US20090020871A1 - Semiconductor chip with solder bump suppressing growth of inter-metallic compound and method of fabricating the same - Google Patents
Semiconductor chip with solder bump suppressing growth of inter-metallic compound and method of fabricating the same Download PDFInfo
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- US20090020871A1 US20090020871A1 US12/162,065 US16206506A US2009020871A1 US 20090020871 A1 US20090020871 A1 US 20090020871A1 US 16206506 A US16206506 A US 16206506A US 2009020871 A1 US2009020871 A1 US 2009020871A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J3/00—Circuit arrangements for ac mains or ac distribution networks
- H02J3/28—Arrangements for balancing of the load in a network by storage of energy
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0153—Electrical filters; Controlling thereof
- H03H7/0161—Bandpass filters
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/18—Networks for phase shifting
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/0347—Manufacturing methods using a lift-off mask
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/036—Manufacturing methods by patterning a pre-deposited material
- H01L2224/0361—Physical or chemical etching
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/039—Methods of manufacturing bonding areas involving a specific sequence of method steps
- H01L2224/03912—Methods of manufacturing bonding areas involving a specific sequence of method steps the bump being used as a mask for patterning the bonding area
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/039—Methods of manufacturing bonding areas involving a specific sequence of method steps
- H01L2224/03914—Methods of manufacturing bonding areas involving a specific sequence of method steps the bonding area, e.g. under bump metallisation [UBM], being used as a mask for patterning other parts
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Definitions
- the present invention relates to a semiconductor chip with a solder bump and a method of fabricating the same, and more particularly, to a semiconductor chip having a solder bump suppressing growth of an inter-metallic compound and a method of fabricating the same.
- a semiconductor package is fabricated by employing a wire bonding technique to electrically connect electrode terminals of a printed circuit board with pads of a semiconductor chip by means of conductive wires.
- the technique increases a size of the semiconductor package as compared to that of the semiconductor chip and it takes much time to complete a wire bonding process, it is limited to downsizing and mass-production of semiconductor chips.
- FIG. 1 is a sectional view illustrating a conventional semiconductor chip having a solder bump.
- FIG. 1 illustrates that a solder bump 30 is just formed on a conventional semiconductor chip 10 before packaging work on the semiconductor chip using solder is completed.
- the semiconductor chip 10 has an electrode pad 11 formed thereon. Also, the semiconductor chip 10 has a dielectric layer 21 formed thereon to allow a top surface of the electrode pad 11 to be exposed.
- One or more under bump metal (UBM) layers usually, three UBM layers 22 , 23 and 24 are formed on the electrode pad 11 , the top surface of which is exposed by the dielectric layer 21 .
- the three UBM layers include an adhesion layer 22 , a diffusion barrier layer 23 , and a wettable layer 24 .
- the solder bump 30 is finally formed on the uppermost layer 24 of the UBM layers 22 , 23 and 24 .
- the solder bump 30 when being formed, reacts with the UBM layers 22 , 23 and 24 , so that an inter-metallic compound (IMC) is created at an interface between the solder bump 30 and the UBM layers 22 , 23 and 24 .
- IMC inter-metallic compound
- solder bump 30 is melted into the UBM layers 22 , 23 and 24 .
- the UBM layers 22 , 23 and 24 are lost, and thus the solder bump 30 comes into direct contact with a metal pad 11 in the semiconductor chip 10 , so that a failure takes place between the solder bump 30 and the metal pad 11 of the semiconductor chip 10 which has bad wettability.
- the present invention has been made in view of the above-mentioned problems, and it is an objective of the present invention to provide a semiconductor chip having a solder bump, in which an interlayer isolation layer, and a penetration layer whose materials can penetrate into the solder bump are formed between at least one under bump metal (UBM) layer and the solder bump, thereby allowing a composition of the solder bump to be changed, and thus suppressing growth of an inter-metallic compound (IMC) at an interface of the solder bump.
- UBM under bump metal
- a semiconductor chip having a solder bump includes at least one metal adhesion layer formed on an electrode pad of the semiconductor chip, an interlayer isolation layer formed on the metal adhesion layer, at least one penetration layer formed on the interlayer isolation layer and penetrating into the solder bump, and the solder bump formed on the penetration layer.
- the metal adhesion layer is separated from the solder bump through the interlayer isolation layer, and a composition of the solder bump is changed through the penetration layer, so that the growth of the IMC is suppressed.
