CN114302789B - 研磨装置及研磨方法 - Google Patents

研磨装置及研磨方法 Download PDF

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Publication number
CN114302789B
CN114302789B CN202080060537.0A CN202080060537A CN114302789B CN 114302789 B CN114302789 B CN 114302789B CN 202080060537 A CN202080060537 A CN 202080060537A CN 114302789 B CN114302789 B CN 114302789B
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CN
China
Prior art keywords
pure water
polishing
hole
height
substrate
Prior art date
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Active
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CN202080060537.0A
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English (en)
Chinese (zh)
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CN114302789A (zh
Inventor
高桥信行
木下将毅
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Ebara Corp
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Ebara Corp
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Publication of CN114302789A publication Critical patent/CN114302789A/zh
Application granted granted Critical
Publication of CN114302789B publication Critical patent/CN114302789B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN202080060537.0A 2019-08-29 2020-08-12 研磨装置及研磨方法 Active CN114302789B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-156921 2019-08-29
JP2019156921A JP7403998B2 (ja) 2019-08-29 2019-08-29 研磨装置および研磨方法
PCT/JP2020/030688 WO2021039401A1 (ja) 2019-08-29 2020-08-12 研磨装置および研磨方法

Publications (2)

Publication Number Publication Date
CN114302789A CN114302789A (zh) 2022-04-08
CN114302789B true CN114302789B (zh) 2024-06-25

Family

ID=74674667

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080060537.0A Active CN114302789B (zh) 2019-08-29 2020-08-12 研磨装置及研磨方法

Country Status (6)

Country Link
US (1) US20220288742A1 (enExample)
JP (1) JP7403998B2 (enExample)
KR (1) KR102846970B1 (enExample)
CN (1) CN114302789B (enExample)
TW (1) TWI848173B (enExample)
WO (1) WO2021039401A1 (enExample)

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* Cited by examiner, † Cited by third party
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JP7008307B2 (ja) * 2019-11-20 2022-02-10 株式会社ロジストラボ 光学素子の製造方法及び光学素子製造システム
JP7709281B2 (ja) * 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法

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CN109382755A (zh) * 2017-08-08 2019-02-26 株式会社荏原制作所 基板研磨装置及方法

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US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6628397B1 (en) * 1999-09-15 2003-09-30 Kla-Tencor Apparatus and methods for performing self-clearing optical measurements
JP2001088021A (ja) * 1999-09-22 2001-04-03 Speedfam Co Ltd 研磨終点検出機構付き研磨装置
JP3854056B2 (ja) * 1999-12-13 2006-12-06 株式会社荏原製作所 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置
US6599765B1 (en) * 2001-12-12 2003-07-29 Lam Research Corporation Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection
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US8694144B2 (en) * 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
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CN109382755A (zh) * 2017-08-08 2019-02-26 株式会社荏原制作所 基板研磨装置及方法

Also Published As

Publication number Publication date
JP2021030408A (ja) 2021-03-01
KR102846970B1 (ko) 2025-08-18
TW202113957A (zh) 2021-04-01
JP7403998B2 (ja) 2023-12-25
US20220288742A1 (en) 2022-09-15
TWI848173B (zh) 2024-07-11
CN114302789A (zh) 2022-04-08
KR20220049596A (ko) 2022-04-21
WO2021039401A1 (ja) 2021-03-04

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