JP2021077750A - 外部電極用ペースト - Google Patents
外部電極用ペースト Download PDFInfo
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- JP2021077750A JP2021077750A JP2019202445A JP2019202445A JP2021077750A JP 2021077750 A JP2021077750 A JP 2021077750A JP 2019202445 A JP2019202445 A JP 2019202445A JP 2019202445 A JP2019202445 A JP 2019202445A JP 2021077750 A JP2021077750 A JP 2021077750A
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- 239000011347 resin Substances 0.000 claims abstract description 63
- 229920005989 resin Polymers 0.000 claims abstract description 63
- 239000002904 solvent Substances 0.000 claims abstract description 34
- 239000000945 filler Substances 0.000 claims abstract description 26
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 16
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims description 12
- UODXCYZDMHPIJE-UHFFFAOYSA-N menthanol Chemical compound CC1CCC(C(C)(C)O)CC1 UODXCYZDMHPIJE-UHFFFAOYSA-N 0.000 claims description 4
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 claims description 2
- IBLKWZIFZMJLFL-UHFFFAOYSA-N 1-phenoxypropan-2-ol Chemical compound CC(O)COC1=CC=CC=C1 IBLKWZIFZMJLFL-UHFFFAOYSA-N 0.000 claims description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 2
- HBNHCGDYYBMKJN-UHFFFAOYSA-N 2-(4-methylcyclohexyl)propan-2-yl acetate Chemical compound CC1CCC(C(C)(C)OC(C)=O)CC1 HBNHCGDYYBMKJN-UHFFFAOYSA-N 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 claims description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 abstract description 9
- 239000000919 ceramic Substances 0.000 description 31
- 238000005520 cutting process Methods 0.000 description 17
- 239000002003 electrode paste Substances 0.000 description 16
- 239000003985 ceramic capacitor Substances 0.000 description 9
- 239000001856 Ethyl cellulose Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 235000019325 ethyl cellulose Nutrition 0.000 description 8
- 229920001249 ethyl cellulose Polymers 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- LNAZSHAWQACDHT-XIYTZBAFSA-N (2r,3r,4s,5r,6s)-4,5-dimethoxy-2-(methoxymethyl)-3-[(2s,3r,4s,5r,6r)-3,4,5-trimethoxy-6-(methoxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6r)-4,5,6-trimethoxy-2-(methoxymethyl)oxan-3-yl]oxyoxane Chemical compound CO[C@@H]1[C@@H](OC)[C@H](OC)[C@@H](COC)O[C@H]1O[C@H]1[C@H](OC)[C@@H](OC)[C@H](O[C@H]2[C@@H]([C@@H](OC)[C@H](OC)O[C@@H]2COC)OC)O[C@@H]1COC LNAZSHAWQACDHT-XIYTZBAFSA-N 0.000 description 1
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- WDQMWEYDKDCEHT-UHFFFAOYSA-N 2-ethylhexyl 2-methylprop-2-enoate Chemical compound CCCCC(CC)COC(=O)C(C)=C WDQMWEYDKDCEHT-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 1
- 229940081735 acetylcellulose Drugs 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- NZZFYRREKKOMAT-UHFFFAOYSA-N diiodomethane Chemical compound ICI NZZFYRREKKOMAT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 235000010981 methylcellulose Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J101/00—Adhesives based on cellulose, modified cellulose, or cellulose derivatives
- C09J101/08—Cellulose derivatives
- C09J101/26—Cellulose ethers
- C09J101/28—Alkyl ethers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Battery Electrode And Active Subsutance (AREA)
Abstract
【解決手段】外部電極用ペーストは、少なくとも一部が共重合しているエトセル系樹脂とアクリル系樹脂とを含む樹脂と、Cuフィラーと、溶剤とを含み、樹脂と溶剤との間に生じる界面張力が15mN/m以上である。
【選択図】なし
Description
少なくとも一部が共重合しているエトセル系樹脂とアクリル系樹脂とを含む樹脂と、
Cuフィラーと、
溶剤と、
を含み、
前記樹脂と前記溶剤との間に生じる界面張力が15mN/m以上であることを特徴とする。
11 ビニル基
20 アクリル系樹脂
31 外部電極用ペースト
31a セラミック素体に付着した外部電極用ペースト
32 セラミック素体
40 セラミック素体
41 端面
42 内部電極
50a、50b 積層セラミックコンデンサ
51a、51b セラミック素体
52a、52b 外部電極
Claims (6)
- 少なくとも一部が共重合しているエトセル系樹脂とアクリル系樹脂とを含む樹脂と、
Cuフィラーと、
溶剤と、
を含み、