- a first metal adhesion layer may be formed of at least one of titan (Ti), Ti alloy, aluminum (Al), Al alloy, nickel (Ni), Ni alloy, copper (Cu), Cu alloy, chromium (Cr), Cr alloy, gold (Au), and Au alloy,
- a second metal adhesion layer may be formed as needed, and may be formed of at least one of Ni, Ni alloy, Cu, Cu alloy, palladium (Pd), and Pd alloy.
- the first metal adhesion layer is more firmly bonded with the interlayer isolation layer.
- the interlayer isolation layer may be formed of one of Ni, Ni alloy, Pd, and Pd alloy.
- the penetration layer may be formed of at least one of Cu, Cu alloy, antimony (Sb), Sb alloy, indium (In), In alloy, tin (Sn), Sn alloy, bismuth (Bi), Bi alloy, platinum (Pt), Pt alloy, gold (Au) and Au alloy.
- solder bump may be formed of one of Au, eutectic Pb solder (Sn/37Pb), high Pb solder (Sn/95Pb), and a lead (Pb)-free solder selected from one of Sn/Ag, Sn/Cu, Sn/Zn, Sn/Zn/Bi, Sn/Ag/Cu, and Sn/Ag/Bi.
- a method of fabricating a semiconductor chip having a solder bump comprises the steps of forming at least one metal adhesion layer on an electrode pad of the semiconductor chip, forming an interlayer isolation layer on the metal adhesion layer, forming at least one penetration layer on the interlayer isolation layer so as to penetrate into the solder bump when the solder bump is formed, and forming the solder bump on the penetration layer.
- the method may further comprise the step of, after the metal adhesion layer is formed, forming photoresist patterns on opposite ends of a top surface of the metal adhesion layer.
- the interlayer isolation layer may be formed on the metal adhesion layer between the photoresist patterns.
- the step of forming the interlayer isolation layer may be performed by a sputtering or plating process.
- the step of forming the penetration layer may be performed by a sputtering or plating process.
- the method may further comprise the step of reflowing the solder bump.
- the penetration layer penetrates into the solder bump through the reflow process, so that the growth of the IMC is suppressed.
- FIG. 1 is a sectional view illustrating a conventional semiconductor chip having a solder bump
- FIG. 2 is a sectional view illustrating a semiconductor chip having a solder bump suppressing growth of an inter-metallic compound (IMC) in accordance with the present invention
- FIG. 3 is a flow chart illustrating a process of forming a solder bump on a semiconductor chip so as to suppress growth of an IMC in accordance with the present invention.
- FIGS. 4 through 12 are sectional views illustrating the process of FIG. 3 .
- FIG. 2 is a sectional view illustrating a semiconductor chip having a solder bump suppressing growth of an inter-metallic compound (IMC) in accordance with the present invention.
- the semiconductor chip 100 according to the present invention has at least one electrode pad 110 formed thereon, and the semiconductor chip 100 has a dielectric layer 210 partially formed thereon to allow a top surface of the electrode pad 110 to be exposed.
- One or more metal adhesion layers 220 and 230 are formed on the electrode pad 110 , the top surface of which is exposed by the partially-formed dielectric layer 210 .
- An interlayer isolation layer 240 is formed on the metal adhesion layer 230 .
- At least one penetration layer 250 is formed on the interlayer isolation layer 240 so as to penetrate into the solder bump when the solder bump is formed.
- the solder bump 300 is formed on the penetration layer 250 .
- the electrode pad 110 may be composed of metal, and is formed on the semiconductor chip 100 .
- the electrode pad 110 electrically connects the semiconductor chip 100 with an external circuit board.
- the dielectric layer 210 is formed on the semiconductor chip 100 so as to allow the top surface of the electrode pad 110 to be exposed.
- the first metal adhesion layer 220 may be composed of at least one of titan (Ti), Ti alloy, aluminum (Al), Al alloy, nickel (Ni), Ni alloy, copper (Cu), Cu alloy, chromium (Cr), Cr alloy, gold (Au), and Au alloy, and is formed on both the partially-formed dielectric layer 210 and the electrode pad 110 whose top surface is exposed by the dielectric layer 210 .
- the UBM layers 220 and 230 may be preferably formed at a thickness of 200 to 20000 ⁇ .
