JP2021041430A5 - - Google Patents
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- Publication number
- JP2021041430A5 JP2021041430A5 JP2019165701A JP2019165701A JP2021041430A5 JP 2021041430 A5 JP2021041430 A5 JP 2021041430A5 JP 2019165701 A JP2019165701 A JP 2019165701A JP 2019165701 A JP2019165701 A JP 2019165701A JP 2021041430 A5 JP2021041430 A5 JP 2021041430A5
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- alloy
- low melting
- based low
- bonding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910016334 Bi—In Inorganic materials 0.000 claims 15
- 230000008018 melting Effects 0.000 claims 9
- 238000002844 melting Methods 0.000 claims 9
- 229910045601 alloy Inorganic materials 0.000 claims 8
- 239000000956 alloy Substances 0.000 claims 8
- 239000010410 layer Substances 0.000 claims 3
- 229910052797 bismuth Inorganic materials 0.000 claims 2
- 239000011247 coating layer Substances 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 229910052738 indium Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 229910003266 NiCo Inorganic materials 0.000 claims 1
- 229910020830 Sn-Bi Inorganic materials 0.000 claims 1
- 229910018728 Sn—Bi Inorganic materials 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011162 core material Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 238000010587 phase diagram Methods 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019165701A JP7080867B2 (ja) | 2019-09-11 | 2019-09-11 | Ｓｎ－Ｂｉ－Ｉｎ系低融点接合部材、微小部材および半導体電子回路、バンプの製造方法ならびに半導体電子回路の実装方法 |
| PCT/JP2020/033647 WO2021049437A1 (ja) | 2019-09-11 | 2020-09-04 | Ｓｎ－Ｂｉ－Ｉｎ系低融点接合部材およびその製造方法、ならびに半導体電子回路およびその実装方法 |
| US17/641,568 US20220395935A1 (en) | 2019-09-11 | 2020-09-04 | Sn-bi-in-based low melting-point joining member, production method therefor, semiconductor electronic circuit, and mounting method therefor |
| EP20863183.8A EP4029639A4 (en) | 2019-09-11 | 2020-09-04 | SN-BI BASED LOW MELTING POINT CONNECTOR, METHOD OF MANUFACTURE THEREOF, SEMICONDUCTOR ELECTRONIC CIRCUIT AND ASSEMBLY METHOD THEREOF |
| KR1020227011610A KR20220055494A (ko) | 2019-09-11 | 2020-09-04 | Sn-Bi-In계 저융점 접합 부재 및 그 제조 방법, 및 반도체 전자 회로 및 그 실장 방법 |
| TW109131104A TWI879799B (zh) | 2019-09-11 | 2020-09-10 | Ｓｎ－Ｂｉ－Ｉｎ系低熔點接合構件及其製造方法，以及半導體電子回路及其構裝方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019165701A JP7080867B2 (ja) | 2019-09-11 | 2019-09-11 | Ｓｎ－Ｂｉ－Ｉｎ系低融点接合部材、微小部材および半導体電子回路、バンプの製造方法ならびに半導体電子回路の実装方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021041430A JP2021041430A (ja) | 2021-03-18 |
| JP2021041430A5 true JP2021041430A5 (enrdf_load_stackoverflow) | 2022-01-20 |
| JP7080867B2 JP7080867B2 (ja) | 2022-06-06 |
Family
ID=74862861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019165701A Active JP7080867B2 (ja) | 2019-09-11 | 2019-09-11 | Ｓｎ－Ｂｉ－Ｉｎ系低融点接合部材、微小部材および半導体電子回路、バンプの製造方法ならびに半導体電子回路の実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7080867B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7080939B2 (ja) * | 2020-09-04 | 2022-06-06 | 株式会社新菱 | 低融点接合部材およびその製造方法ならびに半導体電子回路およびその実装方法 |
| JP7590236B2 (ja) * | 2021-03-17 | 2024-11-26 | 株式会社三共 | 遊技機 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5344607A (en) * | 1993-06-16 | 1994-09-06 | International Business Machines Corporation | Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium |
| TW369451B (en) | 1996-05-10 | 1999-09-11 | Ford Motor Co | Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substrates |
| JP2001219267A (ja) | 2000-02-09 | 2001-08-14 | Nippon Macdermid Kk | 錫−インジウム−ビスマスはんだ合金めっき層の形成方法 |
| US8293370B2 (en) | 2006-08-04 | 2012-10-23 | Panasonic Corporation | Bonding material, bonded portion and circuit board |
| JP5534122B1 (ja) | 2014-02-04 | 2014-06-25 | 千住金属工業株式会社 | 核ボール、はんだペースト、フォームはんだ、フラックスコート核ボールおよびはんだ継手 |
| KR20160145191A (ko) | 2014-10-10 | 2016-12-19 | 이시하라 케미칼 가부시키가이샤 | 합금 범프의 제조방법 |
| JP2018079480A (ja) | 2016-11-14 | 2018-05-24 | 住友金属鉱山株式会社 | 低温用のＢｉ−Ｉｎ−Ｓｎ系はんだ合金、それを用いた電子部品実装基板及びその実装基板を搭載した装置 |
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2019
- 2019-09-11 JP JP2019165701A patent/JP7080867B2/ja active Active
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