JP2021030408A5 - - Google Patents

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Publication number
JP2021030408A5
JP2021030408A5 JP2019156921A JP2019156921A JP2021030408A5 JP 2021030408 A5 JP2021030408 A5 JP 2021030408A5 JP 2019156921 A JP2019156921 A JP 2019156921A JP 2019156921 A JP2019156921 A JP 2019156921A JP 2021030408 A5 JP2021030408 A5 JP 2021030408A5
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JP
Japan
Prior art keywords
pure water
polishing
height
polished surface
substrate
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JP2019156921A
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English (en)
Japanese (ja)
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JP2021030408A (ja
JP7403998B2 (ja
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Priority claimed from JP2019156921A external-priority patent/JP7403998B2/ja
Priority to JP2019156921A priority Critical patent/JP7403998B2/ja
Priority to KR1020227009633A priority patent/KR102846970B1/ko
Priority to US17/638,109 priority patent/US20220288742A1/en
Priority to PCT/JP2020/030688 priority patent/WO2021039401A1/ja
Priority to CN202080060537.0A priority patent/CN114302789B/zh
Priority to TW109129026A priority patent/TWI848173B/zh
Publication of JP2021030408A publication Critical patent/JP2021030408A/ja
Publication of JP2021030408A5 publication Critical patent/JP2021030408A5/ja
Publication of JP7403998B2 publication Critical patent/JP7403998B2/ja
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JP2019156921A 2019-08-29 2019-08-29 研磨装置および研磨方法 Active JP7403998B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2019156921A JP7403998B2 (ja) 2019-08-29 2019-08-29 研磨装置および研磨方法
CN202080060537.0A CN114302789B (zh) 2019-08-29 2020-08-12 研磨装置及研磨方法
US17/638,109 US20220288742A1 (en) 2019-08-29 2020-08-12 Polishing apparatus and polishing method
PCT/JP2020/030688 WO2021039401A1 (ja) 2019-08-29 2020-08-12 研磨装置および研磨方法
KR1020227009633A KR102846970B1 (ko) 2019-08-29 2020-08-12 연마 장치 및 연마 방법
TW109129026A TWI848173B (zh) 2019-08-29 2020-08-26 研磨裝置及研磨方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019156921A JP7403998B2 (ja) 2019-08-29 2019-08-29 研磨装置および研磨方法

Publications (3)

Publication Number Publication Date
JP2021030408A JP2021030408A (ja) 2021-03-01
JP2021030408A5 true JP2021030408A5 (enExample) 2022-05-09
JP7403998B2 JP7403998B2 (ja) 2023-12-25

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ID=74674667

Family Applications (1)

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JP2019156921A Active JP7403998B2 (ja) 2019-08-29 2019-08-29 研磨装置および研磨方法

Country Status (6)

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US (1) US20220288742A1 (enExample)
JP (1) JP7403998B2 (enExample)
KR (1) KR102846970B1 (enExample)
CN (1) CN114302789B (enExample)
TW (1) TWI848173B (enExample)
WO (1) WO2021039401A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7008307B2 (ja) * 2019-11-20 2022-02-10 株式会社ロジストラボ 光学素子の製造方法及び光学素子製造システム
JP7709281B2 (ja) * 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法

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