- the second metal adhesion layer 230 may be formed on the first metal adhesion layer 220 .
- the second metal adhesion layer 230 may be composed of a material, which is suitable to bond the first metal adhesion layer 220 and the interlayer isolation layer 240 , and preferably at least one of Ni, Ni alloy, Cu, Cu alloy, palladium (Pd), and Pd alloy.
- the interlayer isolation layer 240 may be composed of a material, which is suitable to bond the metal adhesion layers 220 and 230 and the penetration layer 250 , and preferably at least one of Ni, Ni alloy, Pd, and Pd alloy.
- the interlayer isolation layer 240 is formed on the second metal adhesion layer 230 , and thus structurally separates the metal adhesion layers 220 and 230 from the penetration layer 250 and the solder bump 300 .
- the penetration layer 250 may be composed of at least one of Cu, Cu alloy, antimony (Sb), Sb alloy, indium (In), In alloy, tin (Sn), Sn alloy, bismuth (Bi), Bi alloy, platinum (Pt), Pt alloy, gold (Au) and Au alloy, and is formed on the interlayer isolation layer 240 .
- the penetration layer 250 may have variable thickness depending on a size of the solder bump 300 , and may form 0.1 to 10% by weight in the solder bump 300 .
- Cu can give a great change to a shape and growth of the IMC when the solder bump 300 is formed of Sn-rich lead (Pb)-free solder.
- a small quantity of Cu is added to the solder bump 300 of SnAg, a property of the solder bump 300 can be improved.
- a melting point of the solder bump 300 may increase.
- the penetration layer 250 is formed between the solder bump 300 and the interlayer isolation layer 240 . Thereby, when the solder bump 300 is formed through a reflow process, the penetration layer 250 is allowed to penetrate into the solder bump 300 .
- the solder bump 300 may be composed of one of Au, Pb-free solder, and Pb solder.
- the Pb-free solder may be preferably composed of at least one of Sn/Ag, Sn/Cu, Sn/Zn, Sn/Zn/Bi, Sn/Ag/Cu, and Sn/Ag/Bi.
- the Pb solder may be selected from either one of high Pb solder and eutectic Pb solder.
- FIG. 3 is a flow chart illustrating a process of forming a solder bump on a semiconductor chip so as to suppress growth of an IMC in accordance with the present invention
- FIGS. 4 through 12 are sectional views illustrating the process of FIG. 3 .
- a electrode pad 110 is formed on a semiconductor chip 100 (S 101 ), and then a dielectric layer 210 is formed across the semiconductor chip 100 so as to allow the top surface of the electrode pad 110 to be exposed on the semiconductor chip 100 (S 102 ).
- one or more metal adhesion layers 220 and 230 are formed on the partially-formed dielectric layer 210 and the electrode pad 110 whose top surface is exposed by means of a sputtering or plating process (S 103 ).
- the metal adhesion layers 220 and 230 may have a structure composed of a first metal adhesion layer 220 alone, or the first metal adhesion layer 220 /second metal adhesion layer 230 .
- photoresist patterns 301 are formed on the second metal adhesion layer 230 in order to form an interlayer isolation layer 240 , a penetration layer 250 , and a solder bump 300 (S 104 ).
- the interlayer isolation layer 240 is formed on the second metal adhesion layer 230 by a plating or sputtering process using the photoresist patterns 301 (S 105 ).
- the interlayer isolation layer 240 may be composed of a metal such as nickel (Ni), as described above.
- At least one penetration layer 250 is formed on the interlayer isolation layer 240 by a plating or sputtering process using the photoresist patterns 301 (S 106 ).
- the penetration layer 250 may be composed of metal such as copper (Cu) as described above.
- the thickness or the volume ratio of the penetration layer 250 can be adjusted to control a quantity of the component of the penetration layer 250 penetrating into the solder bump 300 during reflowing so that the penetration layer 250 may form 0.1 to 10% by weight of the solder bump 300 .
- the wettability with the solder bump can be enhanced and any oxidation of under bump metal (such as the metal adhesion layer or the isolation layer) can be prevented. These materials undergo diffusion into the solder bump during reflow process, and thereby prevent the IMC growth.
- the solder bump 300 is formed using the photoresist patterns 301 (S 107 ).
