JP2021053738A - 研削装置及び研削ヘッド - Google Patents
研削装置及び研削ヘッド Download PDFInfo
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- JP2021053738A JP2021053738A JP2019178908A JP2019178908A JP2021053738A JP 2021053738 A JP2021053738 A JP 2021053738A JP 2019178908 A JP2019178908 A JP 2019178908A JP 2019178908 A JP2019178908 A JP 2019178908A JP 2021053738 A JP2021053738 A JP 2021053738A
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- Prior art keywords
- grinding
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- head body
- recess
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Links
- 238000000227 grinding Methods 0.000 title claims abstract description 103
- 230000007246 mechanism Effects 0.000 claims abstract description 56
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 9
- 239000000428 dust Substances 0.000 abstract description 35
- 235000012431 wafers Nutrition 0.000 description 43
- 238000000034 method Methods 0.000 description 18
- 230000008569 process Effects 0.000 description 13
- 239000004065 semiconductor Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 5
- 238000005498 polishing Methods 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000009837 dry grinding Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/047—Grinding heads for working on plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
Claims (6)
- 被削物を化学機械研削する研削装置において、
前記被削物を着脱自在に支持するテーブル機構と、
このテーブル機構の上方に対向配置された研削ヘッドと、
前記テーブル機構と前記研削ヘッドとを相対的に運動させる駆動機構と、
前記研削ヘッドに吸引流路を介して接続される吸引ポンプを備え、
前記研削ヘッドは、円板状に形成され、その外周下縁側で円環状に配置された砥石を保持するヘッド本体と、
このヘッド本体の中央部に前記テーブル機構側に開口を向けて形成された凹部と、
この凹部に連通すると共に、前記吸引流路に連通する吸引孔を具備する研削装置。 - 前記凹部内には羽根が設けられている請求項1に記載の研削装置。
- 被削物を化学機械研削する研削装置において、
前記被削物を着脱自在に支持するテーブル機構と、
このテーブル機構の上方に対向配置された研削ヘッドと、
前記テーブル機構と前記研削ヘッドとを相対的に運動させる駆動機構と、
前記研削ヘッドに吸引流路を介して接続される吸引ポンプを備え、
前記研削ヘッドは、円板状に形成され、その外周下縁側で円環状に配置された砥石を保持するヘッド本体と、
このヘッド本体の中央部に前記テーブル機構側に開口を向けて形成された凹部と、
この凹部に連通すると共に、前記吸引流路に連通する吸引孔と、
前記ヘッド本体の外周側を覆う外部カバーと、
前記ヘッド本体に設けられ、前記凹部内側と前記外部カバー内側とを連通する孔又は溝を具備する研削装置。 - 前記凹部内には羽根が設けられている請求項3に記載の研削装置。
- テーブル機構に載置された被削物を化学機械研削する研削ヘッドにおいて、
円板状に形成され、その外周下縁側で円環状に配置された砥石を保持するヘッド本体と、
このヘッド本体の中央部に前記テーブル機構側に開口を向けて形成された凹部と、
前記ヘッド本体に設けられ、前記凹部に連通すると共に、外部に設けられた吸引ポンプに接続される吸引孔を具備する研削ヘッド。 - テーブル機構に載置された被削物を化学機械研削する研削ヘッドにおいて、
円板状に形成され、その外周下縁側で円環状に配置された砥石を保持するヘッド本体と、
このヘッド本体の中央部に前記テーブル機構側に開口を向けて形成された凹部と、
前記ヘッド本体に設けられ、前記凹部に連通すると共に、外部に設けられた吸引ポンプに接続される吸引孔と、
前記ヘッド本体の外周側を覆う外部カバーと、
前記ヘッド本体に設けられ、前記ヘッド本体外側と前記外部カバー内側とを連通する孔又は溝とを具備する研削ヘッド。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019178908A JP6865449B2 (ja) | 2019-09-30 | 2019-09-30 | 研削装置及び研削ヘッド |
PCT/JP2020/024054 WO2021065102A1 (ja) | 2019-09-30 | 2020-06-19 | 研削装置及び研削ヘッド |
TW109120905A TW202114823A (zh) | 2019-09-30 | 2020-06-19 | 磨削裝置及磨削頭 |
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---|---|---|---|
JP2019178908A JP6865449B2 (ja) | 2019-09-30 | 2019-09-30 | 研削装置及び研削ヘッド |
Publications (2)
Publication Number | Publication Date |
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JP2021053738A true JP2021053738A (ja) | 2021-04-08 |
JP6865449B2 JP6865449B2 (ja) | 2021-04-28 |
Family
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JP2019178908A Active JP6865449B2 (ja) | 2019-09-30 | 2019-09-30 | 研削装置及び研削ヘッド |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6865449B2 (ja) |
TW (1) | TW202114823A (ja) |
WO (1) | WO2021065102A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113560972A (zh) * | 2021-07-23 | 2021-10-29 | 江苏富联通讯技术有限公司 | 5g通信光芯片sip封装用圆片减薄设备及其使用方法 |
KR20240056794A (ko) | 2021-10-26 | 2024-04-30 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 방법 및 기판 처리 시스템 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023046629A (ja) * | 2021-09-24 | 2023-04-05 | 株式会社Screenホールディングス | 研磨ヘッド及びそれを備えた研磨装置並びに基板処理装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1015823A (ja) * | 1996-07-04 | 1998-01-20 | Canon Inc | 化学機械研磨装置における研磨スラリー供給方法および装置 |
JP2016221636A (ja) * | 2015-06-01 | 2016-12-28 | 株式会社ディスコ | 研削装置 |
JP2019098503A (ja) * | 2017-12-08 | 2019-06-24 | 株式会社ディスコ | 乾式研磨装置 |
-
2019
- 2019-09-30 JP JP2019178908A patent/JP6865449B2/ja active Active
-
2020
- 2020-06-19 WO PCT/JP2020/024054 patent/WO2021065102A1/ja active Application Filing
- 2020-06-19 TW TW109120905A patent/TW202114823A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1015823A (ja) * | 1996-07-04 | 1998-01-20 | Canon Inc | 化学機械研磨装置における研磨スラリー供給方法および装置 |
JP2016221636A (ja) * | 2015-06-01 | 2016-12-28 | 株式会社ディスコ | 研削装置 |
JP2019098503A (ja) * | 2017-12-08 | 2019-06-24 | 株式会社ディスコ | 乾式研磨装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113560972A (zh) * | 2021-07-23 | 2021-10-29 | 江苏富联通讯技术有限公司 | 5g通信光芯片sip封装用圆片减薄设备及其使用方法 |
KR20240056794A (ko) | 2021-10-26 | 2024-04-30 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 방법 및 기판 처리 시스템 |
Also Published As
Publication number | Publication date |
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TW202114823A (zh) | 2021-04-16 |
WO2021065102A1 (ja) | 2021-04-08 |
JP6865449B2 (ja) | 2021-04-28 |
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