールネジ
112:Y軸パルスモーター
114:Y軸移動機構
116:コラム
118:ケーシング
120:レーザー照射ユニット
120a:レーザー発振器
122:照射ヘッド
122a:集光レンズ
A:領域
L:レーザービーム
Claims (2)
- 表面に設定されている複数の分割予定ラインによって区画された複数の領域の各々にデバイスが設けられている板状の被加工物の該表面側を保持した状態で該被加工物を加工する加工装置であって、
一面と、該一面とは反対側に位置する他面と、を含み、該一面から該他面まで透明材で形成されている所定の領域を有する板状の保持部材を有し、該被加工物の該表面側を保持するチャックテーブルと、
該チャックテーブルで該表面が保持された該被加工物を加工して、該被加工物に加工溝を形成する加工ユニットと、
第1の撮像素子を有し、該チャックテーブルの上方に配置され、該チャックテーブルで保持された該被加工物の裏面側を撮像する第1の撮像ユニットと、
第2の撮像素子を有し、該チャックテーブルの下方に配置され、該第1の撮像ユニットで撮像する領域と該被加工物の厚さ方向で対応する領域において該被加工物の該表面側を、該保持部材を介して撮像する第2の撮像ユニットと、
該第1の撮像ユニット及び該第2の撮像ユニットの少なくともいずれかで取得した該被加工物の画像を表示する表示装置と、
画像処理を実行するプログラムが記憶された記憶装置と、該プログラムに従って画像を処理する処理装置と、を有し、該裏面側に形成された該加工溝を該第1の撮像ユニットで撮像した第1の画像と、該表面側に形成された該加工溝を該第2の撮像ユニットで撮像した第2の画像と、の向きが一致する様に、該第1の画像及び該第2の画像のいずれか一方を所定方向で反転させ、且つ、該一方を半透過画像とし、該一方を半透過画像が上となる様に該第1の画像及び該第2の画像を重ねた状態で、該第1の画像における該加工溝と、該第2の画像における該加工溝との両方を該表示装置に表示させる制御部と、
を備えることを特徴とする加工装置。 - 表面に設定されている複数の分割予定ラインによって区画された複数の領域の各々にデバイスが設けられている板状の被加工物の該表面側を保持した状態で該被加工物を加工する加工装置であって、
一面と、該一面とは反対側に位置する他面と、を含み、該一面から該他面まで透明材で形成されている所定の領域を有する板状の保持部材を有し、該被加工物の該表面側を保持するチャックテーブルと、
該チャックテーブルで該表面が保持された該被加工物を加工して、該被加工物に加工溝を形成する加工ユニットと、
第1の撮像素子を有し、該チャックテーブルの上方に配置され、該チャックテーブルで保持された該被加工物の裏面側を撮像する第1の撮像ユニットと、
第2の撮像素子を有し、該チャックテーブルの下方に配置され、該第1の撮像ユニットで撮像する領域と該被加工物の厚さ方向で対応する領域において該被加工物の該表面側を、該保持部材を介して撮像する第2の撮像ユニットと、
該第1の撮像ユニット及び該第2の撮像ユニットの少なくともいずれかで取得した該被加工物の画像を表示する表示装置と、
画像処理を実行するプログラムが記憶された記憶装置と、該プログラムに従って画像を処理する処理装置と、を有し、該裏面側に形成された該加工溝を該第1の撮像ユニットで撮像した第1の画像と、該表面側に形成された該加工溝を該第2の撮像ユニットで撮像した第2の画像と、の向きが一致する様に、該第1の画像及び該第2の画像のいずれかを所定方向で反転させ、且つ、該第1の画像及び該第2の画像の両方にエッジ検出を施し、該第1の画像及び該第2の画像の両方の切削溝の縁部が表示される様に該エッジ検出が施された該第1の画像及び該第2の画像を重ねた状態で、該第1の画像における該加工溝と、該第2の画像における該加工溝との両方を該表示装置に表示させる制御部と、
を備えることを特徴とする加工装置。
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