- the solder bump 300 may be formed by an electroplating process, an electroless plating process, an evaporation process, a ball attach process, a screen printing process, a solder jet process and the like.
- the solder bump 300 may be formed of one of Au, Pb solder, and Pb-free solder.
- the photoresist patterns 301 are removed as illustrated in FIG. 10 , the metal adhesion layers 220 and 230 are etched as illustrated in FIG. 11 , and the solder bump 300 is reflowed as illustrated in FIG. 12 (S 108 ).
- the metal adhesion layers 220 and 230 are etched by wet etching using chemicals, or dry etching using a physical method. Meanwhile, on reflowing, the penetration layer 250 is melted into the solder bump 300 and thus is lost. For this reason, a composition of the solder bump 300 is changed. Therefore, the growth of the IMC which is a problem of the conventional technology can be suppressed.
- the interlayer isolation layer and the penetration layer are formed in that order, and then the solder bump is formed on the penetration layer.
- the material composing the penetration layer penetrates into the solder bump, and thus the solder bump is changed into a multi-component solder bump.
- the growth of the IMC is suppressed, and the reliability of the semiconductor chip can be improved.
Abstract
A semiconductor chip having a solder bump and a method of fabricating the same are provided. Conventionally, an inter-metallic compound (IMC) unexpectedly grows at an interface of the solder bump by means of heat generated during operation of the semiconductor chip, thereby weakening mechanical property of the semiconductor chip. To solve this drawback, the semiconductor chip includes at least one metal adhesion layer formed on an electrode pad of the semiconductor chip, an interlayer isolation layer formed on the metal adhesion layer, at least one penetration layer formed on the interlayer isolation layer and penetrating into the solder bump, and the solder bump formed on the penetration layer. Thereby, materials of the penetration layer penetrate into the solder bump to change the solder bump into a multi-component solder bump, so that the growth of the IMC is suppressed, and the reliability of the semiconductor chip can be improved.
Description
- The present invention relates to a semiconductor chip with a solder bump and a method of fabricating the same, and more particularly, to a semiconductor chip having a solder bump suppressing growth of an inter-metallic compound and a method of fabricating the same.
- In general, a semiconductor package is fabricated by employing a wire bonding technique to electrically connect electrode terminals of a printed circuit board with pads of a semiconductor chip by means of conductive wires. However, since the technique increases a size of the semiconductor package as compared to that of the semiconductor chip and it takes much time to complete a wire bonding process, it is limited to downsizing and mass-production of semiconductor chips.
- Particularly, due to high integration, high performance, and high speed of the semiconductor chip, various efforts to downsize and mass-produce the semiconductor package are tried. This recent trial results in a proposal for the semiconductor package in which the electrode terminals of a printed circuit board are directly and electrically connected with the electrode pads of a semiconductor chip through metal bumps such as solder bumps formed on the electrode pads of the semiconductor chip.
- This conventional semiconductor package fabricated through solder bumps will be described below with reference to
FIG. 1 . -
FIG. 1 is a sectional view illustrating a conventional semiconductor chip having a solder bump. - Specifically,
FIG. 1 illustrates that asolder bump 30 is just formed on aconventional semiconductor chip 10 before packaging work on the semiconductor chip using solder is completed. - As shown in
FIG. 1 , thesemiconductor chip 10 has anelectrode pad 11 formed thereon. Also, thesemiconductor chip 10 has adielectric layer 21 formed thereon to allow a top surface of theelectrode pad 11 to be exposed. One or more under bump metal (UBM) layers, usually, threeUBM layers electrode pad 11, the top surface of which is exposed by thedielectric layer 21. Here, the three UBM layers include anadhesion layer 22, a diffusion barrier layer 23, and awettable layer 24. Thesolder bump 30 is finally formed on theuppermost layer 24 of theUBM layers solder bump 30 reacts with theUBM layers solder bump 30 and theUBM layers solder bump 30 and theUBM layers - However, when the semiconductor package connected by the
solder bump 30 is actually used, heat can be generated from the solder bump. This heat causes the IMC having brittle mechanical property to unexpectedly grow at the interface between thesolder bump 30 and theUBM layers - Meanwhile, there may be other interfacial phenomena influencing the reliability of the semiconductor package. Among them, one is a phenomenon in which the
solder bump 30 is melted into theUBM layers UBM layers solder bump 30 comes into direct contact with ametal pad 11 in thesemiconductor chip 10, so that a failure takes place between thesolder bump 30 and themetal pad 11 of thesemiconductor chip 10 which has bad wettability. - Therefore, the present invention has been made in view of the above-mentioned problems, and it is an objective of the present invention to provide a semiconductor chip having a solder bump, in which an interlayer isolation layer, and a penetration layer whose materials can penetrate into the solder bump are formed between at least one under bump metal (UBM) layer and the solder bump, thereby allowing a composition of the solder bump to be changed, and thus suppressing growth of an inter-metallic compound (IMC) at an interface of the solder bump.
