JP2021034713A - 積層セラミックキャパシタ - Google Patents
積層セラミックキャパシタ Download PDFInfo
- Publication number
- JP2021034713A JP2021034713A JP2020045620A JP2020045620A JP2021034713A JP 2021034713 A JP2021034713 A JP 2021034713A JP 2020045620 A JP2020045620 A JP 2020045620A JP 2020045620 A JP2020045620 A JP 2020045620A JP 2021034713 A JP2021034713 A JP 2021034713A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- connecting electrode
- main body
- multilayer ceramic
- ceramic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 55
- 238000007747 plating Methods 0.000 claims description 39
- 238000010304 firing Methods 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 41
- 229910052759 nickel Inorganic materials 0.000 description 16
- 238000000034 method Methods 0.000 description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 230000004048 modification Effects 0.000 description 11
- 238000012986 modification Methods 0.000 description 11
- 239000010936 titanium Substances 0.000 description 11
- 239000003990 capacitor Substances 0.000 description 9
- 239000010931 gold Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000011575 calcium Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000032798 delamination Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
- H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
110、210、510 本体
111、211、311、411、511 誘電体層
112、212、512、113、213、513 カバー部
121、122、221、222、321、322、421、422、521、522 内部電極
131、132、133、134、231、232、233、234、331、332、333、334、431、432、433、434、531、532、533、534 連結電極
141、142、143、144、241、242、243、244、541、542、543、544 外部電極
141a、142a、143a、144a、241a、242a、243a、 244a、541a、542a、543a、544a 焼成電極
141b、142b、143b、144b、241b、242b、243b、244b、541b、542b、543b、544b 第1めっき層
141c、142c、143c、144c、241c、242c、243c、244c、541c、542c、543c、544c 第2めっき層
Claims (14)
- 誘電体層、及び前記誘電体層を間に挟んで配置される第1内部電極及び第2内部電極を含み、
第3方向に対向する第1面及び第2面、第2方向に対向する第3面及び第4面、第1方向に対向する第5面及び第6面を含む本体と、
前記誘電体層と直交する方向に前記本体を貫通して前記第1内部電極と連結される第1連結電極及び第2連結電極と、
前記誘電体層と直交する方向に前記本体を貫通して前記第2内部電極と連結される第3連結電極及び第4連結電極と、
前記本体の両面に配置され、前記第1連結電極及び前記第2連結電極と連結される第1外部電極及び第2外部電極と、
前記第1外部電極及び前記第2外部電極と離隔し、前記第3連結電極及び前記第4連結電極と連結される第3外部電極及び第4外部電極と、を含み、
前記第1連結電極及び前記第2連結電極のうち少なくとも一部が前記本体の前記第1面または前記第2面に露出する、積層セラミックキャパシタ。 - 前記第1連結電極の一部及び前記第2連結電極の一部が前記本体の前記第1面または前記第2面に露出する、請求項1に記載の積層セラミックキャパシタ。
- 前記第1連結電極または前記第2連結電極の一部が前記本体の前記第1面及び前記第2面に露出する、請求項1に記載の積層セラミックキャパシタ。
- 前記第1連結電極の一部及び前記第2連結電極の一部が前記本体の前記第1面及び前記第2面に露出する、請求項1に記載の積層セラミックキャパシタ。
- 連結電極の直径(D)に対する、前記第1連結電極または前記第2連結電極のうち露出する長さ(d1)の割合(d1/D)は、0.1〜0.9の範囲内である、請求項1から4のいずれか一項に記載の積層セラミックキャパシタ。
- 前記第3連結電極の一部または前記第4連結電極の一部が前記本体の前記第1面または前記第2面に露出する、請求項1から5のいずれか一項に記載の積層セラミックキャパシタ。
- 前記第3連結電極の一部及び前記第4連結電極の一部が前記本体の前記第1面または前記第2面に露出する、請求項1から5のいずれか一項に記載の積層セラミックキャパシタ。
- 前記第3連結電極の一部または前記第4連結電極の一部が前記本体の前記第1面及び前記第2面に露出する、請求項1から5のいずれか一項に記載の積層セラミックキャパシタ。