前記樹脂と前記溶剤との間に生じる界面張力が15mN/m以上であることを特徴とする外部電極用ペースト。 - 前記樹脂と前記溶剤との間に生じる界面張力が40mN/m以上56mN/m未満であることを特徴とする請求項1に記載の外部電極用ペースト。
- 前記Cuフィラーの表面にはCが重合しており、
前記Cuフィラーの表面に重合しているCの量は、0.11重量%以上0.98重量%以下であることを特徴とする請求項1または2に記載の外部電極用ペースト。 - 前記Cuフィラーは、CuおよびCu合金のうちの少なくとも一方からなる粒子であって、その平均粒径D50が8μm以下であることを特徴とする請求項1〜3のいずれかに記載の外部電極用ペースト。
- 前記外部電極用ペーストに含まれる前記溶剤以外の不揮発成分の割合は、15vol%以上32vol%以下であることを特徴とする請求項1〜4のいずれかに記載の外部電極用ペースト。
- 前記溶剤は、ターピネオール、ジヒドロターピネオール、ジヒドロターピニルアセテート、プロピレングリコールフェニルエーテル、ベンジルアルコール、テキサノール、および、ブチルカルビトールアセテートのうちの少なくとも1つを含むことを特徴とする請求項1〜5のいずれかに記載の外部電極用ペースト。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019202445A JP7192743B2 (ja) | 2019-11-07 | 2019-11-07 | 外部電極用ペースト |
KR1020200139895A KR102366442B1 (ko) | 2019-11-07 | 2020-10-27 | 외부전극용 페이스트 |
CN202011219717.7A CN112786309B (zh) | 2019-11-07 | 2020-11-04 | 外部电极用膏 |
Applications Claiming Priority (1)
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---|---|---|---|
JP2019202445A JP7192743B2 (ja) | 2019-11-07 | 2019-11-07 | 外部電極用ペースト |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021077750A true JP2021077750A (ja) | 2021-05-20 |
JP7192743B2 JP7192743B2 (ja) | 2022-12-20 |
Family
ID=75750309
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JP2019202445A Active JP7192743B2 (ja) | 2019-11-07 | 2019-11-07 | 外部電極用ペースト |
Country Status (3)
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JP (1) | JP7192743B2 (ja) |
KR (1) | KR102366442B1 (ja) |
CN (1) | CN112786309B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004264031A (ja) * | 2003-01-23 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 導電性粒子の計測方法 |
JP2013071986A (ja) * | 2011-09-27 | 2013-04-22 | Goo Chemical Co Ltd | 焼成用バインダー組成物 |
JP2017190404A (ja) * | 2016-04-14 | 2017-10-19 | 新中村化学工業株式会社 | 焼成ペースト組成物、及び共重合体の製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2370568B (en) * | 1999-12-13 | 2003-01-22 | Murata Manufacturing Co | Monolithic ceramic electronic component and production process therefor |
US7158364B2 (en) * | 2005-03-01 | 2007-01-02 | Tdk Corporation | Multilayer ceramic capacitor and method of producing the same |
JP2008050594A (ja) | 2006-07-26 | 2008-03-06 | Sekisui Chem Co Ltd | バインダー樹脂組成物 |
JP4442596B2 (ja) * | 2006-09-08 | 2010-03-31 | Tdk株式会社 | 導電性ペースト、積層セラミック電子部品及びその製造方法 |
JP4359607B2 (ja) * | 2006-09-19 | 2009-11-04 | Tdk株式会社 | 電極段差吸収用印刷ペースト及び積層セラミック電子部品の製造方法 |
TW200824076A (en) * | 2006-11-16 | 2008-06-01 | Chipmos Technologies Inc | Carrier film having leads with improved strength and semiconductor package utilizing the film |
JP5633285B2 (ja) * | 2010-01-25 | 2014-12-03 | 日立化成株式会社 | 電極用ペースト組成物及び太陽電池 |
JP5683202B2 (ja) * | 2010-10-13 | 2015-03-11 | ナミックス株式会社 | 熱硬化型導電性ペースト |
JP5843009B2 (ja) * | 2012-06-15 | 2016-01-13 | 株式会社村田製作所 | 導電性ペースト、ならびに積層セラミック電子部品およびその製造方法 |
KR20160060925A (ko) * | 2014-11-21 | 2016-05-31 | 한국에너지기술연구원 | 금속 입자를 함유한 태양전지 후면전극용 페이스트 조성물 및 제조방법 |
JP2016213355A (ja) * | 2015-05-11 | 2016-12-15 | ニチバン株式会社 | 電子部品止め用粘着剤組成物及び粘着テープ |
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2019
- 2019-11-07 JP JP2019202445A patent/JP7192743B2/ja active Active
-
2020
- 2020-10-27 KR KR1020200139895A patent/KR102366442B1/ko active IP Right Grant
- 2020-11-04 CN CN202011219717.7A patent/CN112786309B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004264031A (ja) * | 2003-01-23 | 2004-09-24 | Matsushita Electric Ind Co Ltd | 導電性粒子の計測方法 |
JP2013071986A (ja) * | 2011-09-27 | 2013-04-22 | Goo Chemical Co Ltd | 焼成用バインダー組成物 |
JP2017190404A (ja) * | 2016-04-14 | 2017-10-19 | 新中村化学工業株式会社 | 焼成ペースト組成物、及び共重合体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN112786309B (zh) | 2023-07-28 |
KR102366442B1 (ko) | 2022-02-23 |
CN112786309A (zh) | 2021-05-11 |
KR20210055596A (ko) | 2021-05-17 |
JP7192743B2 (ja) | 2022-12-20 |
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