- According to an aspect of the present invention, there is provided a semiconductor chip having a solder bump. The semiconductor chip includes at least one metal adhesion layer formed on an electrode pad of the semiconductor chip, an interlayer isolation layer formed on the metal adhesion layer, at least one penetration layer formed on the interlayer isolation layer and penetrating into the solder bump, and the solder bump formed on the penetration layer.
- With this construction, the metal adhesion layer is separated from the solder bump through the interlayer isolation layer, and a composition of the solder bump is changed through the penetration layer, so that the growth of the IMC is suppressed.
- At this time, among the metal adhesion layers, a first metal adhesion layer may be formed of at least one of titan (Ti), Ti alloy, aluminum (Al), Al alloy, nickel (Ni), Ni alloy, copper (Cu), Cu alloy, chromium (Cr), Cr alloy, gold (Au), and Au alloy,
- Further, among the metal adhesion layers, a second metal adhesion layer may be formed as needed, and may be formed of at least one of Ni, Ni alloy, Cu, Cu alloy, palladium (Pd), and Pd alloy. Thereby, the first metal adhesion layer is more firmly bonded with the interlayer isolation layer.
- Also, the interlayer isolation layer may be formed of one of Ni, Ni alloy, Pd, and Pd alloy.
- The penetration layer may be formed of at least one of Cu, Cu alloy, antimony (Sb), Sb alloy, indium (In), In alloy, tin (Sn), Sn alloy, bismuth (Bi), Bi alloy, platinum (Pt), Pt alloy, gold (Au) and Au alloy.
- Further, the solder bump may be formed of one of Au, eutectic Pb solder (Sn/37Pb), high Pb solder (Sn/95Pb), and a lead (Pb)-free solder selected from one of Sn/Ag, Sn/Cu, Sn/Zn, Sn/Zn/Bi, Sn/Ag/Cu, and Sn/Ag/Bi.
- According to an aspect of the present invention, there is provided a method of fabricating a semiconductor chip having a solder bump. The method comprises the steps of forming at least one metal adhesion layer on an electrode pad of the semiconductor chip, forming an interlayer isolation layer on the metal adhesion layer, forming at least one penetration layer on the interlayer isolation layer so as to penetrate into the solder bump when the solder bump is formed, and forming the solder bump on the penetration layer.
- Here, the method may further comprise the step of, after the metal adhesion layer is formed, forming photoresist patterns on opposite ends of a top surface of the metal adhesion layer. The interlayer isolation layer may be formed on the metal adhesion layer between the photoresist patterns. The step of forming the interlayer isolation layer may be performed by a sputtering or plating process. The step of forming the penetration layer may be performed by a sputtering or plating process.
- Further, the method may further comprise the step of reflowing the solder bump. Thereby, the penetration layer penetrates into the solder bump through the reflow process, so that the growth of the IMC is suppressed.
- The foregoing and other objects, features and advantages of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which:
-
FIG. 1 is a sectional view illustrating a conventional semiconductor chip having a solder bump; -
FIG. 2 is a sectional view illustrating a semiconductor chip having a solder bump suppressing growth of an inter-metallic compound (IMC) in accordance with the present invention; -
FIG. 3 is a flow chart illustrating a process of forming a solder bump on a semiconductor chip so as to suppress growth of an IMC in accordance with the present invention; and -
FIGS. 4 through 12 are sectional views illustrating the process ofFIG. 3 . - Reference will now be made in detail to the exemplary embodiments of the present invention.