- 前記第3連結電極の一部及び前記第4連結電極の一部が前記本体の前記第1面及び前記第2面に露出する、請求項1から5のいずれか一項に記載の積層セラミックキャパシタ。
- 前記連結電極の直径(D)に対する、前記第3連結電極または前記第4連結電極のうち露出する長さ(d3)の割合(d3/D)は、0.1〜0.9の範囲内である、請求項6から9のいずれか一項に記載の積層セラミックキャパシタ。
- 内部電極及び前記連結電極は同一の金属成分を含む、請求項1から10のいずれか一項に記載の積層セラミックキャパシタ。
- 前記連結電極及び外部電極は同一の金属成分を含む、請求項1から11のいずれか一項に記載の積層セラミックキャパシタ。
- 前記第1外部電極から前記第4外部電極は、焼成電極上に順に積層された第1めっき層及び第2めっき層を含む、請求項1から12のいずれか一項に記載の積層セラミックキャパシタ。
- 前記第1内部電極及び前記第2内部電極は互いに点対称をなすT字状であり、
前記第1連結電極及び前記第4連結電極は前記第2内部電極の未配置領域を貫通し、
前記第2連結電極及び前記第3連結電極は前記第1内部電極の未配置領域を貫通する、請求項1または請求項5、請求項10から13のいずれか一項に記載の積層セラミックキャパシタ。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020190101361A KR102333095B1 (ko) | 2019-08-19 | 2019-08-19 | 적층 세라믹 커패시터 |
KR10-2019-0101361 | 2019-08-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2021034713A true JP2021034713A (ja) | 2021-03-01 |
Family
ID=68171298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020045620A Pending JP2021034713A (ja) | 2019-08-19 | 2020-03-16 | 積層セラミックキャパシタ |
Country Status (4)
Country | Link |
---|---|
US (2) | US11380487B2 (ja) |
JP (1) | JP2021034713A (ja) |
KR (1) | KR102333095B1 (ja) |
CN (2) | CN213340097U (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102333086B1 (ko) | 2019-08-19 | 2021-12-01 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
KR20190116122A (ko) * | 2019-07-04 | 2019-10-14 | 삼성전기주식회사 | 적층 세라믹 커패시터 |
CN114464457A (zh) * | 2022-01-30 | 2022-05-10 | 华南师范大学 | 一种具有宽带性能的芯片电容器 |
KR20230138678A (ko) * | 2022-03-24 | 2023-10-05 | 삼성전기주식회사 | 적층형 커패시터 및 그 내장 기판 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012009813A (ja) * | 2010-05-27 | 2012-01-12 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
JP2014082434A (ja) * | 2012-10-12 | 2014-05-08 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ |
US20180027656A1 (en) * | 2016-07-20 | 2018-01-25 | Samsung Electro-Mechanics Co., Ltd. | Capacitor and board having the same |
JP2018129499A (ja) * | 2017-02-10 | 2018-08-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | キャパシタ部品 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7136272B2 (en) | 2003-03-28 | 2006-11-14 | Intel Corporation | Low parasitic inductance capacitor with central terminals |
JP5155211B2 (ja) | 2009-02-09 | 2013-03-06 | 日本特殊陶業株式会社 | 積層コンデンサ |
JP2011165776A (ja) | 2010-02-05 | 2011-08-25 | Murata Mfg Co Ltd | 3端子コンデンサ及びその実装方法 |
JP5120426B2 (ja) * | 2010-08-11 | 2013-01-16 | Tdk株式会社 | 積層型貫通コンデンサ及び積層型貫通コンデンサの実装構造 |
KR20130037485A (ko) * | 2011-10-06 | 2013-04-16 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 이의 제조방법 |
US9627142B2 (en) * | 2013-09-24 | 2017-04-18 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and board for mounting of the same |
KR102386974B1 (ko) * | 2016-07-20 | 2022-04-15 | 삼성전기주식회사 | 커패시터 및 그 실장 기판 |
KR102620535B1 (ko) | 2016-09-06 | 2024-01-03 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
