JP2020537330A5 - - Google Patents

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Publication number
JP2020537330A5
JP2020537330A5 JP2020514197A JP2020514197A JP2020537330A5 JP 2020537330 A5 JP2020537330 A5 JP 2020537330A5 JP 2020514197 A JP2020514197 A JP 2020514197A JP 2020514197 A JP2020514197 A JP 2020514197A JP 2020537330 A5 JP2020537330 A5 JP 2020537330A5
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JP
Japan
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patent document
publication
international
document
japanese unexamined
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JP2020514197A
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English (en)
Japanese (ja)
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JP2020537330A (ja
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Priority claimed from PCT/US2018/055552 external-priority patent/WO2019075289A1/en
Publication of JP2020537330A publication Critical patent/JP2020537330A/ja
Publication of JP2020537330A5 publication Critical patent/JP2020537330A5/ja
Pending legal-status Critical Current

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JP2020514197A 2017-10-13 2018-10-12 導電性端子、バスバー、その製造方法、及び関連するパワーモジュールの組立方法 Pending JP2020537330A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762572055P 2017-10-13 2017-10-13
US62/572,055 2017-10-13
PCT/US2018/055552 WO2019075289A1 (en) 2017-10-13 2018-10-12 CONDUCTIVE TERMINALS, OMNIBUS BARS, AND METHODS OF PREPARING THE SAME, AND METHODS OF ASSEMBLING POWER MODULES THEREOF

Publications (2)

Publication Number Publication Date
JP2020537330A JP2020537330A (ja) 2020-12-17
JP2020537330A5 true JP2020537330A5 (https=) 2021-10-28

Family

ID=66097146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020514197A Pending JP2020537330A (ja) 2017-10-13 2018-10-12 導電性端子、バスバー、その製造方法、及び関連するパワーモジュールの組立方法

Country Status (4)

Country Link
US (1) US20190115704A1 (https=)
JP (1) JP2020537330A (https=)
CN (1) CN111201683A (https=)
WO (1) WO2019075289A1 (https=)

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JP7181217B2 (ja) * 2017-04-04 2022-11-30 クリック アンド ソッファ インダストリーズ、インク． 超音波溶接システムおよびその使用方法
US10957892B2 (en) 2018-08-23 2021-03-23 Rivian Ip Holdings, Llc Busbars having stamped fusible links
US10944090B2 (en) 2018-08-23 2021-03-09 Rivian Ip Holdings, Llc Layered busbars having integrated fusible links
WO2020112635A1 (en) 2018-11-28 2020-06-04 Kulicke And Soffa Industries, Inc. Ultrasonic welding systems and methods of using the same
USD924810S1 (en) 2019-01-04 2021-07-13 Intel Corporation Busbar
USD960111S1 (en) * 2020-02-25 2022-08-09 Transportation Ip Holdings, Llc Rectifier busbar
KR20230019842A (ko) * 2020-06-03 2023-02-09 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 초음파 용접 시스템, 이를 사용하는 방법, 및 용접된 전도성 핀을 포함하는 관련 작업물
DE102020124171A1 (de) * 2020-09-16 2022-03-17 Danfoss Silicon Power Gmbh Elektronisches Modul und Verfahren zum Verbinden von mehreren Leitern mit einem Substrat
DE102022207269A1 (de) * 2022-07-18 2024-01-18 Zf Friedrichshafen Ag Verfahren und Vorrichtung zum Herstellen einer Anschlussvorrichtung zum Anschließen zumindest eines elektrischen oder elektronischen Bauteils für ein elektrisches oder elektronisches Modul
DE102023209022A1 (de) 2023-09-18 2025-03-20 Robert Bosch Gesellschaft mit beschränkter Haftung Verbindungsanordnung, insbesondere zur Verwendung in Elektrofahrzeugen oder Hybridfahrzeugen und Verfahren zur Herstellung einer Verbindungsanordnung

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GB1288982A (https=) * 1968-11-06 1972-09-13
US7056414B2 (en) * 1999-10-07 2006-06-06 Aisin Seiki Kabushiki Kaisha Connecting method for metal material and electric conductive plastic material and product thereby
JP4659262B2 (ja) * 2001-05-01 2011-03-30 富士通セミコンダクター株式会社 電子部品の実装方法及びペースト材料
JP4524570B2 (ja) * 2004-03-10 2010-08-18 富士電機システムズ株式会社 半導体装置
AT502005B1 (de) * 2005-06-01 2007-03-15 Outokumpu Copper Neumayer Gmbh Elektrisches verbindungselement, verfahren zu seiner herstellung und solarzelle- und modul mit verbindungselement
JP4577509B2 (ja) * 2005-06-22 2010-11-10 トヨタ自動車株式会社 パワー半導体モジュール及びその製造方法
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CN104659011A (zh) * 2013-11-20 2015-05-27 西安永电电气有限责任公司 一种igbt模块的芯片焊接结构
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