-
FIG. 2 is a sectional view illustrating a semiconductor chip having a solder bump suppressing growth of an inter-metallic compound (IMC) in accordance with the present invention. As shown inFIG. 2 , thesemiconductor chip 100 according to the present invention has at least oneelectrode pad 110 formed thereon, and thesemiconductor chip 100 has adielectric layer 210 partially formed thereon to allow a top surface of theelectrode pad 110 to be exposed. One or moremetal adhesion layers electrode pad 110, the top surface of which is exposed by the partially-formeddielectric layer 210. Aninterlayer isolation layer 240 is formed on themetal adhesion layer 230. At least onepenetration layer 250 is formed on theinterlayer isolation layer 240 so as to penetrate into the solder bump when the solder bump is formed. Finally, thesolder bump 300 is formed on thepenetration layer 250. - More specifically, the
electrode pad 110 may be composed of metal, and is formed on thesemiconductor chip 100. Theelectrode pad 110 electrically connects thesemiconductor chip 100 with an external circuit board. Thedielectric layer 210 is formed on thesemiconductor chip 100 so as to allow the top surface of theelectrode pad 110 to be exposed. - Among the
metal adhesion layers metal adhesion layer 220 may be composed of at least one of titan (Ti), Ti alloy, aluminum (Al), Al alloy, nickel (Ni), Ni alloy, copper (Cu), Cu alloy, chromium (Cr), Cr alloy, gold (Au), and Au alloy, and is formed on both the partially-formeddielectric layer 210 and theelectrode pad 110 whose top surface is exposed by thedielectric layer 210. TheUBM layers - The second
metal adhesion layer 230 may be formed on the firstmetal adhesion layer 220. At this time, the secondmetal adhesion layer 230 may be composed of a material, which is suitable to bond the firstmetal adhesion layer 220 and theinterlayer isolation layer 240, and preferably at least one of Ni, Ni alloy, Cu, Cu alloy, palladium (Pd), and Pd alloy. - The
interlayer isolation layer 240 may be composed of a material, which is suitable to bond themetal adhesion layers penetration layer 250, and preferably at least one of Ni, Ni alloy, Pd, and Pd alloy. Theinterlayer isolation layer 240 is formed on the secondmetal adhesion layer 230, and thus structurally separates themetal adhesion layers penetration layer 250 and thesolder bump 300. - The
penetration layer 250 may be composed of at least one of Cu, Cu alloy, antimony (Sb), Sb alloy, indium (In), In alloy, tin (Sn), Sn alloy, bismuth (Bi), Bi alloy, platinum (Pt), Pt alloy, gold (Au) and Au alloy, and is formed on theinterlayer isolation layer 240. Thepenetration layer 250 may have variable thickness depending on a size of thesolder bump 300, and may form 0.1 to 10% by weight in thesolder bump 300. Among the materials forming thepenetration layer 250, Cu can give a great change to a shape and growth of the IMC when thesolder bump 300 is formed of Sn-rich lead (Pb)-free solder. More specifically, a small quantity of Cu is added to thesolder bump 300 of SnAg, a property of thesolder bump 300 can be improved. However, when Cu is supersaturated in thesolder bump 300, a melting point of thesolder bump 300 may increase. To this end, thepenetration layer 250 is formed between thesolder bump 300 and theinterlayer isolation layer 240. Thereby, when thesolder bump 300 is formed through a reflow process, thepenetration layer 250 is allowed to penetrate into thesolder bump 300. - The
solder bump 300 may be composed of one of Au, Pb-free solder, and Pb solder. Here, the Pb-free solder may be preferably composed of at least one of Sn/Ag, Sn/Cu, Sn/Zn, Sn/Zn/Bi, Sn/Ag/Cu, and Sn/Ag/Bi. The Pb solder may be selected from either one of high Pb solder and eutectic Pb solder. -
FIG. 3 is a flow chart illustrating a process of forming a solder bump on a semiconductor chip so as to suppress growth of an IMC in accordance with the present invention, andFIGS. 4 through 12 are sectional views illustrating the process ofFIG. 3 . - The process of forming a solder bump on a semiconductor chip will be described below with reference to
FIG. 3 , andFIGS. 4 through 12 . - First, as in
FIG. 4 , aelectrode pad 110 is formed on a semiconductor chip 100 (S101), and then adielectric layer 210 is formed across thesemiconductor chip 100 so as to allow the top surface of theelectrode pad 110 to be exposed on the semiconductor chip 100 (S102). - Subsequently, as in
FIGS. 5 and 6 , one or more metal adhesion layers 220 and 230 are formed on the partially-formeddielectric layer 210 and theelectrode pad 110 whose top surface is exposed by means of a sputtering or plating process (S103). The metal adhesion layers 220 and 230 may have a structure composed of a firstmetal adhesion layer 220 alone, or the firstmetal adhesion layer 220/secondmetal adhesion layer 230. - Next, as illustrated in