KR102505446B1 (ko) | 2016-09-26 | 2023-03-06 | 삼성전기주식회사 | 적층형 커패시터 및 그 실장 기판 |
JP2018067568A (ja) * | 2016-10-17 | 2018-04-26 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法 |
KR20180047888A (ko) | 2016-11-01 | 2018-05-10 | 삼성전기주식회사 | 적층 전자부품 |
KR102393213B1 (ko) * | 2017-09-07 | 2022-05-02 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조방법 |
JP7131897B2 (ja) * | 2017-09-27 | 2022-09-06 | 太陽誘電株式会社 | セラミック電子部品およびその製造方法 |
CN112185704B (zh) * | 2019-07-04 | 2023-02-17 | 三星电机株式会社 | 多层陶瓷电容器 |
CN112185702B (zh) * | 2019-07-04 | 2023-11-17 | 三星电机株式会社 | 多层陶瓷电容器 |
CN112185693B (zh) | 2019-07-04 | 2022-11-04 | 三星电机株式会社 | 多层陶瓷电容器 |
-
2019
- 2019-08-19 KR KR1020190101361A patent/KR102333095B1/ko active IP Right Grant
-
2020
- 2020-03-09 US US16/812,900 patent/US11380487B2/en active Active
- 2020-03-16 JP JP2020045620A patent/JP2021034713A/ja active Pending
- 2020-07-17 CN CN202021420738.0U patent/CN213340097U/zh active Active
- 2020-07-17 CN CN202010689276.0A patent/CN112397307B/zh active Active
-
2022
- 2022-05-31 US US17/828,453 patent/US11955290B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012009813A (ja) * | 2010-05-27 | 2012-01-12 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
JP2014082434A (ja) * | 2012-10-12 | 2014-05-08 | Samsung Electro-Mechanics Co Ltd | 積層セラミックキャパシタ |
US20180027656A1 (en) * | 2016-07-20 | 2018-01-25 | Samsung Electro-Mechanics Co., Ltd. | Capacitor and board having the same |
JP2018129499A (ja) * | 2017-02-10 | 2018-08-16 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | キャパシタ部品 |
Also Published As
Publication number | Publication date |
---|---|
CN112397307B (zh) | 2022-11-25 |
CN213340097U (zh) | 2021-06-01 |
US11380487B2 (en) | 2022-07-05 |
US11955290B2 (en) | 2024-04-09 |
CN112397307A (zh) | 2021-02-23 |
US20210057159A1 (en) | 2021-02-25 |
KR102333095B1 (ko) | 2021-12-01 |
KR20190116151A (ko) | 2019-10-14 |
US20230011784A1 (en) | 2023-01-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN112185700B (zh) | 多层陶瓷电容器 | |
JP2021034713A (ja) | 積層セラミックキャパシタ | |
US11763995B2 (en) | Multilayer ceramic capacitor | |
CN112185701B (zh) | 多层陶瓷电容器 | |
JP7476652B2 (ja) | 積層セラミックキャパシタ | |
CN112185702B (zh) | 多层陶瓷电容器 | |
CN112185704B (zh) | 多层陶瓷电容器 | |
CN112185699B (zh) | 多层陶瓷电容器 | |
US20220165504A1 (en) | Multilayer ceramic capacitor | |
CN112185693B (zh) | 多层陶瓷电容器 | |
KR102538905B1 (ko) | 적층 세라믹 커패시터 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20221208 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20230620 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20230627 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230912 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20231010 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20231218 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20240213 |