FIG. 7 ,photoresist patterns 301 are formed on the secondmetal adhesion layer 230 in order to form aninterlayer isolation layer 240, apenetration layer 250, and a solder bump 300 (S104). - Then, the
interlayer isolation layer 240 is formed on the secondmetal adhesion layer 230 by a plating or sputtering process using the photoresist patterns 301 (S105). At this time, theinterlayer isolation layer 240 may be composed of a metal such as nickel (Ni), as described above. - As illustrated in
FIG. 8 , at least onepenetration layer 250 is formed on theinterlayer isolation layer 240 by a plating or sputtering process using the photoresist patterns 301 (S106). At this time, thepenetration layer 250 may be composed of metal such as copper (Cu) as described above. The thickness or the volume ratio of thepenetration layer 250 can be adjusted to control a quantity of the component of thepenetration layer 250 penetrating into thesolder bump 300 during reflowing so that thepenetration layer 250 may form 0.1 to 10% by weight of thesolder bump 300. In case of using Pt, Pt alloy, Au, or Au alloy as the penetration layer, the wettability with the solder bump can be enhanced and any oxidation of under bump metal (such as the metal adhesion layer or the isolation layer) can be prevented. These materials undergo diffusion into the solder bump during reflow process, and thereby prevent the IMC growth. - As illustrated in
FIG. 9 , thesolder bump 300 is formed using the photoresist patterns 301 (S107). At this time, thesolder bump 300 may be formed by an electroplating process, an electroless plating process, an evaporation process, a ball attach process, a screen printing process, a solder jet process and the like. As described above, thesolder bump 300 may be formed of one of Au, Pb solder, and Pb-free solder. - Next, the
photoresist patterns 301 are removed as illustrated inFIG. 10 , the metal adhesion layers 220 and 230 are etched as illustrated inFIG. 11 , and thesolder bump 300 is reflowed as illustrated inFIG. 12 (S108). At this time, the metal adhesion layers 220 and 230 are etched by wet etching using chemicals, or dry etching using a physical method. Meanwhile, on reflowing, thepenetration layer 250 is melted into thesolder bump 300 and thus is lost. For this reason, a composition of thesolder bump 300 is changed. Therefore, the growth of the IMC which is a problem of the conventional technology can be suppressed. - As can be seen from the foregoing, according to the present invention, the interlayer isolation layer and the penetration layer are formed in that order, and then the solder bump is formed on the penetration layer. Thereby, the material composing the penetration layer penetrates into the solder bump, and thus the solder bump is changed into a multi-component solder bump. Thus, the growth of the IMC is suppressed, and the reliability of the semiconductor chip can be improved.
- While this invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiment and the drawings, but, on the contrary, it is intended to cover various modifications and variations within the spirit and scope of the appended claims.
Claims (12)
1. A semiconductor chip having a solder bump, comprising:
at least one metal adhesion layer formed on an electrode pad of the semiconductor chip;
an interlayer isolation layer formed on the metal adhesion layer;
at least one penetration layer formed on the interlayer isolation layer and penetrating into the solder bump; and
the solder bump formed on the penetration layer.
2. The semiconductor chip according to claim 1 , wherein among the metal adhesion layers, a first metal adhesion layer is formed of at least one of titan (Ti), Ti alloy, aluminum (Al), Al alloy, nickel (Ni), Ni alloy, copper (Cu), Cu alloy, chromium (Cr), Cr alloy, gold (Au), and Au alloy,
3. The semiconductor chip according to claim 1 , wherein among the metal adhesion layers, a second metal adhesion layer is formed as needed, and is formed of at least one of Ni, Ni alloy, Cu, Cu alloy, palladium (Pd), and Pd alloy.
4. The semiconductor chip according to claim 1 , wherein the interlayer isolation layer is formed of one of Ni, Ni alloy, Pd, and Pd alloy.
5. The semiconductor chip according to claim 1 , wherein the penetration layer is formed of at least one of Cu, Cu alloy, antimony (Sb), Sb alloy, indium (In), In alloy, tin (Sn), Sn alloy, bismuth (Bi), Bi alloy, platinum (Pt), Pt alloy, gold (Au) and Au alloy.
6. The semiconductor chip according to claim 1 , wherein the penetration layer forms 0.1 to 10% by weight of the solder bump by controlling the thickness or the volume ratio of the penetration layer.
7. The semiconductor chip according to claim 1 , wherein the solder bump is formed of one of Au, a lead (Pb)-free solder selected from one of Sn, Sn/Ag, Sn/Cu, Sn/Zn, Sn/Zn/Bi, Sn/Ag/Cu, and Sn/Ag/Bi, and a Pb solder selected from one of high Pb solder and eutectic Pb solder.
8. A method of fabricating a semiconductor chip having a solder bump, the method comprising the steps of:
forming at least one metal adhesion layer on an electrode pad of the semiconductor chip;
forming an interlayer isolation layer on the metal adhesion layer;
forming at least one penetration layer on the interlayer isolation layer so as to penetrate into the solder bump when the solder bump is formed; and
forming the solder bump on the penetration layer.
9. The method according to claim 8 , further comprising the step of, after the metal adhesion layer is formed, forming photoresist patterns on opposite ends of a top surface of the metal adhesion layer,
wherein the interlayer isolation layer is formed on the metal adhesion layer between the photoresist patterns.
10. The method according to claim 8 , wherein the step of forming the interlayer isolation layer is performed by a sputtering or plating process.
11. The method according to claim 8 , wherein the step of forming the penetration layer is performed by a sputtering or plating process.
12. The method according to claim 8 , further comprising the step of reflowing the solder bump.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/162,065 US20090020871A1 (en) | 2005-02-18 | 2006-02-08 | Semiconductor chip with solder bump suppressing growth of inter-metallic compound and method of fabricating the same |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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US11/062,179 US20060212176A1 (en) | 2005-02-18 | 2005-02-18 | Use of electrical power multiplication for power smoothing in power distribution |
US11062179 | 2005-02-18 | ||
US11/069,682 US8629734B2 (en) | 2005-02-18 | 2005-03-01 | Systems and methods for power smoothing in power distribution |
US11069682 | 2005-03-01 | ||
PCT/US2006/004522 WO2006091383A2 (en) | 2005-02-18 | 2006-02-08 | Use of electrical power multiplication for power smoothing in power distribution |
US12/162,065 US20090020871A1 (en) | 2005-02-18 | 2006-02-08 | Semiconductor chip with solder bump suppressing growth of inter-metallic compound and method of fabricating the same |
Publications (1)
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US20090020871A1 true US20090020871A1 (en) | 2009-01-22 |
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US11/069,682 Active 2032-01-15 US8629734B2 (en) | 2005-02-18 | 2005-03-01 | Systems and methods for power smoothing in power distribution |
US12/162,065 Abandoned US20090020871A1 (en) | 2005-02-18 | 2006-02-08 | Semiconductor chip with solder bump suppressing growth of inter-metallic compound and method of fabricating the same |
US14/099,030 Expired - Fee Related US9515369B2 (en) | 2005-02-18 | 2013-12-06 | Use of electrical power multiplication for power smoothing in power distribution |
US15/359,967 Active 2025-09-18 US10367244B2 (en) | 2005-02-18 | 2016-11-23 | Use of electrical power multiplication for power smoothing in power distribution |
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US11/062,179 Abandoned US20060212176A1 (en) | 2005-02-18 | 2005-02-18 | Use of electrical power multiplication for power smoothing in power distribution |
US11/069,682 Active 2032-01-15 US8629734B2 (en) | 2005-02-18 | 2005-03-01 | Systems and methods for power smoothing in power distribution |
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US15/359,967 Active 2025-09-18 US10367244B2 (en) | 2005-02-18 | 2016-11-23 | Use of electrical power multiplication for power smoothing in power distribution |
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US20140091876A1 (en) | 2014-04-03 |
US10367244B2 (en) | 2019-07-30 |
US20060190513A1 (en) | 2006-08-24 |
US20060212176A1 (en) | 2006-09-21 |
ZA200707983B (en) | 2008-10-29 |
US9515369B2 (en) | 2016-12-06 |
US8629734B2 (en) | 2014-01-14 |
US20170077584A1 (en) | 2017-03-16 |
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